10124806-01113LF
10124806-01113LF Datasheet
10124677
| Part | Datasheet |
|---|---|
10124806-01113LF |
10124806-01113LF (pdf) |
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|---|---|
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10124677-2421H06LF |
10124806-01105LF |
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10124806-01416LF |
10124806-01416LF |
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10124806-01116LF |
| PDF Datasheet Preview |
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| BOARD/WIRE-TO-BOARD CONNECTORS DDR4 MEMORY MODULE SOCKETS OVERVIEW Vertical DDR4 DIMM sockets from FCI provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. The low-resistance contacts also support the use of RDIMM registered DIMM , which helps to further reduce power consumption in datacenter hardware such as servers, storage and networking equipment. The low 2.4mm module seating plane and slim ejector designs reduce the overall profile of the connector and installed module to help optimize airflow. Surface-mount SMT , plated-through-hole PTH solder, and press-fit PF connector termination options are offered. • Sockets provide mechanical voltage keying and end latches for module retention and ejection • Low insertion-force design requires less than 24 pounds force for module installation • Available solder tail options support use on 1.6mm or 2.4mm thick motherboards • Press-fit termination option supports use on 1.6mm min. host-PCBs • Contact design protects against stubbing and supports high-speed serial differential signaling at data rates extending to 3.2Gb/s for DDR4 • Low contact resistance supports RDIMM modules • Slim latch design optimizes airflow • RoHS-Compliant and lead-free process-compatible options aid compliance with lead elimination initiatives TARGET MARKETS/APPLICATIONS • Data • Servers • Storage Systems • Supercomputers • Workstations • Desktop PCs • Communications • Switches • Routers • Wireless Infrastructure • Industrial • Embedded Systems DDR4 MEMORY MODULE SOCKETS TECHNICAL INFORMATION MATERIALS • Contact Copper alloy • Contact finish: • Contact area 15uin. , 20uin. or 30uin. Gold, 30uin. GXT or Gold flash over nickel • Termination area Tin over nickel • Forklock Copper alloy • Housing High temperature thermoplastic, UL94V-0 • Ejector High performance thermoplastic, UL94V-0 ELECTRICAL PERFORMANCE • Contact resistance d 10mΩ initial, d 10mΩ increase after environmental test • Current rating 0.75A/contact De-rated with d 30 °C temperature rise above ambient PART NUMBERS MECHANICAL PERFORMANCE • Durability 25 cycles SPECIFICATIONS • FCI • Product specification GS-12-1092 • Packaging specification GS-14-2267 • JEDEC • Module Outline MO-309 • Socket Outlines • PTH solder SO-016 • Surface-mount SO-017 • Press-fit SO-019 PACKAGING • Tray APPROVALS & CERTIFICATIONS • UL and CSA approvals pending Type Color Options Part References Surface Mount SMT termination Housing Black with forklocks or solder tabs |
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