WM8788
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WM8788GEDT (pdf) |
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WM8788GEDT/R |
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WM8788 High Performance 24-bit Stereo ADC The WM8788 is a high performance 24-bit stereo ADC designed • Hi-fi audio ADC for LCD televisions, DVD, Blu-Ray and set-top box applications. - 106dB SNR ‘A’ weighted - -91dB THD -1dBFS output A stereo pair of analogue inputs is provided external resistors - Sample rates 8kHz to 192kHz are used to configure the device for line level inputs at 1Vrms or • 2 analogue audio inputs for higher input signal levels. The hi-fi ADCs output 16, 20 or 24- - Support for line level inputs >1Vrms bit stereo data on the digital audio interface. • Digital audio interface ADC sample rates from 8kHz to 192kHz are supported Master Clock MCLK ratios of 128fs up to 768fs are possible fs = sample rate . - Master or Slave operation - 16, 20 or 24-bit data format - Right-justified, Left-justified, I2S modes Wide range of master clock MCLK rates The digital audio interface operates in Master or Slave modes, - 128fs, 192fs, 256fs, 384fs, 512fs, 768fs support and supports Right-justified, Left-justified and I2S modes, • Hardware configuration control selectable using hardware control pins. • Integrated voltage reference circuits The WM8788 is powered from a single 3.3V supply rail, connected to the AVDD and REFVDD pins. • • Single 3.3V supply 16-pin TSSOP package A power on reset POR circuit ensures correct start-up and shut-down. The device is held in reset when MCLK is not present, offering a low-power standby state. The WM8788 is supplied in a 16-pin TSSOP package. • LCD televisions • Set-top boxes STB • Blu-Ray / DVD players and recorders BLOCK DIAGRAM INLFB INL INRFB INR Reference Generator ADC L ADC R Digital Filters VMIDC REFVDD AVDD AGND WM8788 Control Interface BCLK LRCLK ADCDAT MCLK MASTER OSR AIFMODE0 AIFMODE1 WOLFSON MICROELECTRONICS plc To receive regular email updates, sign up at WM8788 ORDERING 3 PIN 3 ABSOLUTE MAXIMUM RATINGS 4 RECOMMENDED OPERATING 4 THERMAL 5 ELECTRICAL CHARACTERISTICS 6 TERMINOLOGY 7 SIGNAL TIMING REQUIREMENTS 8 SYSTEM CLOCK 8 AUDIO INTERFACE TIMING 9 MASTER MODE 9 SLAVE MODE 9 DEVICE DESCRIPTION 10 INTRODUCTION 10 CALIBRATED START-UP 10 SLAVE MODE 10 MASTER MODE 10 INPUT SIGNAL PATH 11 ANALOGUE-TO-DIGITAL CONVERTER 12 DIGITAL AUDIO 12 DIGITAL AUDIO INTERFACE 13 MASTER AND SLAVE MODE OPERATION 14 AUDIO DATA FORMATS 14 DIGITAL FILTER CHARACTERISTICS 16 ADC FILTER 16 APPLICATIONS INFORMATION 18 RECOMMENDED EXTERNAL COMPONENTS 18 AUDIO INPUT POWER SUPPLY DECOUPLING 18 RECOMMENDED EXTERNAL COMPONENTS PCB LAYOUT CONSIDERATIONS 20 PACKAGE 21 IMPORTANT NOTICE 22 ADDRESS 22 Preliminary Technical Data WM8788 PIN CONFIGURATION The WM8788 is supplied in a 16-pin TSSOP format. The pin configuration is illustrated below, showing the top-down view from above the chip. VMIDC 1 16 AGND INL 2 15 ADCDAT INLFB 3 14 BCLK INR INRFB WM8788 Top View LRCLK MCLK REFVDD 6 11 OSR AVDD 7 10 MASTER AIFMODE1 8 AIFMODE0 ORDERING INFORMATION ORDER CODE WM8788GEDT TEMPERATURE RANGE -40C to +85C WM8788GEDT/R -40C to +85C Note Reel quantity = 2,000 PACKAGE MOISTURE SENSITIVITY LEVEL 16-pin TSSOP Pb-free MSL1 16-pin TSSOP Pb-free, tape and reel MSL1 PEAK SOLDERING TEMPERATURE 260oC 260oC PIN DESCRIPTION PIN NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NAME VMIDC INL INLFB INR INRFB REFVDD AVDD AIFMODE1 AIFMODE0 MASTER OSR MCLK LRCLK BCLK ADCDAT AGND TYPE Analogue Output Analogue Input Analogue Output Analogue Input Analogue Output Supply Digital Tri-state Input Digital Tri-state Input Digital Tri-state Input Digital Tri-state Input Digital Input Digital Input / Output Digital Input / Output Digital Output Supply DESCRIPTION Midrail voltage decoupling capacitor Left channel analogue input Left channel feedback connection Right channel analogue input Right channel feedback connection ADC Reference Positive supply Analogue Positive supply Audio interface configuration pin 1 Audio interface configuration pin 0 Audio interface Master / Slave select ADC oversample rate select Master clock Audio interface left / right clock Audio interface bit clock ADC digital audio data Ground PTD, December 2011, Rev WM8788 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at <30C / 85% Relative Humidity. Not normally stored in moisture barrier bag. MSL2 = out of bag storage for 1 year at <30C / 60% Relative Humidity. Supplied in moisture barrier bag. MSL3 = out of bag storage for 168 hours at <30C / 60% Relative Humidity. Supplied in moisture barrier bag. The Moisture Sensitivity Level for each package type is specified in Ordering Information. CONDITION Supply voltage AVDD, REFVDD Voltage range digital inputs Voltage range analogue inputs Operating temperature range, TA Junction temperature, TJMAX Storage temperature after soldering MIN -0.3V -0.7V -0.7V -40ºC -40ºC -65ºC MAX 4.5V AVDD +0.7V AVDD +0.7V +85ºC +150ºC +150ºC RECOMMENDED OPERATING CONDITIONS PARAMETER Analogue and digital I/O supplies range Ground SYMBOL AVDD, REFVDD Note: The AVDD and REFVDD pins must both be connected to the same external supply voltage. UNIT V Preliminary Technical Data WM8788 THERMAL PERFORMANCE Thermal analysis should be performed in the intended application to prevent the WM8788 from exceeding maximum junction temperature. Several contributing factors affect thermal performance most notably the physical properties of the mechanical enclosure, location of the device on the PCB in relation to surrounding components and the number of PCB layers. Connecting the GND pin through thermal vias and into a large ground plane will aid heat extraction. Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1: - Package top to air radiation . - Package bottom to PCB radiation . - Package pins to PCB conduction . Figure 1 Heat Transfer Paths The temperature rise TR is given by TR = PD * - PD is the power dissipated in the device. - is the thermal resistance from the junction of the die to the ambient temperature and is therefore a measure of heat transfer from the die to surrounding air. is determined with reference to JEDEC standard JESD51-9. The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature. PARAMETER Operating temperature range Operating junction temperature Thermal Resistance Note: Junction temperature is a function of ambient temperature and of the device operating conditions. The ambient temperature limits and junction temperature limits must both be observed. UNIT °C °C °C/W WM8788 Preliminary Technical Data ELECTRICAL CHARACTERISTICS Test Conditions AVDD = REFVDD = 3.3V, AGND = 0V, TA = +25oC, 1kHz signal, fs = 48kHz, MCLK = 256fs unless otherwise stated. Implemented recommended calibration start-up sequence as detailed in Calibrated Start-Up section. PARAMETER TEST CONDITIONS Analogue Inputs INL, INR Maximum input signal level RIN = RFB = Input capacitance |
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