5082-0012

5082-0012 Datasheet

5082-0012

Part	Datasheet
5082-0012	5082-0012 (pdf)

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5082-0012 PIN Diode Chip for Hybrid MIC Switches/Attenuators Data Sheet This PIN diode chip is silicon dioxide or nitride passivated. The 5082-0012 has a planar construction. The fabrication processes are optimized for long term reliability and tightly controlled for uniformity in electrical performance. DIMENSIONS Top Contact Bottom Contact Au. Cathode Au. Anode Dimensions in millimeters 1/1000 inch • Low Series Resistance Typical This general purpose PIN diode is intended for low power switching applications such as duplexers, antenna switching matrices, digital phase shifters, time multiplex filters, TR switches, pulse and amplitude modulators, limiters, leveling circuits, and attenuators. Maximum Ratings Junction Operating and Storage Temperature Range -65°C to +150°C Soldering Temperature +425°C for 1 min. max. Electrical Specifications at TA = 25°C Chip Part Number 5082- Nearest Equivalent Packaged Part No. 5082- Minimum Breakdown Voltage VBR V 0012 3001 Test Conditions VR = VBR Measure IR 10 mA Maximum Junction Capacitance Cj pF VR = 50 V f = 1 MHz Typical Parameters Typical Series Resistance RS IF = 100 mA f = 100 MHz Typical Lifetime IF = 50 mA IR = 250 mA Time trr ns IF = 20 mA VR = 10 V 90% Recovery Assembly and Handling Procedures for PIN Chips Storage Devices should be stored in a dry nitrogen purged dessicator or equivalent. Die Attach a. Eutectic AuSn preform with stage temperature of 310°C for one minute max. AuGe preform with stage temperature of 390°C for one minute max. Cleaning If required, surface contamination may be removed with electronic grade solvents. Typical solvents, such as freon T.F. or T.M.C. , acetone, deionized water, and methanol, or their locally approved equivalents, can be used singularly or in combinations. Typical cleaning times per solvent are one to three minutes. DI water and methanol should be used in that order in the final cleans. Final drying can be accomplished by placing the cleaned dice on clean filter paper and drying with an infrared lamp for 5-10 minutes. Acids such as hydrofluoric HF , nitric HNO3 and hydrochloric HCl should not be used. b. Epoxy For epoxy die-attach, conductive silver-filled or goldfilled epoxies are recommended. This method can be used for all Avago PIN chips. Wire Bonding Either ultrasonic or thermocompression bonding techniques can be employed. Suggested wire is pure gold, to mil diameter. The effects of cleaning methods/solutions should be verified on small samples prior to submitting the entire lot.

PDF Datasheet Preview

5082-0012

PIN Diode Chip for Hybrid MIC Switches/Attenuators

Data Sheet

This PIN diode chip is silicon dioxide or nitride passivated. The 5082-0012 has a planar construction. The fabrication processes are optimized for long term reliability and tightly controlled for uniformity in electrical performance.

DIMENSIONS

Top Contact

Bottom Contact

Au. Cathode

Au. Anode

Dimensions in millimeters
1/1000 inch
• Low Series Resistance Typical

This general purpose PIN diode is intended for low power switching applications such as duplexers, antenna switching matrices, digital phase shifters, time multiplex filters, TR switches, pulse and amplitude modulators, limiters, leveling circuits, and attenuators.

Maximum Ratings

Junction Operating and Storage Temperature Range -65°C to +150°C Soldering Temperature +425°C for 1 min. max.

Electrical Specifications at TA = 25°C

Chip Part Number 5082-

Nearest Equivalent Packaged

Part No. 5082-

Minimum Breakdown

Voltage VBR V
0012
3001

Test Conditions

VR = VBR Measure IR 10 mA

Maximum Junction Capacitance Cj pF

VR = 50 V f = 1 MHz

Typical Parameters

Typical Series Resistance RS

IF = 100 mA f = 100 MHz

Typical Lifetime

IF = 50 mA IR = 250 mA

Time trr ns

IF = 20 mA VR = 10 V 90% Recovery

Assembly and Handling Procedures for PIN Chips

Storage Devices should be stored in a dry nitrogen purged dessicator or equivalent.

Die Attach a. Eutectic AuSn preform with stage temperature of 310°C for one minute max. AuGe preform with stage temperature of 390°C for one minute max.

Cleaning If required, surface contamination may be removed with electronic grade solvents. Typical solvents, such as freon T.F. or T.M.C. , acetone, deionized water, and methanol, or their locally approved equivalents, can be used singularly or in combinations. Typical cleaning times per solvent are one to three minutes. DI water and methanol should be used in that order in the final cleans. Final drying can be accomplished by placing the cleaned dice on clean filter paper and drying with an infrared lamp for 5-10 minutes. Acids such as hydrofluoric HF , nitric HNO3 and hydrochloric HCl should not be used.
b. Epoxy For epoxy die-attach, conductive silver-filled or goldfilled epoxies are recommended. This method can be used for all Avago PIN chips.

Wire Bonding Either ultrasonic or thermocompression bonding techniques can be employed. Suggested wire is pure gold, to mil diameter.

The effects of cleaning methods/solutions should be verified on small samples prior to submitting the entire lot.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 5082-0012 Datasheet file may be downloaded here without warranties.

Datasheet ID: 5082-0012 519848