CW2400J

CW2400J Datasheet

TDS # CW2400

Part	Datasheet
CW2400J	CW2400J (pdf)

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CHEMTRONICS Technical Data Sheet TDS # CW2400 Conductive Epoxy PRODUCT DESCRIPTION Conductive Epoxy is a two part, silver epoxy used in prototype, repair and general conductive bonding applications. CW2400 features strong mechanical bonds, excellent electrical conductivity, and quick room temperature curing. Conductive Epoxy bonds aggressively to a wide variety of materials. • Two-component product • Simple mixing ratios • Excellent electrical conductivity • Fast curing • High strength bond • Bonds dissimilar surfaces • Operating temperature range from • -91°C -131°F to 100°C 212°F TYPICAL APPLICATIONS Conductive Epoxy may be used for electronics applications including: • Conductive Bonds Between Heat Sensitive Components • Solderless Surface Mount Connections • Circuit Board Trace Repair • Static Discharge and Grounding • Solder Repair • Conductive Structural Adhesions TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES Composition Material Part A Part B Specific Gravity Parts A & B Mixed Cured Compound Epoxy Hardener Volume Resistivity ohm-cm Thermal Conductivity Cal-cm/sec-cm2 -°C BTU-in/hr-ft2 -°F W/m°K Operating Temperature Range Lap Shear ASTM D-1002 x 10-3 -131 to 212°F -91 to 100°C >1200 lbs/in. Shore Hardness Dropping Point ASTM D-2266 None 650°F 343°C Adhesion Cured Flexibility Chemical Resistance Moisture Resistance Typical Thickness Excellent Good 5 mil Shelf life 9 months Conditions Store at temperatures below 77° F COMPATIBILITY Conductive Epoxy is generally compatible with most materials used in printed circuit board fabrication. As with any adhesive/sealant, compatibility with substrate should be determined on a non-critical area prior to use. USAGE INSTRUCTIONS Read MSDS carefully prior to use. Cleaning For best results, clean the board with one of or cleaners in order to remove any surface contamination which may prevent adequate material contact. Mixing Mix equal amounts 1:1 by weight or volume of Part A and Part B. Mix thoroughly for 2 minutes and apply within 8 minutes. Thinning Do not attempt to thin. Curing times and electrical conductivity depend primarily on temperature. For fastest curing times, maximum conductivity and adhesion, cure the bond between 150-250°F 65-121°C for 5-10 minutes. Conductive Epoxy can be room temperature cured at or above 75°F 25°C , for 4 hours. Maximum conductivity and bond strength are achieved in 24 hours. Curing at temperatures below 75°F 25°C will result in a loss of conductivity and adhesion. Pot Life 8-10 Minutes at 75°F 25°C after mixing. AVAILABILITY

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CHEMTRONICS

Technical Data Sheet

TDS # CW2400

Conductive Epoxy

PRODUCT DESCRIPTION

Conductive Epoxy is a two part, silver epoxy used in prototype, repair and general conductive bonding applications. CW2400 features strong mechanical bonds, excellent electrical conductivity, and quick room temperature curing. Conductive Epoxy bonds aggressively to a wide variety of materials.
• Two-component product
• Simple mixing ratios
• Excellent electrical conductivity
• Fast curing
• High strength bond
• Bonds dissimilar surfaces
• Operating temperature range from
• -91°C -131°F to 100°C 212°F

TYPICAL APPLICATIONS Conductive Epoxy may be used for electronics applications including:
• Conductive Bonds Between Heat Sensitive Components
• Solderless Surface Mount Connections
• Circuit Board Trace Repair
• Static Discharge and Grounding
• Solder Repair
• Conductive Structural Adhesions

TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES

Composition

Material

Part A Part B

Specific Gravity Parts A & B Mixed

Cured Compound

Epoxy Hardener

Volume Resistivity
ohm-cm

Thermal Conductivity Cal-cm/sec-cm2 -°C BTU-in/hr-ft2 -°F

W/m°K Operating Temperature Range

Lap Shear ASTM D-1002
x 10-3
-131 to 212°F -91 to 100°C >1200 lbs/in.

Shore Hardness

Dropping Point ASTM D-2266

None 650°F 343°C

Adhesion Cured Flexibility Chemical Resistance Moisture Resistance Typical Thickness

Excellent

Good 5 mil

Shelf life
9 months

Conditions Store at temperatures below 77° F

COMPATIBILITY Conductive Epoxy is generally compatible with most materials used in printed circuit board fabrication. As with any adhesive/sealant, compatibility with substrate should be determined on a non-critical area prior to use.

USAGE INSTRUCTIONS

Read MSDS carefully prior to use.

Cleaning For best results, clean the board with one of or cleaners in order to remove any surface contamination which may prevent adequate material contact.

Mixing Mix equal amounts 1:1 by weight or volume of Part A and Part B. Mix thoroughly for 2 minutes and apply within 8 minutes.

Thinning Do not attempt to thin.

Curing times and electrical conductivity depend primarily on temperature. For fastest curing times, maximum conductivity and adhesion, cure the bond between 150-250°F 65-121°C for 5-10 minutes. Conductive Epoxy can be room temperature cured at or above 75°F 25°C , for 4 hours. Maximum conductivity and bond strength are achieved in 24 hours. Curing at temperatures below 75°F 25°C will result in a loss of conductivity and adhesion.

Pot Life 8-10 Minutes at 75°F 25°C after mixing.

AVAILABILITY

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CW2400J Datasheet file may be downloaded here without warranties.

Datasheet ID: CW2400J 644093