Part | Datasheet |
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821702B00000 | 821702B00000 (pdf) |
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Board Level Heat Sinks P/N: TO--220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x 21.6mm • Material Aluminum, 1.0mm Thick • Type Stamped • Finish Black Anodized • PCB Mounting Solderable Device Leads • Package Bulk • Accessories Hardware & Thermal Interface Materal • Multiple Holes for Device Attachment • Dual Device Cooling Heat Sink • RoHS Compliant Customized Heat Sinks • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM 1000 10 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
More datasheets: 67-21/R6C-AP2R1B/2A0 | CY7C4271-10JC | CY7C4261-15JXC | CY7C4261-15JXCT | CY7C4261-15JC | CY7C4271-15AC | ATA6871-TLQW | ATA6871-TLPW | 19020177A | 2465 |
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