WS2111-TR1

WS2111-TR1 Datasheet

Agilent WS2111 4 x 4 Power Amplifier Module for UMTS850 824 849 MHz

Part	Datasheet
WS2111-TR1	WS2111-TR1 (pdf)

Related Parts	Information
WS2111-BLK	WS2111-BLK

PDF Datasheet Preview
Agilent WS2111 4 x 4 Power Amplifier Module for UMTS850 824 849 MHz Data Sheet The WS2111, a Wide-band Code Division Multiple Access WCDMA Power Amplifier PA , is a fully matched 10-pin surface mount module developed for WCDMA handset applications. This power amplifier module operates in the MHz bandwidth. The WS2111 meets the stringent WCDMA linearity requirements for output power of up to 28 dBm. A low current Vcont pin is provided for high efficiency improvement of the low output power range. The WS2111 features CoolPAM Circuit technology offering stateof-the-art reliability, temperature stability and ruggedness. The WS2111 is self contained, incorporating 50ohm input and output matching networks. • CoolPAM circuit technology • Good linearity • High efficiency • 10-pin surface mounting package 4 mm x 4 mm x mm • Low power-state control • Internal matching networks for both RF input and output • Low quiescent current • W-CDMA Handsets • HSDPA Handsets Functional Block Diagram Vcc2 6 RF Input 4 Input Match Inter Stage Match Vcc1 5 MMIC Bias Circuit & Control Logic Vcont 2 Vref 1 Output Match RF Output 8 MODULE Table Absolute Maximum Ratings[1] Parameter RF Input Power DC Supply Voltage DC Reference Voltage Storage Temperature Min. Typical Max. Unit Vref Tstg +125 Table Recommended Operating Conditions Parameter DC Supply Voltage Mid/High Power Mode Low Power Mode DC Reference Voltage Mode Control Voltage High Power Mode Low/Mid Power Mode Operating Frequency Ambient Temperature Min. Typical Max. Ordering Information Number of Devices WS2111-BLK WS2111-TR1 2500 Container Bulk 13" Tape and Reel Tape and Reel Information Dimension List Annote A0 B0 K0 D0 D1 P0 P1 Millimeter ± ± ± ± ± ± ± Annote P2 P10 E F W T all dimensions are in millimeters Figure Tape and Reel Format 4 mm x 4 mm. Millimeter ± ± ± ± ± ± Tape and Reel Information, continued all dimensions are in millimeters Figure Plastic Reel Format Handling and Storage MSL Moisture Sensitivity Level ESD Electrostatic Discharge Electrostatic discharge occurs naturally in the environment. With the increase in voltage potential, the outlet of neutralization or discharge will be sought. If the acquired discharge route is through a semiconductor device, destructive damage will result. ESD countermeasure methods should be developed and used to control potential ESD damage during handling in a factory environment at each manufacturing site. Plastic encapsulated surface mount package is sensitive to damage induced by absorbed moisture and temperature. Agilent Technologies follows JEDEC Standard J-STD 020B. Each component and package type is classified for moisture sensitivity by soaking a known dry package at various temperatures and relative humidity, and times. After soak, the components are subjected to three consecutive simulated reflows. The out of bag exposure time maximum limits are determined by the classification test Table ESD Classification described below which corresponds to a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. WS2111 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time MET for this part is 168 hours. After this time period, the part would need to be removed from the reel, de-taped and then re-baked. MSL classification reflow temperature for the WS2111 is targeted at 250° C +0/-5° C. Figure 32 and Table 9 show typical SMT profile for maximum temperature of 250+0/-5° C. Pin# Name Vref Reference Voltage Vcont Control Voltage Ground RF In RF Input Vcc1 Supply Voltage

PDF Datasheet Preview

Agilent WS2111 4 x 4 Power Amplifier Module for UMTS850 824 849 MHz

Data Sheet

The WS2111, a Wide-band Code Division Multiple Access WCDMA Power Amplifier PA , is a fully matched 10-pin surface mount module developed for WCDMA handset applications. This power amplifier module operates in the MHz bandwidth. The WS2111 meets the stringent WCDMA linearity requirements for output power of up to 28 dBm. A low current Vcont pin is provided for high efficiency improvement of the low output power range.

The WS2111 features CoolPAM Circuit technology offering stateof-the-art reliability, temperature stability and ruggedness.

The WS2111 is self contained, incorporating 50ohm input and output matching networks.
• CoolPAM circuit technology
• Good linearity
• High efficiency
• 10-pin surface mounting package
4 mm x 4 mm x mm
• Low power-state control
• Internal matching networks
for both RF input and output
• Low quiescent current
• W-CDMA Handsets
• HSDPA Handsets

Functional Block Diagram

Vcc2 6

RF Input 4

Input Match

Inter

Stage

Match

Vcc1 5

MMIC

Bias Circuit & Control Logic

Vcont 2

Vref 1

Output Match

RF Output 8

MODULE

Table Absolute Maximum Ratings[1]

Parameter RF Input Power DC Supply Voltage DC Reference Voltage Storage Temperature

Min. Typical

Max.

Unit

Vref

Tstg
+125

Table Recommended Operating Conditions

Parameter

DC Supply Voltage Mid/High Power Mode Low Power Mode

DC Reference Voltage

Mode Control Voltage High Power Mode Low/Mid Power Mode

Operating Frequency

Ambient Temperature

Min. Typical

Max.
Ordering Information

Number of Devices

WS2111-BLK

WS2111-TR1
2500

Container Bulk 13" Tape and Reel

Tape and Reel Information

Dimension List Annote

A0 B0 K0 D0 D1 P0 P1

Millimeter
± ± ± ± ± ± ±

Annote

P2 P10 E F W T
all dimensions are in millimeters

Figure Tape and Reel Format 4 mm x 4 mm.

Millimeter
± ± ± ± ± ±

Tape and Reel Information, continued
all dimensions are in millimeters Figure Plastic Reel Format

Handling and Storage

MSL Moisture Sensitivity Level

ESD Electrostatic Discharge

Electrostatic discharge occurs naturally in the environment. With the increase in voltage potential, the outlet of neutralization or discharge will be sought. If the acquired discharge route is through a semiconductor device, destructive damage will result.

ESD countermeasure methods should be developed and used to control potential ESD damage during handling in a factory environment at each manufacturing site.

Plastic encapsulated surface mount package is sensitive to damage induced by absorbed moisture and temperature. Agilent Technologies follows JEDEC Standard J-STD 020B. Each component and package type is classified for moisture sensitivity by soaking a known dry package at various temperatures and relative humidity, and times. After soak, the components are subjected to three consecutive simulated reflows.

The out of bag exposure time maximum limits are determined by the classification test

Table ESD Classification
described below which corresponds to a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033.

WS2111 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time MET for this part is 168 hours. After this time period, the part would need to be removed from the reel, de-taped and then re-baked.

MSL classification reflow temperature for the WS2111 is targeted at 250° C +0/-5° C. Figure 32 and Table 9 show typical SMT profile for maximum temperature of 250+0/-5° C.

Pin#

Name

Vref

Reference Voltage

Vcont

Control Voltage

Ground

RF In

RF Input

Vcc1

Supply Voltage

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Datasheet ID: WS2111-TR1 520540