U99-C056-XXXX 56 POSITION
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U99-C056-200T (pdf) |
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CFP4 Series Connector Product Specification S6099C Rev About Amphenol Commercial Products Amphenol’s commercial connector products are used in a variety of end user applications including networking, telecom, server & computer, storage & HDD, consumer electronics and entertainment, professional audio & Industrial & Military/Aerospace. Related Products QSFP+ U99-C056-XXXX 56 POSITION CFP4 SERIES CONNECTOR 38 POSITION CONNECTOR THRU THE BEZEL CAGE ASSEMBLY WITH HEAT SINK 1x3 BEHIND THE BEZEL CAGE ASSEMBLY WITH HEAT SINK AND LIGHT PIPES Overview This short form Product Specification defines the general use and performance parameters for Amphenol’s CFP4 series connector. The interconnect system comprises a 56 position mm pitch connector designed to be compatible with the 100G Form factor Pluggable CFP Multi-source Agreement. Usage The connector system is capable of data rates up to 25 Gbps per channel up to 4 channels with resonance dampening for improved signal integrity 56 position connector . Intended for use in high speed serial interconnect applications such as: • Clusters • Servers • Storage devices CAGE AND CONNECTOR ASSEMBLY WITH ROUND PIN HEAT SINK AND ELASTOMER GASKET General Requirements Connectors are tape and reel packaged for robotic pick-and-place. S6099C Rev About Amphenol Commercial Products Amphenol’s commercial connector products are used in a variety of end user applications including networking, telecom, server & computer, storage & HDD, consumer electronics and entertainment, professional audio & Industrial & Military/Aerospace. Related Products QSFP+ 38 POSITION CONNECTOR THRU THE BEZEL CAGE ASSEMBLY WITH HEAT SINK 1x3 BEHIND THE BEZEL CAGE ASSEMBLY WITH HEAT SINK AND LIGHT PIPES Connector Electrical Characteristics Operating Voltage 3.3V Operating Current 1.87A Connector Mechanical Characteristics Maximum Insertion Force without heat sink 60 N Maximum Withdrawal Force without heat sink 50 N Durability 200 mating cycles Material Requirements Unless otherwise specified, the materials for each component shall be: • Contacts o Base material Phosphor Bronze o Contact Normal Force 50g nominal o Plating • Mating area 15 or 30 microinches or µm min Gold over 50 µin µm min Nickel • Solder tails 100 microinches µm min Matte Tin, over 50 µin µm min Nickel • Housings Black color, glass-reinforced, lead-free solder reflow process compatible thermoplastic, UL94V-0 rated |
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