CDBWM8993-M-1
CDBWM8993-M-1 Datasheet
| Part | Datasheet |
|---|---|
CDBWM8993-M-1 |
CDBWM8993-M-1 (pdf) |
| Related Parts | Information |
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CDKWM8993-S-1 |
CDKWM8993-S-1 |
| PDF Datasheet Preview |
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| WM8993 Audio Hub Codec for Multimedia Phones The WM8993 is a highly integrated ultra-low power hi-fi CODEC designed for portable devices such as multimedia phones. A stereo 1W/channel speaker driver can operate in class D or AB mode. Low leakage and high PSRR across the audio band enable direct battery connection for the speaker supply. Class W headphone drivers provide a dramatic reduction in playback power and are ground-referenced. Active ground loop noise rejection and DC offset correction help prevent pop noise and ground noise from degrading headphone output quality. Powerful mixing capability allows the device to support a huge range of architectures and use cases. A highly flexible input configuration supports multiple microphone or line inputs mono or stereo, single-ended or differential . Fully differential internal architecture and on-chip RF noise filters ensure a very high degree of noise immunity. ReTuneTM Mobile parametric EQ with fully programmable coefficients is integrated for optimization of speaker characteristics. Programmable dynamic range control is also available for maximizing loudness, protecting speakers from clipping and preventing premature shutdown due to battery droop. The WM8993 is supplied in very small and thin 48-ball W-CSP package, ideal for portable systems. • 100dB SNR during DAC playback ‘A’ weighted • Low power, low noise MIC interface • Class D or AB stereo speaker driver - Stereo1W into BTL speaker at <1% THD - Mono 2W into BTL speaker • ReTune Mobile parametric equalizer • Dynamic range controller • Low power Class W headphone drivers - Integrated charge pump and DC offset correction - 5mW total power for DAC playback to headphones • Digital audio interface - All standard data formats and 2-channel TDM supported - All standard sample rates from 8kHz to 48kHz • Low power FLL - Provides all necessary internal clocks - 32kHz to 27MHz input frequency - Free-running mode for class D and charge pump • 4 highly flexible line outputs single-ended or differential • Dedicated earpiece driver • “Direct voice” and “Direct DAC” paths to outputs - Low noise paths bypass all internal mixers - Low power consumption • Active noise reduction - DC offset correction removes pops and clicks - Ground loop noise cancellation • 48-ball W-CSP package 3.65x3.55x0.546mm, 0.5mm pitch • Multimedia phones IN1LN IN1LP IN2LN IN2LP/VRXN IN1RN IN1RP IN2RN IN2RP/VRXP AVDD1 VMIDC AGND1 AVDD2 DCVDD DBVDD DGND SPKVDD SPKGND CPVDD CPGND CPVOUTP CPVOUTN CHARGE PUMP CPFB1 CPFB2 HEADPHONE DRIVERS HPOUT1L HPOUT1R HPOUT1FB MICBIAS1 MICBIAS2 MIC INTERFACE Current Detect GPIO Current Detect GPIO INPUT MIXERS ADC L ADC R RECORD ADC FILTERS HIGH PASS FILTERS ADC VOLUME ReTuneTM Mobile PARAMETRIC EQUALISER DYNAMIC RANGE CONTROL FLL GPIO AUDIO CLOCKS DIGITAL AUDIO INTERFACE DAC FILTERS DAC VOLUME DAC L DAC R ORDERING ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING THERMAL ELECTRICAL CHARACTERISTICS TERMINOLOGY 23 TYPICAL PERFORMANCE POWER CONSUMPTION 24 AUDIO SIGNAL PATHS DIAGRAM SIGNAL TIMING REQUIREMENTS MASTER CLOCK 26 AUDIO INTERFACE TIMING 27 MASTER MODE SLAVE TDM MODE CONTROL INTERFACE TIMING 30 DEVICE DESCRIPTION INTRODUCTION 31 INPUT SIGNAL PATH 33 MICROPHONE INPUTS MICROPHONE BIAS CONTROL MICROPHONE CURRENT DETECT LINE AND VOICE CODEC INPUTS INPUT PGA ENABLE INPUT PGA CONFIGURATION INPUT PGA VOLUME INPUT MIXER INPUT MIXER CONFIGURATION AND VOLUME CONTROL ANALOGUE TO DIGITAL CONVERTER ADC 43 ADC DIGITAL VOLUME HIGH PASS FILTER DIGITAL 46 DIGITAL MIXING PATHS DAC INTERFACE VOLUME BOOST DIGITAL DYNAMIC RANGE CONTROL DRC 49 COMPRESSION/LIMITING CAPABILITIES GAIN DYNAMIC CHARACTERISTICS ANTI-CLIP CONTROL QUICK RELEASE CONTROL GAIN SMOOTHING INITIALISATION ORDERING INFORMATION ORDER CODE TEMPERATURE RANGE PACKAGE WM8993ECS/RV Note Reel quantity = 3500 -40C to +85C 48-ball W-CSP Pb-free, Tape and reel MOISTURE SENSITIVITY LEVEL MSL1 PEAK SOLDERING TEMPERATURE 260C PIN DESCRIPTION PIN NO A5 B5 C5 NAME MICBIAS1 MICBIAS2 IN1LN TYPE Analogue Output Analogue Output Analogue Input IN1LP Analogue Input IN2LN/GI7 Analogue Input / Digital Input DESCRIPTION Microphone bias Microphone bias Left channel single-ended MIC input / Left channel negative differential MIC input Left channel line input / Left channel positive differential MIC input Left channel line input / Left channel negative differential MIC input / WM8993 PIN NO NAME IN2LP/VRXN IN1RN IN1RP IN2RN/GI8 IN2RP/VRXP DCVDD DGND DBVDD AVDD1 AVDD2 AGND CPVDD CPGND SPKVDD SPKGND CPVOUTP CPVOUTN The Moisture Sensitivity Level for each package type is specified in Ordering Information. CONDITION Supply voltages AVDD1, DBVDD Supply voltages AVDD2, DCVDD Supply voltages CPVDD Supply voltages SPKVDD Voltage range digital inputs Voltage range analogue inputs Operating temperature range, TA Junction temperature, TJMAX Storage temperature after soldering MIN -0.3V -0.3V -0.3V -0.3V DGND -0.3V AGND -0.3V -40ºC -40ºC -65ºC MAX +4.5V +2.5V +2.2V +7.0V DBVDD +0.3V AVDD1 +0.3V +85ºC +150ºC +150ºC RECOMMENDED OPERATING CONDITIONS PARAMETER Digital supply range Core DCVDD Digital supply range I/O DBVDD Analogue supply 1 range AVDD1 Analogue supply 2 range AVDD2 Charge Pump supply range CPVDD Speaker supply range SPKVDD Ground DGND, AGND, CPGND, SPKGND Notes Analogue, digital and speaker grounds must always be within 0.3V of each other. There is no power sequencing requirement the supplies may be enabled in any order. DCVDD must be less than or equal to AVDD1 and AVDD2. DCVDD must be less than or equal to DBVDD. AVDD1 must be less than or equal to SPKVDD. UNIT V WM8993 THERMAL PERFORMANCE Thermal analysis should be performed in the intended application to prevent the WM8993 from exceeding maximum junction temperature. Several contributing factors affect thermal performance most notably the physical properties of the mechanical enclosure, location of the device on the PCB in relation to surrounding components and the number of PCB layers. Connecting the GND balls through thermal vias and into a large ground plane will aid heat extraction. Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1: - Package top to air radiation . - Package bottom to PCB radiation . - Package balls to PCB conduction . W-CSP Package Figure 1 Heat Transfer Paths The temperature rise TR is given by TR = PD * - PD is the power dissipated in the device. - is the thermal resistance from the junction of the die to the ambient temperature and is therefore a measure of heat transfer from the die to surrounding air. is determined with reference to JEDEC standard JESD51-9. The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature. |
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