CPU .005" 12" X 12"

CPU .005" 12" X 12" Datasheet

CPU PAD

Part	Datasheet
CPU .005" 12" X 12"	CPU .005" 12" X 12" (pdf)

Related Parts	Information
CPU .63X.63	CPU .63X.63
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CPU 1.375X1.375	CPU 1.375X1.375

PDF Datasheet Preview
CPU PAD Thermally Conductive Material for Cooling Central Processing Units Application Force for CPU Pad CPU Pad is a high performance, acrylic, pressure sensitive adhesive. Being pressure sensitive, the adhesive makes a strong bond to surfaces with little or no pressure. Parts can simply be assembled and placed on the CPU Pad. Immediately after placement, the parts are securely bonded together. No long clamping times or high pressures are required. Mounting Procedure Insure cleanliness of central processing unit and heat sink. Remove the clear liner from one side of the CPU Pad. Bergquist CPU Pad is a thermally conductive, electrically insulating, double coated tape. The tape consists of a high performance acrylic, pressure sensitive adhesive, on both sides of a This product can be used in applications that currently require clips. CPU Pad is typically used to mount a heat sink on top of a central processing unit on the circuit board. Roll the pad onto the substrate. Remove the white liner. With moderate pressure less than 10 psi , press the part in place. TYPICAL PROPERTIES OF CPU Pad PROPERTY Color Thickness Tensile Strength Elongation Glass Transition TYPICAL VALUE Tan 5000 psi 40 % -70 °C METRIC TYPICAL VALUE/ 5 MIL 9 MIL 35 MPa -70 °C -70 °C TEST METHOD Visual ASTM D 374 ASTM D 412 ASTM D 412 TMA Adhesion to Aluminum Adhesion to Liner Tensile Shear 4 lbs./in 16 g/inch 120 psi 7 N/cm 6 N/m MPa 2700 grams per in. ASTM D 1876 50 gr. grams per in. ASTM D 1876 140 psi ASTM D 1002 Thermal Properties Thermal Conductivity W/m-K Thermal Resistance C-in2/W Thermal of expansion 450 ppm W/m-K °Cmm2/w 450 ppm W/m-K °C-in2/W ASTM D5470 ASTM D5470 TMA Thermal Cycling 1 Hour at -50°C and 1 Hour at 150°C Time Peel Adhesion Voltage Breakdown Cycles PLI N/cm 6000

PDF Datasheet Preview

CPU PAD

Thermally Conductive Material for Cooling Central Processing Units

Application Force for CPU Pad

CPU Pad is a high performance, acrylic, pressure sensitive adhesive. Being pressure sensitive, the adhesive makes a strong bond to surfaces with little or no pressure. Parts can simply be assembled and placed on the CPU Pad. Immediately after placement, the parts are securely bonded together. No long clamping times or high pressures are required.

Mounting Procedure

Insure cleanliness of central processing unit and heat sink.

Remove the clear liner from one side of the CPU Pad.

Bergquist CPU Pad is a thermally conductive, electrically insulating, double coated tape. The tape consists of a high performance acrylic, pressure sensitive adhesive, on both sides of a This product can be used in applications that currently require clips. CPU Pad is typically used to mount a heat sink on top of a central processing unit on the circuit board.

Roll the pad onto the substrate.

Remove the white liner.

With moderate pressure less than 10 psi , press the part in place.

TYPICAL PROPERTIES OF CPU Pad

PROPERTY Color Thickness Tensile Strength Elongation Glass Transition

TYPICAL VALUE Tan 5000 psi 40 % -70 °C

METRIC TYPICAL VALUE/ 5 MIL 9 MIL
35 MPa
-70 °C
-70 °C

TEST METHOD Visual ASTM D 374 ASTM D 412 ASTM D 412 TMA

Adhesion to Aluminum Adhesion to Liner Tensile Shear
4 lbs./in 16 g/inch 120 psi
7 N/cm 6 N/m MPa
2700 grams per in. ASTM D 1876
50 gr. grams per in. ASTM D 1876
140 psi

ASTM D 1002

Thermal Properties

Thermal Conductivity

W/m-K

Thermal Resistance

C-in2/W

Thermal of expansion 450 ppm

W/m-K °Cmm2/w 450 ppm

W/m-K °C-in2/W

ASTM D5470 ASTM D5470 TMA

Thermal Cycling 1 Hour at -50°C and 1 Hour at 150°C

Time

Peel Adhesion Voltage Breakdown

Cycles

PLI N/cm
6000

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Datasheet ID: CPU .005" 12" X 12" 521727