831302B00000
831302B00000 Datasheet
| Part | Datasheet |
|---|---|
831302B00000 |
831302B00000 (pdf) |
| PDF Datasheet Preview |
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| Board Level Heat Sinks P/N: TO-220, TO-262 Temp Rise Above Ambient - °C Mounting Surface Thermal Resistance - °C/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 & TO-262 • Size x mm • Material Aluminum, mm Thick • Type Stamped • IC Mounting Integrated Spring • PCB Mounting Solderable Tab • Finish Black Anodized • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • Vertical Mounting via Solderable Tab • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 80 60 40 20 Air Velocity - LFM 200 400 600 800 Heat Dissapated - Watts 1000 10 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: AT45DB081B-CI | AT45DB081B-RI | AT45DB081B-TC | AT45DB081B-TI | AT45DB081B-CC | AT45DB081B-CNC | AT45DB081B-CNI | AT45DB081B-TC-2.5 | AT45DB081B-RC-2.5 | 27-21/BHC-AP1Q2/3C |
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