HSMA-C130

HSMA-C130 Datasheet

HSMx-C130 Surface Mount ChipLEDs

Part	Datasheet
HSMA-C130	HSMA-C130 (pdf)

Related Parts	Information
HSME-C130	HSME-C130
HSMC-C130	HSMC-C130

PDF Datasheet Preview
HSMx-C130 Surface Mount ChipLEDs Data Sheet The HSMx-C130 ChipLeds are designed specially for the membrane switch application. The request is to have as low as possible while retaining the footprint at the optimal size of a 0603 x mm device. Apart from the membrane switch application, the HSMx-C130 is also suitable for use in applications where low height is required. These chip-type LEDs utilize Aluminum Indium Gallium Phosphide AlInGaP material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. Four different colors are available amber, red, green, and orange. All parts are intensity binned and color binned except for red color . They come in 8 mm conductive tape on a 7 inch diameter reel with 4000 units per reel which make them compatible for automatic placement. x High brightness AlInGaP material x Small size with extremely low profile x 0603 industry standard footprint with 0.35mm height x Diffused optics x Operating range of -40qC to 85qC x Available in 4 colors x Compatible with IR soldering x Available in 8 mm conductive tape on 7” diameter reel x Reel sealed in zip locked moisture barrier bags x Membrane switch indicator x LCD backlighting x Push button backlighting x Front panel indicator x Symbol backlighting x Keypad backlighting CAUTION HSMx-C130 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions LED DIE CATHODE MARK POLARITY DIFFUSED EPOXY PCB BOARD ± ± CATHODE LINE ± ± MIN. SOLDERING TERMINAL NOTES ALL DIMENSIONS IN MILLIMETERS INCHES . TOLERANCE IS mm IN. UNLESS OTHERWISE SPECIFIED. Device Selection Guide Part Number HSMA-C130 HSMC-C130 HSME-C130 HSML-C130 Color Amber Red Yellow Green Orange Die Technology AlInGaP Parts per Reel 4000 Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Absolute Maximum Ratings at TA = 25qC Notes Derate linearly as shown in Figure AlInGaP Units -40 to +85 qC -40 to +85 qC See reflow soldering profile Figure 5 & 6 Electrical Characteristics at TA = 25°C Part Number HSMA-C130 HSMC-C130 HSME-C130 HSML-C130 Forward Voltage VF Volts IF = 20mA Typ. Max. IR = 100PA Min. 5 Thermal Resistance RTJP qC/W Typical Optical Characteristics at TA = 25°C

PDF Datasheet Preview

HSMx-C130 Surface Mount ChipLEDs

Data Sheet

The HSMx-C130 ChipLeds are designed specially for the membrane switch application. The request is to have as low as possible while retaining the footprint at the optimal size of a 0603 x mm device. Apart from the membrane switch application, the HSMx-C130 is also suitable for use in applications where low height is required.

These chip-type LEDs utilize Aluminum Indium Gallium Phosphide AlInGaP material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents.

Four different colors are available amber, red, green, and orange. All parts are intensity binned and color binned except for red color . They come in 8 mm conductive tape on a 7 inch diameter reel with 4000 units per reel which make them compatible for automatic placement.
x High brightness AlInGaP material x Small size with extremely low profile x 0603 industry standard footprint with 0.35mm height x Diffused optics x Operating range of -40qC to 85qC x Available in 4 colors x Compatible with IR soldering x Available in 8 mm conductive tape on 7” diameter reel x Reel sealed in zip locked moisture barrier bags
x Membrane switch indicator x LCD backlighting x Push button backlighting x Front panel indicator x Symbol backlighting x Keypad backlighting

CAUTION HSMx-C130 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

Package Dimensions

LED DIE

CATHODE MARK

POLARITY

DIFFUSED EPOXY PCB BOARD
± ±

CATHODE LINE
± ±

MIN.

SOLDERING TERMINAL

NOTES ALL DIMENSIONS IN MILLIMETERS INCHES . TOLERANCE IS mm IN. UNLESS OTHERWISE SPECIFIED.

Device Selection Guide

Part Number HSMA-C130 HSMC-C130 HSME-C130 HSML-C130

Color Amber Red Yellow Green Orange

Die Technology AlInGaP

Parts per Reel 4000

Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused

Absolute Maximum Ratings at TA = 25qC

Notes Derate linearly as shown in Figure

AlInGaP

Units
-40 to +85 qC
-40 to +85 qC

See reflow soldering profile Figure 5 & 6

Electrical Characteristics at TA = 25°C

Part Number HSMA-C130 HSMC-C130 HSME-C130 HSML-C130

Forward Voltage

VF Volts IF = 20mA

Typ.

Max.

IR = 100PA Min. 5

Thermal Resistance RTJP qC/W Typical

Optical Characteristics at TA = 25°C

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Datasheet ID: HSMA-C130 520437