Part No. 96-080M80 - QFP to PGA Adapter for EIAJ 80 Position, Pitch
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96-080M80 (pdf) |
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Part No. 96-080M80 - QFP to PGA Adapter for EIAJ 80 Position, Pitch FEATURES • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact. • Consult factory for panelized form or for mounting of consigned chips. SPECIFICATIONS • Adapter body is black FR-4 with 1 ounce minimum Copper traces. • Pads are bare Copper protected with by Enthone or immersion white tin to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling. • Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. • Pin plating is 200µ [5.08µm] min. 93/7 Tin/Lead per MILP-81728 over 100µ [2.54µm] min. Nickel per QQ-N-290. • Operating temperature=221°F [105°C]. MOUNTING CONSIDERATIONS • Suggested PCB hole size=.028 ± ± dia. • Will plug into standard PGA sockets. ALL DIMENSIONS INCHES [MILLIMETERS] Row-to-row Pin-to-pin All others: Tolerances: ± [± ± [± non-cumulative ± unless otherwise specified Note Aries specializes in custom design and production. In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. Aries reserves the right to change product specifications without notice. ORDERING INFORMATION Specify Part No. 96-080M80 -or- 96-080M80-P for panelized form when ordering Specify Part Number 80-PGM13070-30 for wire wrap PGA socket X-RAY VIEW TOP SIDE QFP PAD ASSIGNMENT TOP QFP SIDE NORTH AMERICA Frenchtown, NJ USA TEL 908 996-6841 FAX 908 996-3891 UK/IRELAND/GB TEL +44 870 240 0249 FAX +44 1653 600493 EUROPE/MAINLAND/HOLLAND TEL +31 78 615 94 65 FAX +31 78 615 43 11 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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