HSMP-386B-TR1G

HSMP-386B-TR1G Datasheet

HSMP-386x Surface Mount PIN Diodes

Part	Datasheet
HSMP-386B-TR1G	HSMP-386B-TR1G (pdf)

Related Parts	Information
HSMP-3860-TR1	HSMP-3860-TR1
HSMP-3864-TR1	HSMP-3864-TR1
HSMP-3862-TR1	HSMP-3862-TR1
HSMP-3862-TR2G	HSMP-3862-TR2G
HSMP-386F-TR2G	HSMP-386F-TR2G
HSMP-3860-TR2G	HSMP-3860-TR2G
HSMP-386F-BLKG	HSMP-386F-BLKG
HSMP-3860-BLKG	HSMP-3860-BLKG
HSMP-3864-TR2G	HSMP-3864-TR2G
HSMP-3860-TR1G	HSMP-3860-TR1G
HSMP-3863-BLKG	HSMP-3863-BLKG
HSMP-3862-BLKG	HSMP-3862-BLKG
HSMP-3863-TR1G	HSMP-3863-TR1G
HSMP-3862-TR1G	HSMP-3862-TR1G
HSMP-3864-BLKG	HSMP-3864-BLKG
HSMP-3864-TR1G	HSMP-3864-TR1G
HSMP-386B-BLKG	HSMP-386B-BLKG
HSMP-386B-TR2G	HSMP-386B-TR2G
HSMP-3863-TR2G	HSMP-3863-TR2G
HSMP-386C-TR2G	HSMP-386C-TR2G
HSMP-386E-TR1G	HSMP-386E-TR1G
HSMP-386C-TR1G	HSMP-386C-TR1G
HSMP-386L-TR2G	HSMP-386L-TR2G
HSMP-386E-TR2G	HSMP-386E-TR2G
HSMP-386L-BLKG	HSMP-386L-BLKG
HSMP-386C-BLKG	HSMP-386C-BLKG
HSMP-386L-TR1G	HSMP-386L-TR1G
HSMP-386E-BLKG	HSMP-386E-BLKG
HSMP-386F-TR1G	HSMP-386F-TR1G

PDF Datasheet Preview
HSMP-386x Surface Mount PIN Diodes Data Sheet Description/Applications The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance CT and Total Resistance RT are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. Pin Connections and Package Marking, SOT-363 • Unique Configurations in Surface Mount Packages Add Flexibility Save Board Space Reduce Cost • Switching Low Distortion Switching Low Capacitance • Attenuating Low Current Attenuating for Less Power Consumption • Matched Diodes for Consistent Performance • Better Thermal Conductivity for Higher Power Dissipation • Low Failure in Time FIT Rate[1] • Lead-free Note: For more information see the Surface Mount PIN Reliability Data Sheet. Package marking provides orientation, identification, and date code. See “Electrical Specifications” for appropriate package marking. Package Lead Code Identification, SOT-23, SOT-143 Top View SINGLE SERIES COMMON ANODE COMMON CATHODE Package Lead Code Identification, SOT-323 Top View SINGLE SERIES COMMON ANODE COMMON CATHODE Package Lead Code Identification, SOT-363 Top View UNCONNECTED TRIO RING QUAD 34 See separate data sheet HSMP-386D Absolute Maximum Ratings[1] TC = +25°C Symbol Parameter Forward Current 1 µs Pulse Peak Inverse Voltage Junction Temperature Tstg Storage Temperature Thermal Resistance[2] Unit Amp V °C °C °C/W Ordering Information Specify part number followed by option. For example HSMP - 386x - XXX Bulk or Tape and Reel Option Part Number x = Lead Code Surface Mount PIN Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Assembly Information SOT-323 PCB Footprint Recommended PCB pad layouts for the miniature SOT packages are shown in Figures 15, 16, These layouts provide ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. Dimensions in inches Dimensions in inches Figure Recommended PCB Pad Layout for Avago’s SC70 Products. Figure16. Dimensions in inches mm Figure Recommended PCB Pad Layout for Avago’s Products. SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including method of heating e.g., IR or vapor phase reflow, wave soldering, etc. circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. Avago’s diodes have been qualified to the time-temperature profile shown in Figure This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it held in place with solder paste passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone TMAX should not exceed 260°C. These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. Tp TL Ts max Ramp-up tp tL Critical Zone T L to Tp Temperature Ts min Preheat Ramp-down t 25° C to Peak Time Figure Surface Mount Assembly Profile. Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C Reflow Parameter Lead-Free Assembly Average ramp-up rate Liquidus Temperature TS max to Peak Preheat Temperature Min TS min Temperature Max TS max Time min to max tS

PDF Datasheet Preview

HSMP-386x Surface Mount PIN Diodes

Data Sheet

Description/Applications

The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer.

The HSMP-386x series Total Capacitance CT and Total Resistance RT are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended.

A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime.

Pin Connections and Package Marking, SOT-363
• Unique Configurations in Surface Mount Packages Add Flexibility Save Board Space Reduce Cost
• Switching Low Distortion Switching Low Capacitance
• Attenuating Low Current Attenuating for Less Power Consumption
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power Dissipation
• Low Failure in Time FIT Rate[1]
• Lead-free

Note:

For more information see the Surface Mount PIN Reliability Data Sheet.

Package marking provides orientation, identification, and date code. See “Electrical Specifications” for appropriate package marking.

Package Lead Code Identification, SOT-23, SOT-143 Top View

SINGLE

SERIES

COMMON ANODE

COMMON CATHODE

Package Lead Code Identification, SOT-323 Top View

SINGLE

SERIES

COMMON ANODE

COMMON CATHODE

Package Lead Code Identification, SOT-363 Top View

UNCONNECTED TRIO

RING QUAD 34

See separate data sheet HSMP-386D

Absolute Maximum Ratings[1] TC = +25°C

Symbol Parameter

Forward Current 1 µs Pulse

Peak Inverse Voltage

Junction Temperature

Tstg

Storage Temperature

Thermal Resistance[2]

Unit Amp

V °C °C °C/W
Ordering Information

Specify part number followed by option. For example HSMP - 386x - XXX

Bulk or Tape and Reel Option Part Number x = Lead Code Surface Mount PIN

Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.”

Assembly Information

SOT-323 PCB Footprint

Recommended PCB pad layouts for the miniature SOT packages are shown in Figures 15, 16, These layouts provide ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance.

Dimensions in inches

Dimensions in inches

Figure Recommended PCB Pad Layout for Avago’s SC70 Products.

Figure16.

Dimensions in
inches mm

Figure Recommended PCB Pad Layout for Avago’s Products.

SMT Assembly

Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including method of heating e.g., IR or vapor phase reflow, wave soldering, etc. circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass.

Avago’s diodes have been qualified to the time-temperature profile shown in Figure This profile is representative of an IR reflow type of surface mount assembly process.

After ramping up from room temperature, the circuit board with components attached to it held in place with solder paste passes through one or more preheat zones. The
preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder.

The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone TMAX should not exceed 260°C.

These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder.

Tp TL

Ts max

Ramp-up
tp tL

Critical Zone T L to Tp

Temperature

Ts min

Preheat

Ramp-down
t 25° C to Peak

Time

Figure Surface Mount Assembly Profile.

Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C

Reflow Parameter

Lead-Free Assembly

Average ramp-up rate Liquidus Temperature TS max to Peak

Preheat

Temperature Min TS min

Temperature Max TS max

Time min to max tS

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived HSMP-386B-TR1G Datasheet file may be downloaded here without warranties.

Datasheet ID: HSMP-386B-TR1G 520412