WM8788GEDT

WM8788GEDT Datasheet


WM8788

Part Datasheet
WM8788GEDT WM8788GEDT WM8788GEDT (pdf)
Related Parts Information
WM8788GEDT/R WM8788GEDT/R WM8788GEDT/R
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WM8788

High Performance 24-bit Stereo ADC

The WM8788 is a high performance 24-bit stereo ADC designed
• Hi-fi audio ADC
for LCD televisions, DVD, Blu-Ray and set-top box applications.
- 106dB SNR ‘A’ weighted
- -91dB THD -1dBFS output

A stereo pair of analogue inputs is provided external resistors
- Sample rates 8kHz to 192kHz
are used to configure the device for line level inputs at 1Vrms or
• 2 analogue audio inputs
for higher input signal levels. The hi-fi ADCs output 16, 20 or 24-
- Support for line level inputs >1Vrms
bit stereo data on the digital audio interface.
• Digital audio interface

ADC sample rates from 8kHz to 192kHz are supported Master Clock MCLK ratios of 128fs up to 768fs are possible fs = sample rate .
- Master or Slave operation - 16, 20 or 24-bit data format - Right-justified, Left-justified, I2S modes Wide range of master clock MCLK rates

The digital audio interface operates in Master or Slave modes,
- 128fs, 192fs, 256fs, 384fs, 512fs, 768fs support
and supports Right-justified, Left-justified and I2S modes,
• Hardware configuration control
selectable using hardware control pins.
• Integrated voltage reference circuits

The WM8788 is powered from a single 3.3V supply rail, connected to the AVDD and REFVDD pins.



Single 3.3V supply 16-pin TSSOP package

A power on reset POR circuit ensures correct start-up and shut-down. The device is held in reset when MCLK is not present, offering a low-power standby state.

The WM8788 is supplied in a 16-pin TSSOP package.
• LCD televisions
• Set-top boxes STB
• Blu-Ray / DVD players and recorders

BLOCK DIAGRAM

INLFB INL

INRFB INR

Reference Generator

ADC L ADC R

Digital Filters

VMIDC REFVDD

AVDD

AGND

WM8788

Control Interface

BCLK LRCLK ADCDAT MCLK

MASTER OSR AIFMODE0 AIFMODE1

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WM8788
ORDERING 3

PIN 3

ABSOLUTE MAXIMUM RATINGS 4

RECOMMENDED OPERATING 4

THERMAL 5

ELECTRICAL CHARACTERISTICS 6 TERMINOLOGY 7

SIGNAL TIMING REQUIREMENTS 8 SYSTEM CLOCK 8 AUDIO INTERFACE TIMING 9

MASTER MODE 9 SLAVE MODE 9

DEVICE DESCRIPTION 10 INTRODUCTION 10 CALIBRATED START-UP 10

SLAVE MODE 10 MASTER MODE 10

INPUT SIGNAL PATH 11 ANALOGUE-TO-DIGITAL CONVERTER 12 DIGITAL AUDIO 12

DIGITAL AUDIO INTERFACE 13 MASTER AND SLAVE MODE OPERATION 14 AUDIO DATA FORMATS 14

DIGITAL FILTER CHARACTERISTICS 16 ADC FILTER 16

APPLICATIONS INFORMATION 18 RECOMMENDED EXTERNAL COMPONENTS 18

AUDIO INPUT POWER SUPPLY DECOUPLING 18 RECOMMENDED EXTERNAL COMPONENTS

PCB LAYOUT CONSIDERATIONS 20

PACKAGE 21

IMPORTANT NOTICE 22 ADDRESS 22

Preliminary Technical Data

WM8788

PIN CONFIGURATION

The WM8788 is supplied in a 16-pin TSSOP format. The pin configuration is illustrated below, showing the top-down view from above the chip.

VMIDC 1
16 AGND

INL 2
15 ADCDAT

INLFB 3
14 BCLK

INR INRFB

WM8788

Top View

LRCLK MCLK

REFVDD 6
11 OSR

AVDD 7
10 MASTER

AIFMODE1 8

AIFMODE0
ORDERING INFORMATION

ORDER CODE WM8788GEDT

TEMPERATURE RANGE
-40C to +85C

WM8788GEDT/R
-40C to +85C

Note Reel quantity = 2,000

PACKAGE

MOISTURE

SENSITIVITY LEVEL
16-pin TSSOP Pb-free

MSL1
16-pin TSSOP Pb-free, tape and reel

MSL1

PEAK SOLDERING TEMPERATURE 260oC
260oC

PIN DESCRIPTION

PIN NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

NAME VMIDC

INL INLFB

INR INRFB REFVDD AVDD AIFMODE1 AIFMODE0 MASTER OSR MCLK LRCLK BCLK ADCDAT AGND

TYPE Analogue Output Analogue Input Analogue Output Analogue Input Analogue Output Supply Digital Tri-state Input Digital Tri-state Input Digital Tri-state Input Digital Tri-state Input Digital Input Digital Input / Output Digital Input / Output Digital Output Supply

DESCRIPTION Midrail voltage decoupling capacitor Left channel analogue input Left channel feedback connection Right channel analogue input Right channel feedback connection ADC Reference Positive supply Analogue Positive supply Audio interface configuration pin 1 Audio interface configuration pin 0 Audio interface Master / Slave select ADC oversample rate select Master clock Audio interface left / right clock Audio interface bit clock ADC digital audio data Ground

PTD, December 2011, Rev

WM8788

Preliminary Technical Data

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified.

ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device.

Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are:

MSL1 = unlimited floor life at <30C / 85% Relative Humidity. Not normally stored in moisture barrier bag. MSL2 = out of bag storage for 1 year at <30C / 60% Relative Humidity. Supplied in moisture barrier bag. MSL3 = out of bag storage for 168 hours at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.

CONDITION Supply voltage AVDD, REFVDD Voltage range digital inputs Voltage range analogue inputs Operating temperature range, TA Junction temperature, TJMAX Storage temperature after soldering

MIN -0.3V -0.7V -0.7V -40ºC -40ºC -65ºC

MAX 4.5V AVDD +0.7V AVDD +0.7V +85ºC +150ºC +150ºC

RECOMMENDED OPERATING CONDITIONS

PARAMETER

Analogue and digital I/O supplies range

Ground

SYMBOL AVDD, REFVDD

Note:

The AVDD and REFVDD pins must both be connected to the same external supply voltage.

UNIT V

Preliminary Technical Data

WM8788

THERMAL PERFORMANCE

Thermal analysis should be performed in the intended application to prevent the WM8788 from exceeding maximum junction temperature. Several contributing factors affect thermal performance most notably the physical properties of the mechanical enclosure, location of the device on the PCB in relation to surrounding components and the number of PCB layers. Connecting the GND pin through thermal vias and into a large ground plane will aid heat extraction.

Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1:
- Package top to air radiation .
- Package bottom to PCB radiation .
- Package pins to PCB conduction .

Figure 1 Heat Transfer Paths

The temperature rise TR is given by TR = PD *
- PD is the power dissipated in the device.
- is the thermal resistance from the junction of the die to the ambient temperature and is therefore a measure of heat transfer from the die to surrounding air. is determined with reference to JEDEC standard JESD51-9.

The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature.

PARAMETER

Operating temperature range Operating junction temperature Thermal Resistance

Note:

Junction temperature is a function of ambient temperature and of the device operating conditions. The ambient temperature limits and junction temperature limits must both be observed.

UNIT °C °C °C/W

WM8788

Preliminary Technical Data

ELECTRICAL CHARACTERISTICS

Test Conditions

AVDD = REFVDD = 3.3V, AGND = 0V, TA = +25oC, 1kHz signal, fs = 48kHz, MCLK = 256fs unless otherwise stated. Implemented recommended calibration start-up sequence as detailed in Calibrated Start-Up section.

PARAMETER

TEST CONDITIONS

Analogue Inputs INL, INR

Maximum input signal level

RIN = RFB =

Input capacitance
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Datasheet ID: WM8788GEDT 523279