ABA-51563-TR1

ABA-51563-TR1 Datasheet

Agilent ABA-51563 GHz Broadband Silicon RFIC Amplifier

Part	Datasheet
ABA-51563-TR1	ABA-51563-TR1 (pdf)

PDF Datasheet Preview
Agilent ABA-51563 GHz Broadband Silicon RFIC Amplifier Data Sheet Description Agilent’s ABA-51563 is an economical, easy-to-use, internally 50-ohm matched silicon monolithic broadband amplifier that offers excellent gain and flat broadband response from DC to GHz. Packaged in an ultraminiature industry-standard SOT-363 package, it requires half the board space of a SOT-143 package. Surface Mount Package SOT-363 /SC70 Pin Connections and Package Marking Features • Operating frequency DC ~ GHz • dB gain • VSWR < throughout operating frequency • dBm output P1dB • dB noise figure • Unconditionally stable • Single 5V supply Id = 18 mA • Lead-free option available Applications • Amplifier for cellular, cordless, special mobile radio, PCS, ISM, wireless LAN, DBS, TVRO, and TV tuner applications At 2 GHz, the ABA-51563 offers a small-signal gain of dB, output P1dB of dBm and dBm output third order intercept point. It is suitable for use as buffer amplifiers for wideband applications. They are designed for low cost gain blocks in cellular applications, DBS tuners, LNB and other wireless communications systems. ABA-51563 is fabricated using Agilent’s HP25 silicon bipolar process, which employs a doublediffused single polysilicon process with self-aligned submicron emitter geometry. The process is capable of simultaneous high fT and high NPN breakdown 25 GHz fT at 6V BVCEO . The process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. GND 1 GND 2 Input Output & Vcc GND 3 Note Top View. Package marking provides orientation and identification. “x” is character to identify date code. Simplified Schematic RF Input Ground 2 Ground 3 Attention Observe precautions for handling electrostatic sensitive devices. ESD Machine Model Class A ESD Human Body Model Class 1A Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control. RF Output & Vcc Ground 1 ABA-51563 Absolute Maximum Ratings[1] Symbol Parameter Device Voltage, RF output to ground T = 25°C CW RF Input Power Vcc = 5V Pdiss Total Power Dissipation[3] Junction Temperature TSTG Storage Temperature Units V dBm W °C °C Absolute Max. +7 +20 150 -65 to 150 Thermal Resistance[2] Vcc = 5V = 104°C/W Notes Operation of this device in excess of any of these limits may cause permanent damage. Thermal resistance measured using 150°C Liquid Crystal Measurement Technique. Board package belly temperature, Tb, is 25°C. Derate mW/°C for Tb > 120.8°C. Ordering Information Devices per Container Container ABA-51563-TR1 3000 7" reel ABA-51563-TR2 10000 13" reel ABA-51563-BLK antistatic bag ABA-51563-TR1G 3000 7" reel ABA-51563-TR2G 10000 13" reel ABA-51563-BLKG antistatic bag Note For lead-free option,the part number will have the character “G” at the end. Package Dimensions Outline 63 SOT-363/SC-70 Recommended PCB Pad Layout for Agilent's SC70 6L/SOT-363 Products Dimensions in inches. c SYMBOL E D HE A A2 A1 Q1 e b c L DIMENSIONS mm MIN. MAX. NOTES All dimensions are in mm. Dimensions are inclusive of plating. Dimensions are exclusive of mold flash & metal burr. All specifications comply to EIAJ SC70. Die is facing up for mold and facing down for trim/form, Device Orientation REEL TOP VIEW 4 mm END VIEW USER FEED DIRECTION COVER TAPE CARRIER TAPE Package marking example orientation shown. Tape Dimensions and Product Orientation for Outline 63 D1 t1 CARRIER TAPE THICKNESS Tt COVER TAPE THICKNESS 10° MAX. 10° MAX.

PDF Datasheet Preview

Agilent ABA-51563 GHz Broadband Silicon RFIC Amplifier

Data Sheet

Description Agilent’s ABA-51563 is an economical, easy-to-use, internally 50-ohm matched silicon monolithic broadband amplifier that offers excellent gain and flat broadband response from DC to GHz. Packaged in an ultraminiature industry-standard SOT-363 package, it requires half the board space of a SOT-143 package.

Surface Mount Package SOT-363 /SC70

Pin Connections and Package Marking

Features
• Operating frequency DC ~ GHz
• dB gain
• VSWR < throughout operating
frequency
• dBm output P1dB
• dB noise figure
• Unconditionally stable
• Single 5V supply Id = 18 mA
• Lead-free option available

Applications
• Amplifier for cellular, cordless,
special mobile radio, PCS, ISM, wireless LAN, DBS, TVRO, and TV tuner applications

At 2 GHz, the ABA-51563 offers a small-signal gain of dB, output P1dB of dBm and dBm output third order intercept point. It is suitable for use as buffer amplifiers for wideband applications. They are designed for low cost gain blocks in cellular applications, DBS tuners, LNB and other wireless communications systems.

ABA-51563 is fabricated using Agilent’s HP25 silicon bipolar process, which employs a doublediffused single polysilicon process with self-aligned submicron emitter geometry. The process is capable of simultaneous high fT and high NPN breakdown 25 GHz fT at 6V BVCEO . The process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability.

GND 1 GND 2 Input

Output & Vcc

GND 3

Note Top View. Package marking provides orientation and identification. “x” is character to identify date code.

Simplified Schematic

RF Input

Ground 2

Ground 3

Attention Observe precautions for handling electrostatic sensitive devices. ESD Machine Model Class A ESD Human Body Model Class 1A Refer to Agilent Application Note A004R:

Electrostatic Discharge Damage and Control.

RF Output & Vcc

Ground 1

ABA-51563 Absolute Maximum Ratings[1]

Symbol Parameter

Device Voltage, RF output to ground T = 25°C

CW RF Input Power Vcc = 5V

Pdiss

Total Power Dissipation[3]

Junction Temperature

TSTG

Storage Temperature

Units

V dBm W °C °C

Absolute Max.
+7 +20 150 -65 to 150

Thermal Resistance[2] Vcc = 5V = 104°C/W

Notes Operation of this device in excess of any of
these limits may cause permanent damage. Thermal resistance measured using 150°C

Liquid Crystal Measurement Technique. Board package belly temperature, Tb, is
25°C. Derate mW/°C for Tb > 120.8°C.
Ordering Information

Devices per Container

Container

ABA-51563-TR1
3000
7" reel

ABA-51563-TR2
10000
13" reel

ABA-51563-BLK
antistatic bag

ABA-51563-TR1G
3000
7" reel

ABA-51563-TR2G
10000
13" reel

ABA-51563-BLKG
antistatic bag

Note For lead-free option,the part number will have the character “G” at the end.

Package Dimensions Outline 63 SOT-363/SC-70

Recommended PCB Pad Layout for Agilent's SC70 6L/SOT-363 Products

Dimensions in inches. c

SYMBOL E D HE A A2 A1 Q1 e b c L

DIMENSIONS mm

MIN.

MAX.

NOTES All dimensions are in mm. Dimensions are inclusive of plating. Dimensions are exclusive of mold flash & metal burr. All specifications comply to EIAJ SC70. Die is facing up for mold and facing down for trim/form,

Device Orientation

REEL

TOP VIEW 4 mm

END VIEW

USER FEED DIRECTION

COVER TAPE

CARRIER TAPE

Package marking example orientation shown.

Tape Dimensions and Product Orientation for Outline 63

D1 t1 CARRIER TAPE THICKNESS

Tt COVER TAPE THICKNESS
10° MAX.
10° MAX.

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Datasheet ID: ABA-51563-TR1 519851