1009-60

1009-60 Datasheet

Temp/Hum/Bias 85°C/85%RH/100V

Part	Datasheet
1009-60	1009-60 (pdf)

Related Parts	Information
2020-48	2020-48
SP1000-0.009-00-1212	SP1000-0.009-00-1212
803308	803308

PDF Datasheet Preview
Thermal Solutions For Surface Mount Power Applications SELECTION GUIDE September 2009 Thermal U.S. Patent 4,810,563 and others. ISO-9001:2000 Certificate Number, QSR-572 Table of Contents Thermal Clad Thermal Clad Overview Thermal Clad Applications Thermal Clad Reliability Dielectrics Selecting Dielectric Materials Dielectric Performance Characteristics Summary Of Key Dielectric Characteristics Using Dielectric Materials In Specialty Applications Design Considerations Selecting The Base Metal Layer Selecting A Circuit Layer Electrical Design Considerations Assembly Recommendations Other Bergquist Thermal Products Appendix Thermal Clad Configurations Thermal Overview Key Benefits Of Thermal Clad The Bergquist Company is the world leader in the development and manufacture of thermally conductive interface materials.Thermal Clad Insulated Metal Substrate was developed by Bergquist as a thermal management solution for today’s higher watt-density surface mount applications where heat issues are a major concern. Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards PWB's . These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications. Thermal Clad is a cost-effective solution which can eliminate components, allow for simplified designs, smaller devices and an overall less complicated production processes. Additional benefits of Thermal Clad include lower operating temperatures, longer component life and increased durability. Bergquist Thermal Clad substrates are not limited to use with metal base layers. In one example, power conversion applications can enhance their performance by replacing FR-4 with Thermal Clad dielectrics in multi-layer assemblies. In this application, the thickness of the copper circuit layer can be minimized by the high thermal performance of Thermal Clad. For additional information on this topic, refer to the “Specialty Applications” section on pages 10-11 of this guide. Original Power Board Assembly Actual 66 Thru-hole FETs 15 High profile capacitors 9 High profile bus bars Total Weight lbs g New Power Board Assembly Actual 48 FETs 9 Low profile capacitors 5 Low profile bus bars Total Weight lbs g Thermal Clad is a complete thermal management system, unlike traditional technology which uses heat sinks, clips and other mounting hardware. Thermal Clad enables low-cost production by eliminating the need for costly manual assembly. Traditionally, cooling an FR-4 board required use of a large heat sink, interface material and various hardware brackets, screws or clamps a configuration requiring labor intensive manual assembly. Cooling with Thermal Clad can eliminate the need for heat sinks, device clips, cooling fans and other hardware. An automated assembly method will reduce long term costs. Conventional methods measured junction temperature 5W=Tj 43ºC Thermal Clad measured junction temperature 5W=Tj 35ºC Thermal Clad Benefits • RoHS compliant and halogen-free • Lower component operating temperatures • Reduce printed circuit board size • Increase power density • Extend the life of dies • Reduce the number of interconnects • Improve product thermal and mechanical performance • Combine power and control • Improve product durability • Enable better use of surface mount technology • Reduce heat sinks and other mounting hardware, including thermal interface material • Replace fragile ceramic substrates with greater mechanical durability • Bergquist is your one-stop source from raw materials to finished circuit Improve Durability and Performance Thermal Clad improves durability because designs can be kept simple while components are kept cool. The low thermal impedance of the Thermal Clad dielectric outperforms other insulators for power components, allowing for cooler operation. Thermal Clad keeps assemblies cool by eliminating thermal interfaces and using thermally efficient solder joints. Voltage breakdown and thermal performance improve in potted assemblies using SMD’s and bare die on Thermal Clad.

PDF Datasheet Preview

Thermal Solutions For Surface Mount Power Applications

SELECTION GUIDE

September 2009

Thermal U.S. Patent 4,810,563 and others.

ISO-9001:2000 Certificate Number,

QSR-572

Table of Contents

Thermal Clad

Thermal Clad Overview Thermal Clad Applications Thermal Clad Reliability

Dielectrics

Selecting Dielectric Materials Dielectric Performance Characteristics Summary Of Key Dielectric Characteristics Using Dielectric Materials In Specialty Applications

Design Considerations

Selecting The Base Metal Layer Selecting A Circuit Layer Electrical Design Considerations Assembly Recommendations

Other Bergquist Thermal Products Appendix Thermal Clad Configurations

Thermal Overview

Key Benefits Of Thermal Clad

The Bergquist Company is the world leader in the development and manufacture of thermally conductive interface materials.Thermal Clad Insulated Metal Substrate was developed by Bergquist as a thermal management solution for today’s higher watt-density surface mount applications where heat issues are a major concern.

Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards PWB's . These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.

Thermal Clad is a cost-effective solution which can eliminate components, allow for simplified designs, smaller devices and an overall less complicated production processes. Additional benefits of Thermal Clad include lower operating temperatures, longer component life and increased durability.

Bergquist Thermal Clad substrates are not limited to use with metal base layers. In one example, power conversion applications can enhance their performance by replacing FR-4 with Thermal Clad dielectrics in multi-layer assemblies. In this application, the thickness of the copper circuit layer can be minimized by the high thermal performance of Thermal Clad. For additional information on this topic, refer to the “Specialty Applications” section on pages 10-11 of this guide.

Original Power Board Assembly Actual
66 Thru-hole FETs 15 High profile capacitors 9 High profile bus bars Total Weight lbs g

New Power Board Assembly Actual
48 FETs 9 Low profile capacitors 5 Low profile bus bars Total Weight lbs g

Thermal Clad is a complete thermal management system, unlike traditional technology which uses heat sinks, clips and other mounting hardware. Thermal Clad enables low-cost production by eliminating the need for costly manual assembly.

Traditionally, cooling an FR-4 board required use of a large heat sink, interface material and various hardware brackets, screws or clamps a configuration requiring
labor intensive manual assembly.

Cooling with Thermal Clad can eliminate the need for heat sinks, device clips, cooling fans and other hardware.

An automated assembly method will reduce long term costs.

Conventional methods measured junction temperature
5W=Tj 43ºC

Thermal Clad measured junction temperature
5W=Tj 35ºC

Thermal Clad Benefits
• RoHS compliant and halogen-free
• Lower component operating temperatures
• Reduce printed circuit board size
• Increase power density
• Extend the life of dies
• Reduce the number of interconnects
• Improve product thermal and mechanical performance
• Combine power and control
• Improve product durability
• Enable better use of surface mount technology
• Reduce heat sinks and other mounting hardware, including
thermal interface material
• Replace fragile ceramic substrates with greater
mechanical durability
• Bergquist is your one-stop source from raw materials
to finished circuit

Improve Durability and Performance

Thermal Clad improves durability because designs can be kept simple while components are kept cool. The low thermal impedance of the Thermal Clad dielectric outperforms other insulators for power components, allowing for cooler operation.

Thermal Clad keeps assemblies cool by eliminating thermal interfaces and using thermally efficient solder joints. Voltage breakdown and thermal performance improve in potted assemblies using SMD’s and bare die on Thermal Clad.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 1009-60 Datasheet file may be downloaded here without warranties.

Datasheet ID: 1009-60 521732