MAX23NG
MAX23NG Datasheet
NEED HIGHER PERFORMANCE? Aavid Thermalloy also offers the Max Clip SystemTM for discrete power semiconductors featuring simple assembly and high reliability.
| Part | Datasheet |
|---|---|
MAX23NG |
MAX23NG (pdf) |
| Related Parts | Information |
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563202D00000G |
563202D00000G |
502403B00000 |
502403B00000 |
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2281B |
2281B |
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519703B00000G |
519703B00000G |
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568115B00000 |
568115B00000 |
500503B00000G |
500503B00000G |
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2333B |
2333B |
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520103B00000G |
520103B00000G |
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1116BG |
1116BG |
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519803B00000G |
519803B00000G |
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6261B-MT5G |
6261B-MT5G |
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6382BG |
6382BG |
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2285B |
2285B |
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B-375-120-62G |
B-375-120-62G |
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116600F00000 |
116600F00000 |
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4804 REV D-G |
4804 REV D-G |
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4804M REV D-G |
4804M REV D-G |
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8223-CL03 |
8223-CL03 |
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115600F00000 |
115600F00000 |
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115900F00000 |
115900F00000 |
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4804S REV D-G |
4804S REV D-G |
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116100F00000 |
116100F00000 |
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MAX15NG |
MAX15NG |
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115100F00000G |
115100F00000G |
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110500F00000G |
110500F00000G |
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7701G |
7701G |
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MAX04-HNG |
MAX04-HNG |
8909NBG |
8909NBG |
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7721-12N |
7721-12N |
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MAX11NG |
MAX11NG |
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115200F00000G |
115200F00000G |
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CLP-214G |
CLP-214G |
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1130B |
1130B |
TV-4G |
TV-4G |
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6230B-TTG |
6230B-TTG |
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576802B00000 W/TAB038326 |
576802B00000 W/TAB038326 |
576203B00000G |
576203B00000G |
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6273B |
6273B |
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575502B00000G |
575502B00000G |
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575400B00000G |
575400B00000G |
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591302B04000G |
591302B04000G |
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501000B00000G |
501000B00000G |
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574802B00000G |
574802B00000G |
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592502B00000G |
592502B00000G |
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335314B00000G |
335314B00000G |
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508600B00000G |
508600B00000G |
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6109BG |
6109BG |
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7129DG |
7129DG |
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566902B04000G |
566902B04000G |
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7024BG |
7024BG |
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574402B00000G |
574402B00000G |
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573902B03900G |
573902B03900G |
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6271B |
6271B |
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575300B00000G |
575300B00000G |
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513101B00000 |
513101B00000 |
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513002B00000 |
513002B00000 |
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566902B00000G |
566902B00000G |
7717-30N |
7717-30N |
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7717-79NG |
7717-79NG |
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7717-175NG |
7717-175NG |
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7717-19N |
7717-19N |
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7717-30DAP |
7717-30DAP |
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7717-6DAP |
7717-6DAP |
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56-77-2G |
56-77-2G |
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7717-245N |
7717-245N |
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7717-129DAP |
7717-129DAP |
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7717-44DAPG |
7717-44DAPG |
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7717-86DAPG |
7717-86DAPG |
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7717-26DAPG |
7717-26DAPG |
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7717-114N |
7717-114N |
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7717-10DAP |
7717-10DAP |
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7717-156NG |
7717-156NG |
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7717-46DAP |
7717-46DAP |
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7717-149N |
7717-149N |
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7717-239N |
7717-239N |
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7717-15NG |
7717-15NG |
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7717-152N |
7717-152N |
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7717-8NG |
7717-8NG |
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7717-44NG |
7717-44NG |
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7717-155N |
7717-155N |
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7717-133DAP |
7717-133DAP |
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7717-8DAPG |
7717-8DAPG |
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7717-6N |
7717-6N |
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7717-4NG |
7717-4NG |
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7717-139N |
7717-139N |
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7717-46N |
7717-46N |
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7717-79DAP |
7717-79DAP |
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7717-86NG |
7717-86NG |
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7717-7NG |
7717-7NG |
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7717-122DAPG |
7717-122DAPG |
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56-02-10 |
56-02-10 |
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7717-89DAPG |
7717-89DAPG |
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56-77-20G |
56-77-20G |
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7717-3DAPG |
7717-3DAPG |
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7717-89NG |
7717-89NG |
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7717-15DAPG |
7717-15DAPG |
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56-02-93 |
56-02-93 |
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43-18-1G |
43-18-1G |
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7717-43DAP |
7717-43DAP |
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7717-18DAPG |
7717-18DAPG |
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43-05-2G |
43-05-2G |
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56-02-20 |
56-02-20 |
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43-02-4G |
43-02-4G |
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7717-112DAP |
7717-112DAP |
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7717-94N |
7717-94N |
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43-05-1G |
43-05-1G |
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7717-5DAPG |
7717-5DAPG |
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7717-149DAP |
7717-149DAP |
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7717-130NG |
7717-130NG |
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7717-153N |
7717-153N |
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56-77-9G |
56-77-9G |
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7717-3NG |
7717-3NG |
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568403B00000 |
568403B00000 |
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321127B00000 |
321127B00000 |
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2268B |
2268B |
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2207/PR11B ASSY |
2207/PR11B ASSY |
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2207/PR11B-2 ASSYG |
2207/PR11B-2 ASSYG |
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622851F00000 |
622851F00000 |
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2240B ASSY |
2240B ASSY |
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782653B01000G |
782653B01000G |
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2321BG |
2321BG |
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2342B |
2342B |
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6260B-MT5 |
6260B-MT5 |
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567103B00000 |
567103B00000 |
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553003B00000 |
553003B00000 |
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560700B00000 |
560700B00000 |
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529901B00000 |
529901B00000 |
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508222B00000 |
508222B00000 |
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6381BG |
6381BG |
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506003B01300 |
506003B01300 |
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530801B05100G |
530801B05100G |
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550202D00000G |
550202D00000G |
502303B00000 |
502303B00000 |
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579003B00000G |
579003B00000G |
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505303B00000G |
505303B00000G |
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576303B00000G |
576303B00000G |
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2332BG |
2332BG |
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500303B00000G |
500303B00000G |
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2334BG |
2334BG |
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6032DG |
6032DG |
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530001B00000 |
530001B00000 |
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533701B02552G |
533701B02552G |
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529801B02100G |
529801B02100G |
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580300B00000G |
580300B00000G |
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335214B00000G |
335214B00000G |
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513101B02500G |
513101B02500G |
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2328BG |
2328BG |
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530614B05300G |
530614B05300G |
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529902B00000 |
529902B00000 |
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550302B00000 |
550302B00000 |
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7106D/TRG |
7106D/TRG |
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6239BG |
6239BG |
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6399B-P2G |
6399B-P2G |
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533202B02500G |
533202B02500G |
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533201B02500G |
533201B02500G |
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550102B00000 |
550102B00000 |
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335814B00000G |
335814B00000G |
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550402B00000 |
550402B00000 |
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574802B03700G |
574802B03700G |
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513302B02500G |
513302B02500G |
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533002B02500G |
533002B02500G |
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529801B00000 |
529801B00000 |
581102B00000 |
581102B00000 |
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532602B00000 |
532602B00000 |
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566102B00000G |
566102B00000G |
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6000DG |
6000DG |
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580100W00000G |
580100W00000G |
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7130DG |
7130DG |
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533522B02552G |
533522B02552G |
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533302B02551G |
533302B02551G |
502203B00000 |
502203B00000 |
566010B02800G |
566010B02800G |
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581002B02100G |
581002B02100G |
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6045B |
6045B |
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335314B00032G |
335314B00032G |
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533402B02500G |
533402B02500G |
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7021B-MT6G |
7021B-MT6G |
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552703B00000 |
552703B00000 |
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6038DG |
6038DG |
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6232B-MTG |
6232B-MTG |
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335214B00032G |
335214B00032G |
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533722B02552G |
533722B02552G |
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552844B00000 |
552844B00000 |
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552803B00000G |
552803B00000G |
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584000B03300G |
584000B03300G |
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533602B02500G |
533602B02500G |
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533202B02551G |
533202B02551G |
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530802B05100G |
530802B05100G |
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325705R00000G |
325705R00000G |
7717-5NG |
7717-5NG |
7717-7DAPG |
7717-7DAPG |
7717-18NG |
7717-18NG |
534302B03553G |
534302B03553G |
6230DG (COPPER) |
6230DG (COPPER) |
504222B00000G |
504222B00000G |
7109D/TRG |
7109D/TRG |
576802B03700G |
576802B03700G |
7106DG |
7106DG |
501100B00000G |
501100B00000G |
591302B02800G |
591302B02800G |
529802B00000 |
529802B00000 |
320205B00000G |
320205B00000G |
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568300B00000 |
568300B00000 |
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2227B |
2227B |
7721-10PPSG |
7721-10PPSG |
7721-15NG |
7721-15NG |
7721-3PPSG |
7721-3PPSG |
7721-6PPSG |
7721-6PPSG |
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7721-13NG |
7721-13NG |
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7721-11NG |
7721-11NG |
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7717-21DAPG |
7717-21DAPG |
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7717-107DAP |
7717-107DAP |
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7717-156DAPG |
7717-156DAPG |
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7717-175DAPG |
7717-175DAPG |
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B-470-235-40 |
B-470-235-40 |
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43-02-37G |
43-02-37G |
118300F00000G |
118300F00000G |
MAX09NG |
MAX09NG |
MAX01NG |
MAX01NG |
MAX07NG |
MAX07NG |
7721-7PPSG |
7721-7PPSG |
4880G |
4880G |
4880MG |
4880MG |
125800D00000G |
125800D00000G |
125700D00000G |
125700D00000G |
115000F00000G |
115000F00000G |
4880SG |
4880SG |
MAX13NG |
MAX13NG |
MAX08NG |
MAX08NG |
116200F00000G |
116200F00000G |
MAX04NG |
MAX04NG |
115300F00000G |
115300F00000G |
MAX12NG |
MAX12NG |
CLP-212G |
CLP-212G |
MAX03-HNG |
MAX03-HNG |
MAX01-HNG |
MAX01-HNG |
MAX02-HNG |
MAX02-HNG |
MAX10NG |
MAX10NG |
MAX02NG |
MAX02NG |
MAX03NG |
MAX03NG |
| PDF Datasheet Preview |
|---|
| TABLE OF CONTENTS Table of Contents General Information How to Use This Standard Part Index by Part 3 Index by Device and Thermal Index by Style and Thermal How to Select a Heat How to Read a Thermal Board Mounted Heat Sinks Heat Sinks for IC Packages Surface Mount Discrete Semiconductor Packages 24 SMT 26 Thru-Hole Discrete Semiconductor Packages TO-220 and TO-220, TO-218, and TO-220 and 59 TO-220, TO-218, TO-247, and 62 65 68 74 Axial Lead Bridge 77 Options Table of How to Decipher an Aavid 12 Digit Part 80 How to Decipher a "Thermalloy" Origin Part Index A, B, C = Aavid Standard Parts Index D = "Thermalloy" Origin Parts 85 Interface Materials In-Sil , Kondux , 86 Alignment 87 Double Sided Tape Options Factory 88 Labor Saving Heat Sink to Board and Semiconductor Mounts Wave-On Mounts, Semiconductor Mounts, Shur-Lock Tabs, Solderable Tabs, Solderable Nuts, Clinch Nuts, Solderable Studs, Device Mounting Clips 97 Thermal Accessories Mounting 99 Insulating Shoulder 100 and Thermalfilm and Thermasil Insulating Washers/Aluminum Insulating Stanchion 105 Insulating Mounting 110 Card Ejectors & 111 Thermal Greases and AMERICA USA Tel +1 603 224-9988 email: ASIA Singapore Tel +65 6362 8388 email: EUROPE Italy Tel +39 051 764011 email: Taiwan Tel +886 2 2698-9888 email: United Kingdom Tel +44 1793 401400 email: GENERAL INFORMATION Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to How to Use This Catalog Base part number Semiconductor device Style description for heat sink TO-220 Heat Sinks 7022 Channel style heat sink with folded back fins Semiconductor devices have been included in photos to assist in determining mounting position. Thermal graphs show natural and forced convection based on black anodize finish. For information on how to use a thermal graph, please refer to page Icons indicate that a mounting kit, grease or epoxy can be used with the heat sink Grease Epo& xy page112 Mounting Kits page 99 Mechanical drawing dimensions as shown are mm inches Detailed description illustrates the heat sink’s differentiating features. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Ordering information will specify the base heat sink with available accessories. ORDERING INFORMATION Part Number 7022BG 7022PBG 7022B-MTG 7022PB-MTG Description Channel heat sink with folded back fins Channel heat sink with folded back fins With solderable tabs With solderable tabs Finish Black anodize Pre-black anodize* Black anodize Pre-black anodize* Dia of PCB Plated Thru Hole for Tabs * Edges cut during the manufacturing process will be unfinished. See page XX for more information POPULAR OPTIONS 7022B- Base part no. A RoHS Compliant Position Code Description Location TC11-MT Insulated device mounting clip for T0-220 and solderable tabs Hole X Details Page For additional options see page xx Material and finish information is shown for each part Material Thick Aluminum Finish See Table Aavid has a large selection of popular options to enhance your heat sink selection. This section will indicate the most popular options available. Detailed indexes are available to select additional options. AMERICA USA Tel +1 603 224-9988 email: ASIA Singapore Tel +65 6362 8388 email: EUROPE Italy Tel +39 051 764011 email: Taiwan Tel +886 2 2698-9888 email: United Kingdom Tel +44 1793 401400 email: INDEX 10-5597-02G 10-5597-22G 10-5597-33G 10-5607-04G 10-5607-05G 10-5634-01G 10-6326-27G 10-6326-28G 10-6327-01G 10-BRD1-01G 10-BRD1-03G 10-BRD1-04G 10-BRD1-05G 10-BRD1-07G 10-BRD2-01G 10-CLS1-01G ORDERING INFORMATION IC Pkg Size mm IC Pkg Style 23 x 23 23 x 23 23 x 23 27 x 27 27 x 27 27 x 27 35 x 35 Flip chip 35 x 35 Flip chip 35 x 35 35 x 35 35 x 35 Flip chip Flip chip Flip chip Flip chip Flip chip Flip chip 40 x 40 40 x 40 42 x 40 Flip chip Flip chip Part Number “W” mm 374024B60023G 374124B60023G 374224B60023G 374324B60023G 374424B60023G 374524B60023G 10-5634-01G 10-THMA-01G 374624B60024G 374724B60024G 374824B60024G 10-BRD2-01G 10-BRD1-01G 10-BRD1-03G ORDERING INFORMATION IC Pkg. Size mm 28 x 28 x 28 x 28 35 x 35 x 45 x 45 x 45 x 45 Part Number “W” mm 10-6326-27G 10-6326-28G 10-6327-01G 10-TNT2-01G 10-5597-02G 10-5597-22G 10-5597-33G 10-5607-04G 10-5607-05G 372924M02000G 10-L4LB-03G 10-L4LB-05G 10-L4LB-11G “L” mm “H” mm “S” mm “T” mm Push pin mechanical drawings and board mounting drawings see page 15 Natural convection thermal resistance based on a 75° C heat sink temperature rise. Forced convection thermal resistance based on an entering m/s 200LFM airflow. Finish Black anodize Black anodize Black anodize Black anodize Green anodize Gold anodize Gold anodize Black anodize Black anodize Green anodize Black anodize Black anodize Black anodize Fig. PCB Fig.1 Pin Style Pad Plastic Brass Plastic Plastic Plastic Plastic Brass Plastic Brass Plastic Plastic Brass Plastic AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ORDERING INFORMATION IC Pkg. Size mm IC Pkg. Style 10 x 10 Plastic 15 x 15 Plastic 23 x 23 Plastic 23 x 23 Plastic 23 x 23 Plastic 25 x 25 Plastic 27 x 27 Plastic 27 x 27 Plastic 27 x 27 Plastic 28 x 28 Plastic 28 x 28 Plastic 31 x 31 Plastic 35 x 35 Plastic 35 x 35 Plastic 35 x 35 Plastic 35 x 35 Plastic 35 x 35 Plastic 40 x 40 Plastic 40 x 40 Plastic 40 x 40 ORDERING INFORMATION IC Pkg. Size mm IC Pkg. Style 10 x 10 Metal / Ceramic 23 x 23 Metal / Ceramic 23 x 23 Metal / Ceramic 23 x 23 Metal / Ceramic 25 x 25 Metal / Ceramic 27 x 27 Metal / Ceramic 27 x 27 Metal / Ceramic 27 x 27 Metal / Ceramic 27 x 27 Metal / Ceramic 28 x 28 Metal / Ceramic 28 x 28 Metal / Ceramic 28 x 28 Metal / Ceramic 31 x 31 Metal / Ceramic 31 x 31 Metal / Ceramic Metal / Ceramic 35 x 35 Metal / Ceramic 35 x 35 Metal / Ceramic 35 x 35 Metal / Ceramic 35 x 35 Metal / Ceramic 35 x 35 Metal / Ceramic ORDERING INFORMATION IC Pkg. Size mm 27 x 27 35 x 35 x Part Number 2317B-EP11-BGS1G 2518B-EP11-BGS2G 2519B-EP11-BGS5G 2520B-EP04-BGS5G 2522B-EP04-BGS5G “W” mm “L” mm “H” mm IC Pkg. Style All Natural convection thermal resistance based on a 75° C heat sink temperature rise. Forced convection thermal resistance based on an entering m/s 200LFM airflow. Interface Clip EP11 BGS1 EP11 BGS2 EP11 BGS5 EP04 BGS5 EP04 BGS5 THERMALCOTETM GREASE TAPE TYPE AND INTERFACE MATERIAL INFORMATION Material EP11 EP04 Description ThermalcoteTM grease with release liner ThermalcoteTM grease with release liner Adhesive None Thermal Resistance Color White For more information on ThermalcoteTM see page Carrier None PULL TAB "D" “D” Dim “E” Dim AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: HEAT SINKS FOR IC PACKAGES Bi Directional BGA Bi Directional Designed for applications with airflow traveling in a single direction, these heat sinks are suitable for a variety of standard square IC packages. Models are available with pre-applied thermal tape for easy attachment to the IC. Epoxy attach models are also available. ORDERING INFORMATION IC Pkg Size IC Pkg Style 10 X 10 615653B00250G 10 X 10 709203B00400G 24 X 24 Metal 335114B00032G 25 X 25 Metal 335214B00032G 25 X 25 Metal 335211B00032G 25 X 25 25 X 25 25 X 25 Plastic 335214B00034G 27 X 27 Plastic 335314B00035G 27 X 27 Metal 335314B00032G 27 X 27 28 X 28 700353U01100G 30 X 30 30 X 30 30 X 30 Metal 335814B00032G 30 X 30 Metal 335714B00032G 799403B01500G “W” mm “L” mm “H” mm ORDERING INFORMATION Finish Black anodize Black anodize with black paint on bottom side 5010 Angle fin heat sink Angle fin heat sink is a simple low cost solution for cooling DIP devices. Suitable for 14 and 16 pin packages and available in two finish options. Easily attaches using thermal epoxy. 0 100 Air Per Minute 200 400 600 800 Heat 1000 100 ORDERING INFORMATION Finish Pre black anodize* Black anodize * Edges cut during the manufacturing process will be unfinished. See page 110 for more information. 5602, 5802 Slide on heat sink with angled fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to LOCKING CATCH Material Thick Aluminum Finish See Table Grease Epo& xy page112 Material Thick Aluminum Finish See Table Slide on heat sink with angled fins attaches to 14 and 16 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Part Number Device Pkg Style Ceramic Ceramic Plastic Plastic Finish Black anodize Black anodize with black paint on bottom side Black anodize Black anodize with black paint on bottom side “A” Dim Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to LOCKING CATCH Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5806 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to 28 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Description Slide on heat sink with staggered fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to DIPS LOCKING CATCH Material Thick Aluminum Finish Black Anodize 5803 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to 18 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Slide on heat sink with staggered fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to LOCKING CATCH Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES DIPS 5804 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to 20 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Slide on heat sink with staggered fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to LOCKING CATCH Material Thick Aluminum Finish Black Anodize 5805 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to 24 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Slide on heat sink with staggered fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to LOCKING CATCH Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: 5085, 5086, 5087 Extruded epoxy attach on heat sink with straight fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Extruded epoxy attach on heat sink with straight fins attaches to 24, 28, and 40 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. ORDERING INFORMATION Part Number DIP Package “A” Dim 24 pin 28 pin 40 pin For epoxy information see pages 0 100 0 508700 508600 508500 Air Per Minute 200 400 600 800 Heat 1000 20 6284 Extruded epoxy attach heat sink DIPS Grease Epo& xy page112 "A" Material Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 0 100 Extruded epoxy attach heat sink which requires no additional board space is suitable for narrow DIP packages. May be added before or after final board assembly. No additional board space is required. Attaches to 28 pin DIP. ORDERING INFORMATION Part Number 6284BG Description Extruded epoxy attach heat sink for 28 pin DIP For epoxy information see pages Air Per Minute 200 400 600 800 Heat 1000 25 5011, 5012 Extruded epoxy attach heat sink with straight fins Material Aluminum Finish Black Anodize Grease Epo& xy page112 FIGURE A Extruded epoxy attach heat sink with straight fins attaches to 14 and 16 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. Available in two fin directions. ORDERING INFORMATION Figure Extruded epoxy attach heat sink with straight fins A Extruded epoxy attach heat sink with straight fins B For epoxy information see pages FIGURE B Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Aluminum Finish Black Anodize 0 100 501100 501200 Air Per Minute 200 400 600 800 Heat 1000 100 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5731 Surface mount heat sink for D-PAK TO-252 package semiconductors THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Surface mount heat sink for D-PAK TO-252 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. ORDERING INFORMATION Packaging 573100D00010G 13" Reel, 250 per reel Bulk, 500 per bag See page 25 for tape and reel information 0 100 Air Per Minute 200 400 600 800 Heat 1000 25 Case Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Copper Finish Tin Plated Refer to Figure A and B on page 26 for board footprint information 5733 Surface mount heat sink for D2 PAK TO-263 package semiconductors Surface mount heat sink for D2 PAK TO-263 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. ORDERING INFORMATION Part Number 573300D00010G Packaging 13" Reel, 250 per reel Bulk, 500 per bag See page 25 for tape and reel information Air Per Minute 200 400 600 800 Heat 1000 20 16 12 Case Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Copper Finish Tin Plated Refer to Figure A and B on page 26 for board footprint information 7106 Surface mount heat sink for D2 PAK TO-263 , power SO-10 MO-184 and SO-10 package semiconductors Surface mount heat sink for D2 PAK TO-263 , power SO-10 MO-184 and SO-10 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. ORDERING INFORMATION Part Number Packaging 7106D/TRG 13" Reel, 200 per reel 7106DG Bulk, 500 per bag See page 25 for tape and reel information 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Copper Finish Tin Plated Refer to Figure C on page 26 for board footprint information AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7109 Surface mount heat sink for D2 PAK TO-263 package semiconductors Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Surface mount heat sink for D2 PAK TO-263 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. ORDERING INFORMATION Packaging 7109D/TRG 13" Reel, 125 per reel 7109DG Bulk, 500 per bag See below for tape and reel information 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 5734 Surface mount heat sink for D3 PAK TO-268 package semiconductors Refer to Figure D on page 26 for board footprint information Material Thick Copper Finish Tin Plated Surface mount heat sink for D3 PAK TO-268 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. ORDERING INFORMATION Part Number 573400D00010G Packaging 13" Reel, 250 per reel Bulk, 500 per bag See below for tape and reel information Tape and Reel information Air Per Minute 200 400 600 800 Heat 1000 20 16 12 Case Temp Rise Above Thermal Resistance From MTG Surface to Refer to Figure A and B on page 26 for board footprint information Material Thick Copper Finish Tin Plated ORDERING INFORMATION “A” Dim 7106D/TRG 7109D/TRG 573100D00010G 573300D00010G 573400D00010G “B” Dim “C” Dim “D” Dim AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SMT Footprints FIGURE A Recommended copper heat speader drain pad footprint Note The thickness of the drain pad is variable depending on the amount of heat generated by the SMT device, design limitations and process. Part Number 573100 573300 573400 “L” “W” FIGURE B Recommended heat sink solder mask opening W1 W2 Part Number “L” 573100 573300 573400 “W1” “W2” FIGURE C Recommended copper pad size for heat sink and device mounting footprint FIGURE D Recommended copper pad size for heat sink and device mounting footprint For D Pak TO-263 For MO-184 and SO-10 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ORDERING INFORMATION Part Number Description 7025BG Channel heat sink with no solderable tabs 7025B-MTG With solderable mounting tabs For additional options see page 85 Dia of PCB Plated Thru Hole for Tabs 7019 Narrow channel style heat sink with folded back fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 0 100 Air Per Minute 200 400 600 800 Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Heat ORDERING INFORMATION Part Number 7019BG Finish Channel heat sink with no solderable tabs Black anodize 7019PBG 7019B-MTG Channel heat sink with no solderable tabs Pre black anodize* With solderable tabs Black anodize Dia of PCB Plated Thru Hole for Tabs *Edges cut during the manufacturing process will be unfinished. See page 110 for more information For additional options see page 85 1000 10 2 0 10 7020 Narrow channel style heat sink with folded back fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Aluminum Finish See Table Grease Epo& xy page112 Mounting Kits page 99 Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description 7020BG Narrow channel heat sink with no solderable tabs 7020B-MTG With solderable tabs Dia of PCB Plated Thru Hole for Tabs POPULAR OPTIONS 7020B- G Base part no. A Position Code TC10-MT Insulating device mounting clip and solderable tabs For additional options see page 85 Location Hole X Details Page 93, 98 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to TO-220 Heat Sinks 7021 Channel style heat sink with folded back fins Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 10 ORDERING INFORMATION Dia of PCB Plated Thru Hole for Tabs 7021BG Channel heat sink with no solderable tabs 7021B-MTG With solderable tabs POPULAR OPTIONS 7021B- G Base part no. A Position A Code TC10-MT MT5 MT6 TC10-MT5 Description Locking device mounting clip and solderable tabs Bifurcated tabs with stand off Bifurcated tabs with stand off Locking device mounting clip and bifurcated tabs Location Details Hole X Page 93, 98 Page 93 Page 93 Hole X Page 93, 98 For additional options see page 85 Grease Epo& xy page112 Mounting Kits page 99 Material Thick Aluminum Finish Black Anodize Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 7023 Channel style heat sink with folded back fins Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 10 ORDERING INFORMATION Part Number 7023BG 7023B-MTG Description Channel heat sink with no solderable tabs With solderable tabs Dia of PCB Plated Thru Hole for Tabs POPULAR OPTIONS 7023B- Base part no. A Position Code Description Location Details TC6-MT Locking device mounting clip and solderable tabs Hole X Page 93, 98 TC7-MT Insulating device mounting clip and solderable tabs Hole X Page93, 98 For additional options see page 85 Grease Epo& xy page112 2x THRU Mounting Kits page 99 SECTION A-A Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7022 Channel style heat sink with folded back fins TO-220 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 ORDERING INFORMATION Part Number Description 7022BG Channel heat sink with no solderable tabs 7022PBG Channel heat sink with no solderable tabs 7022B-MTG With solderable tabs 7022PB-MTG With solderable tabs * Edges cut during the manufacturing process will be unfinished. See page 110 for more information Finish Black anodize Pre black anodize* Black anodize Pre black anodize* Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish See Table POPULAR OPTIONS 7022B- G Base part no. A Position Code TC11-MT Insulated device mounting clip for T0-220 and solderable tabs For additional options see page 85 Location Hole X Details Page 93, 98 5510 High performance channel style heat sink with folded back fins Grease Epo& xy page112 Mounting Kits page 99 High performance channel style heat sink with folded back fins for greater cooling capacity in a minimum of space when mounted horizontally. Folded back fin design maximizes surface area without increasing the vertical space required by the heat sink. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number Description High performance channel style heat sink with folded back fins POPULAR OPTIONS 551002B0 00 00G Base part no. A Position A Code 01 6-32 Wave On threaded insert stand off Details Page 89 For additional options see page 82 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to TO-220 Heat Sinks 6021, 6221 Channel style heat sink with straight fins FIGURE A FIGURE B WIDE X LONG SLOT Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink with straight fins features integrated solderable tabs for easy mounting to the printed circuit card. Available with a single device mounting hole or slotted hole to accomodate varying device lead lengths. "B" "A" Material Thick Aluminum Finish See Table 0 100 Air Per Minute 200 400 600 800 1000 10 ORDERING INFORMATION Part Number Description Finish Dia of PCB Heat Plated Thru Figure Hole for Tabs “A” Dim “B” Dim 6021BG Channel heat sink with straight fins and integrated tabs Black anodize 6021PBG Channel heat sink with straight fins and integrated tabs Pre-black anodize* 6221PBG With slotted device mounting hole Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information POPULAR OPTIONS 6021- - G Available on the 6021 only Base part no. A Position Code Description Location Black anodize PB Pre-black anodize* SF1 4-40 UNC-2A device mounting stud Hole X For additional options for part 6021 see page 85 Details Page 96 6230 Copper channel style heat sink with straight fins Grease Epo& xy page112 Mounting Kits page 99 Copper channel style heat sink with straight fins features integrated tabs which can be twisted to attach the heat sink to the board prior to wave solder. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description 6230DG Channel heat sink with straight fins and integrated tabs Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Copper Finish Tin Plated AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TV35 Narrow channel style heat sink features twisted fins TO-220 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number TV35G Description Channel style heat sink with twisted fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 2X THRU Material Thick Aluminum Finish Black Anodize TV46, TV47, TV58 Narrow channel style heat sink features twisted fins Grease Epo& xy page112 Mounting Kits page 99 Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. 0 100 0 TV58 TV46, TV47 Air Velocity Per Minute 200 400 600 800 Heat Dissipated 1000 20 ORDERING INFORMATION Part Number TV46G TV47G TV58G “A” Dim “B” Dim Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU CL “B” Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks TV265, TV1500, TV1505 Channel style heat sink features twisted fins Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above 0 100 0 TV1500 TV1505 Air Per Minute 200 400 600 800 Heat 1000 20 4 0 10 Thermal Resistance From MTG Surface to Channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. Models are available with integrated twist tabs or mounting solderable tabs. Mounting Surface Temp Rise Above 0 100 0 TV 265 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Part Number Description TV265G Channel style heat sink with twisted fins and solderable tabs TV1500G Channel style heat sink with twisted fins TV1505G With integrated twist tabs Figure A B Dia of PCB Plated Thru Hole for Tabs Grease Epo& xy page112 FIGURE A Mounting Kits page 99 FIGURE B TAB TV1505 ONLY Material Thick Aluminum Finish Black Anodize 5900 Channel style heat sink features solderable tabs and twisted fins Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink features solderable tabs and twisted fins for increased air turbulence for better cooling. For ease of assembly use with clip 7701 sold separately to attach device. See page 97 for clip information. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description 5900PBG Channel style heat sink with twisted fins and solderable tabs Dia of PCB Plated Thru Hole for Tabs * Edges cut during the manufacturing process will be unfinished. See page 110 for more information. Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Slots for clip attach Material Thick Aluminum Finish Pre Black Anodize* AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TO-220 Heat Sinks 5929, 5930 Channel style heat sink featuring twisted fins Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink features twisted fins for increased air turbulence for better cooling. Two heights are available and include wave solderable tin plated tabs for easy attachment to the PC board. 0 100 0 593002 592902 Air Per Minute 200 400 600 800 Heat 1000 20 4 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU ORDERING INFORMATION Part Number 592902B03400G “A” Dim 593002B03400G Dia of PCB Plated Thru Hole for Tabs POPULAR OPTIONS 59 _ 02B034 00G Base part no. Position Code Description Location Details 05 4-40 male semiconductor mount LG Hole X Page 90 For additional options see page 82 5630, 5766 Channel style heat sink featuring three integrated tabs Channel style heat sink features three integrated tabs for greater stability and slotted mounting hole to accommodate a variety of device lead lengths. Available in two heights. Mounting tabs are designed for either soldering tin finish or twisted. 0 100 0 563002 576602 ORDERING INFORMATION “A” Dim Finish Black anodize Tin plated Black anodize Tin plated Dia of PCB Plated Thru Hole for Tabs Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to "X" "A" Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 Material Thick Aluminum Finish See Table 5750 Channel style heat sink with two integrated tabs Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink features two integrated tabs and slotted mounting hole to accommodate a variety of device lead lengths. Mounting tabs are designed for either soldering tin finish or twisted. ORDERING INFORMATION Finish Black anodize Tin plated Dia of PCB Plated Thru Hole for Tabs 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5901 Channel style heat sink featuring recessed lower fins Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink features recessed lower fins to allow closer component spacing and longer upper fins for maximum cooling. Includes two solderable tabs for easy attachment to the PC card. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number Description 590102B03600G High performance heat sink with recessed lower fins Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to x SLOT Material Thick Aluminum Finish Black Anodize For additional options see page 82 5903 Channel style heat sink featuring slotted mounting hole Grease Epo& xy page112 Mounting Kits page 99 0 100 Air Per Minute 200 400 600 800 1000 10 Channel style heat sink features slotted mounting hole to accommodate a variety of devices and lead lengths. Includes two solder- Heat able tabs for easy attachment to the PC card. ORDERING INFORMATION Part Number Description 590302B03600G High performance heat sink with solderable tabs Dia of PCB Plated Thru Hole for Tabs For additional options see page 82 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Black Anodize 5770, 5771, 5772 Slim low cost channel style heat sink Grease Epo& xy page112 Mounting Kits page 99 Slim low cost channel style heat sink is ideal where space and cost are limited. Available in 3 fin heights with or without solderable mounting tab. 0 100 0 577002 577102 577202 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Part Number 577002B04000G 577102B04000G 577202B04000G Description Slim, low cost channel style heat sink with no solderable tabs With solderable tab Slim, low cost channel style heat sink with no solderable tabs With solderable tab Slim, low cost channel style heat sink with no solderable tabs With solderable tab “A” Dim Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Aluminum Finish Black Anodize POPULAR OPTIONS 577_ _02B 0 4000G Base part no. A Position Code In-Sil-8TM pad For additional options see page 82 Details Page 86 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TO-220 Heat Sinks 6109, 6110 Low cost channel style heat sink featuring integrated alignment tabs Grease Epo& xy page112 Mounting Kits page 99 FIGURE A FIGURE B AT BASE Low cost channel style heat sink features integrated alignment tabs to prevent the device from rotating while applying torque to the mounting hardware. Available in two lengths with a pre-black anodized finish. Material Thick Aluminum Finish Pre-Black Anodize* ORDERING INFORMATION Part Number Description Figure 6109PBG Low cost channel heat sink with device locating tabs A 6110PBG Low cost channel heat sink with device locating tabs B * Edges cut during the manufacturing process will be unfinished. See page 110 for more information POPULAR OPTIONS 61_ _PB - G Position Code Base part no. A Description Solderable mounting tabs For additional options see page 85 Details Page 93 AT BASE Mounting Surface Temp Rise Above 0 100 0 6109 6110 Air Per Minute 200 400 600 800 Heat 1000 20 7178 Copper narrow channel style heat sink with a single integrated tab Grease Epo& xy page112 Mounting Kits page 99 Copper narrow channel style heat sink includes a single integrated tab to allow easy attachment to the PC board. Tin plated finish ensures easy solderability. Mounting Surface Temp Rise Above 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number 7178DG Description Narrow channel copper heat sink Dia of PCB Plated Thru Hole for Tabs Thermal Resistance From MTG Surface to AT BASE Material Thick Copper Finish Tin Plated 7136, 7139 Copper channel style slide on heat sink featuring integrated mounting clip FIGURE A FIGURE B Top is cut away to show detail Copper channel style slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also includes solderable mounting tabs for easy attachment to the PC board. ORDERING INFORMATION Part Number 7136DG 7139DG Description Vertical mount Horizontal mount Figure A B Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Copper Finish Tin Plated 0 100 Air Per Minute 200 400 600 800 7136 7139 Heat 1000 20 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 7128 Copper channel style heat sink with integrated clip Copper channel style heat sink with integrated clip and locking tab for secure attachment to the device. Narrow profile uses less board space. Includes tin plated solderable tabs for easy attachment to the printed circuit card. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Dia of PCB Plated Thru Hole for Tabs 7128DG Slide on channel heat sink with integrated clip and locking tabs Case Temp Rise Above Thermal Resistance From Case to Top is cut away to show detail Material Thick Copper Finish Tin Plated 6038 Channel style heat sink with integrated clip Channel style heat sink with integrated clip and locking tab for secure attachment to the device. Tabs can be bent for mounting. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number Description 6038BG Slide on channel heat sink with integrated clip and locking tabs Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to AT BASE Material Thick Aluminum Finish Black Anodize 7142 Narrow channel style heat sink with integrated clip Narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Device can be mounted horizontally using a single center tab that can be soldered directly to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number 7142DG Description Slide on narrow channel heat sink with integrated clip and locking tabs Dia of PCB Plated Thru Hole for Tabs Case Temp Rise Above Thermal Resistance From Case to Top is cut away to show detail Material Thick Copper Finish Tin Plated AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 6238, 6239 Channel style heat sink with integrated clip Channel style heat sink with integrated clip features strong spring tension and device locking tab to attach device securely to the heat sink. Available with solderable tabs for vertical mount or without tabs for mounting horizontally. "A" B AT BASE ORDERING INFORMATION Part Number 6238BG 6238B-MTG 6239B-MTG Description Channel heat sink with integral clip, no solderable tab With solderable mounting tabs With solderable mounting tabs For additional options see page 85 “A” Dim Dia of PCB Plated Thru Hole for Tabs SECTION B-B Material Thick Aluminum Finish Black Anodize 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 5342 Channel style heat sink with convenient clip FIGURE A “A” CLIP 53 Grease Epo& xy page112 FIGURE B “A” Mounting Kits page 99 Channel style heat sink features a dittin to locate the device and a convenient clip to eliminate the need for mounting hardware. The twisted fins increase cooling efficiency. Available in two solderable mounting tab styles. Can be ordered without the ditton if electrical isolation is required or for mounting tabless packages. Material Thick Aluminum Finish Black Anodize Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to ORDERING INFORMATION Part Number 534202B02853G 534202B03453G 534265B02853G 534265B03453G Description With Shur-LockTM tabs and clip With solderable mounting tabs and clip With Shur-LockTM tabs and clip With solderable mounting tabs and clip Figure A B A B “A” Dim Dia of PCB Plated Thru Hole for Tabs Dia x High Dittin Dia x High Dittin No Dittin No Dittin For additional options see page 82 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TO-220 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7141 Copper narrow channel style heat sink with integrated clip Case Temp Rise Above Thermal Resistance From Case to Copper narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Single center tab can be soldered directly to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number 7141DG Description Narrow channel heat sink with integrated clip Dia of PCB Plated Thru Hole for Tabs 5073 Economy, narrow base, low profile channel style heat sink Top is cut away to show detail Material Thick Copper Finish Tin Plated Grease Epo& xy page112 Mounting Kits page 99 Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with inch centering. When mounted horizontally, the total height of the heat sink is just 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU ORDERING INFORMATION Part Number Finish Black anodize Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information POPULAR OPTIONS 507302 _ 000 00G Base part no. Position Code Description Location 09 Stud x LG For additional options see page 82 Hole X Details Page 96 5041, 5042 Economy, narrow base, low profile channel style heat sink FIGURE A THRU FIGURE B Material Thick Aluminum Finish See Table Grease Epo& xy page112 THRU TYP 2 Mounting Kits page 99 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with tight component spacing. Models are available for single and dual device mounting. ORDERING INFORMATION Part Number Description Figure Economy, narrow base channel style heat sink A For dual devices POPULAR OPTIONS 504_ _2B0 00 00G Base part no. A Position Code Description 01 6-32 Wave On threaded insert stand off For additional options see page 82 Location Hole X Details Page 89 Material Thick Aluminum Finish Black Anodize 0 100 80 Air Per Minute 200 400 600 800 1000 10 504102 504222 Heat AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TV40 Narrow channel style heat sink features twisted fins TO-220 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number TV40G Description Narrow channel style heat sink with twisted fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 2X THRU Material Thick Aluminum Finish Black Anodize 7173 Copper channel style heat sink featuring two integrated tabs Grease Epo& xy page112 Mounting Kits page 99 Copper channel style heat sink features two integrated tabs. The heat sink is tin plated and can be soldered to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number 7173DG Description Copper channel style heat sink Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Copper Finish Tin Plated 6236 Channel style heat sink featuring an integrated device retaining clip Channel style heat sink features an integrated device retaining clip that eliminates the need for attachment hardware. Available in two finish options. ORDERING INFORMATION Part Number 6236BG 6236PBG Finish Black anodize Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 4 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Locking Catch Top is cut away to show detail Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5306, 5307, 5760 Channel style heat sink with wide mounting surface FIGURE A THRU FIGURE B Grease Epo& xy page112 Mounting Kits page 99 THRU 2X Lightweight, low cost channel style heat sink with wide mounting surface and selection of lengths to accept a variety of packages. Models accomodate one or two devices. ORDERING INFORMATION Figure “A” Dim For additional options see page 82 “B” Dim “C” Dim 5779, 5786 Twin channel style heat sink FIGURE A TYP 2 AT BASE Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Black Anodize AT BASE 0 100 Air Per Minute 200 400 600 800 Heat 576012, 530714 or 576014 530613 or 530614 Grease Epo& xy page112 1000 10 8 6 4 2 0 Mounting Kits page 99 THRU TYP 2 FIGURE B THRU TYP 2 Twin channel style heat sink vertically mounts two TO-220 devices to a single heat sink. Center fins increase cooling capacity. Available with integrated twist tabs or staked on solder tabs for easy attachment to the PC board. ORDERING INFORMATION Twin channel style heat sink with integrated tabs 578622B03200G With staked on solderable tabs For additional options see page 82 TYP 2 Figure A B Dia of PCB Plated Thru Hole for Tabs TYP 2 Material Thick Aluminum Finish Black Anodize 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5069, 5070, 5071, 5072 Hat section style heat sink FIGURE A FIGURE B Grease Epo& xy page112 Mounting Kits page 99 THRU TYP 2 Hat section style heat sinks are low profile and perfect for use on printed circuit cards with inch centering between boards. For higher power applications the 5071 hat can be added to the 5070 or 5072 for double sided cooling of a TO-220 device. ORDERING INFORMATION Description Hat section heat sink Wide hat section heat sink Hat section heat sink with cut out Dual device hat section heat sink Figure A C B POPULAR OPTIONS 50_ _ _2B 0 0000G Base part no. A Position Code Details Kon DuxTM pad Page 86 For additional options see page 82 “A” Dim THRU Material Thick Aluminum Finish Black Anodize FIGURE C 0 100 Air Per Minute 200 400 600 800 507222 Heat 507222 with 507102 attached 1000 10 2 0 10 0 100 0 506902 507102 507002 Air Per Minute 200 400 600 800 Heat 1000 10 7137, 7140 Copper, hat section, slide on heat sink Copper, hat section, slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also included are solderable mounting tabs for easy attachment to the PC card. ORDERING INFORMATION Part Number 7137DG 7140DG Description Vertical mount Horizontal mount Figure A B FIGURE A Dia of PCB Plated Thru Hole for Tabs Top is cut away to show detail Material Thick Copper Finish Tin Plated FIGURE B 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 6237 Hat section style heat sink featuring an integrated clip Hat section style heat sink features an integrated clip for secure attachment to the device without added hardware. Available in two finishes. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 4 0 10 ORDERING INFORMATION Part Number Finish 6237BG Black anodize 6237PBG Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Top is cut away to show detail Material Thick Aluminum Finish See Table 5690 High power, square basket heat sink with folded back fins Grease Epo& xy page112 Mounting Kits page 99 High power, square basket heat sink accommodates two TO-220 devices. Features folded back fins for increased surface area for maximum cooling. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 ORDERING INFORMATION Part Number Description High power, square basket, folded back fin heat sink POPULAR OPTIONS 569022B0 00 00G Base part no. A Position A Code 01 Description Wave On threaded insert, stand off Bd For additional options see page 82 Location Hole X Details Page 89 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to BASE SEE DETAIL "A" THRU TYP 8 SQ. REF TYP 2 TYP 2 TYP 2 TYP 6 TYP 2 DETAIL-A Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5748, 5798, 5799 Clip on style heat sink featuring an integrated clip FIGURE A LOCKING CATCH FIGURE B LOCKING CATCH Clip on style heat sink features an integrated clip to retain the device meaning no mounting hardware is required. Models have fins on both sides, left or right side and are available with solderable tabs for easy attachment to the PC board. Material Thick Aluminum Finish Black Anodize Note Fins on left or right. Right hand side model shown ORDERING INFORMATION Part Number Description Clip on heat sink, left & right side fins, no solderable tabs 574802B03300G Left & right side fins with solderable tabs Left side fin, no solderable tabs 579802B03300G Left side fin with solderable tab Right side fin, no solderable tabs 579902B03300G Right side fin with solderable tab For additional options see page 82 Figure A B Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above 0 100 0 574802 579902 579802 Air Per Minute 200 400 600 800 Heat 1000 20 6043, 6049, 6094 Low cost, clip on style heat sink featuring a locking tab 0 100 Air Per Minute 200 400 600 800 1000 20 Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Low cost, clip on style heat sink features a locking tab to prevent the device from dislodging from 6094 Heat 6049 the heat sink. Also includes slide 6043 runners to ensure proper device alignment. Available in a pre-black anodize finish. ORDERING INFORMATION Part Number “A” Dim 6043PBG 6049PBG 6094PBG “B” Dim “C” Dim *Edges cut during the manufacturing process will be unfinished. See page 110 for more information “D” Dim “E” Dim "B" "C" Material Thick Aluminum Finish Pre-Black Anodize* AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks PF750, PF758 Slip on heat sink featuring integrated tabs Slip on heat sink is tin plated and has integrated tabs for soldering to the PC board. Locating features provide simple device alignment and spring action holds the device for good thermal contact. 0 100 0 PF750 PF758 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Part Number PF750G PF758G Description Slip on heat sink with tabs Slip on heat sink with tabs “A” Dim “B” Dim PF752 Slip on heat sink Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. ORDERING INFORMATION Part Number PF752G Description Slip on heat sink 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Tin Plate Material Thick Aluminum Finish Black Anodize PF720, PF723 Slip on heat sink Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. Available with or without solderable mounting tabs ORDERING INFORMATION Part Number PF720G PF723G Description Slip on heat sink, no solderable tabs With solderable tabs * Edges cut during manufacturing process will be unfinished Mounting Surface Temp Rise Above Heat Dissipated Watts Material Thick Aluminum Finish Pre-Black Paint* AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5744, 5745, 5746, 5749 Low cost, labor saving, slide on heat sink featuring spring action FIGURE A HOLDING TABS DITTIN FIGURE B HOLDING TABS DITTIN Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Available with solder- able tabs for horizontal or vertical mounting to the PC board. ORDERING INFORMATION Part Number 574402B03200G 574502B03300G 574602B03300G 574902B03300G Description Low cost slide on heat sink, no solderable tabs With solderable tabs for horizontal mounting Low cost slide on heat sink, no solderable tabs With solderable tabs for vertical mounting Low cost slide on heat sink , no solderable tabs With solderable tabs for vertical mounting Low cost slide on heat sink , no solderable tabs With solderable tabs for vertical mounting For additional options see page 82 Figure A B Material Thick Aluminum Finish Black Anodize “A” Dim Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above 0 100 0 574402 574502 0 100 Air Per Minute 200 400 600 800 Heat Air Per Minute 200 400 600 800 1000 20 16 12 8 4 0 1000 20 16 Mounting Surface Temp Rise Above 574602 574902 Heat 5741 Low cost, labor saving, slide on heat sink featuring spring action Mounting Kits page 99 Thermal Resistance From MTG Surface to Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Includes a clearance hole in the top side to allow the use of optional hardware to attach device and heat sink to circuit board or other surface. Also available with solderable tabs for vertical mounting to the PC board. Mounting Surface Temp Rise Above 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Dia of PCB Plated Thru Hole for Tabs Low cost slide on heat sink, no solderable tabs 574102B03300G With solderable tabs POPULAR OPTIONS 574102B0 00 00G Base part no. A Position A Code 37 Details Solderable tab with step to limit insertion depth Page 92 For additional options see page 82 Thermal Resistance From MTG Surface to CLEARANCE DITTIN THRU Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5751, 5793, 5794 Snap down style heat sink featuring two side fins FIGURE A FIGURE B LOCKING CATCH Snap down style heat sink features two side fins that act as springs to hold the semiconductor firmly to the heat sink. Models include an integrated clip and device locking catch for more robust applications. Available for both standard and bevel edged TO-220 packages. THRU ORDERING INFORMATION Description Snap down heat sink With integrated clip and locking catch With integrated clip and locking catch for TO-220 with beveled edge For additional options see page 82 Figure A B Material Thick Aluminum Finish Black Anodize View A-A 579302 View A-A 579402 Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above 0 100 0 579302 579402 Air Per Minute 200 400 600 800 Heat 1000 10 Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above 0 100 0 575102 Air Per Minute 200 400 600 800 Heat 1000 20 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: 6225 Space saving staggered fin heat sink TO-220 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION 6225B-MTG Space saving staggered fin heat sink For additional options see page 85 Dia of PCB Plated Thru Hole for Tabs 6032 Copper, space saving staggered fin heat sink Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 Copper, space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description Dia of PCB Plated Thru Hole for Tabs 6032DG Copper space saving staggered fin heat sink 6022 Space saving staggered fin heat sink Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Copper Finish Tin Plated Grease Epo& xy page112 Mounting Kits page 99 Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board. ORDERING INFORMATION Part Number Finish Dia of PCB Plated Thru Hole for Tabs 6022PBG Pre-black anodize* 6022BG Black anodize *Edges cut during the manufacturing process will be unfinished. See page 110 for more information For additional options see page 85 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 6232 Space saving staggered fin heat sink Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs with triangular base for easy attachment to the PC board. ORDERING INFORMATION Finish Dia of PCB Plated Thru Hole for Tabs 6232B-MTG Black anodize 6232PB-MTG Pre-black anodize* *Edges cut during the manufacturing process will be unfinished. See page 110 for more information For additional options see page 85 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 10 6025 Copper, space saving staggered fin heat sink Copper, space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs for easy attachment to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number Description 6025DG Copper, space saving staggered fin heat sink with solderable tabs Dia of PCB Plated Thru Hole for Tabs For additional options see page 85 5932 Space saving twisted fin heat sink Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Grease Epo& xy page112 Mounting Kits page 99 Material Thick Aluminum Finish See Table THRU Grease Epo& xy page112 Mounting Kits page 99 Material Thick Copper Finish Tin Plated Grease Epo& xy page112 Mounting Kits page 99 Space saving twisted fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number 593202B03500G Description Space saving twisted fin heat sink with solderable tabs Dia of PCB Plated Thru Hole for Tabs POPULAR OPTIONS 593202B0 00 00G Base part no. A Position A Code 34 Description Solderable tab for plated thru hole For additional options see page 82 Details Page 92 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU TYP 2 Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5425 Space saving staggered fin heat sink Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs that can be twisted for attachment to the PC board. Heat sink is also available with tin plating for soldering directly to the PC board. ORDERING INFORMATION Finish Black anodize Tin plated For additional options see page 82 Dia of PCB Plated Thru Hole for Tabs 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to TO-220 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 THRU Material Thick Aluminum Finish See Table 5925 Space saving twisted fin heat sink Space savings twisted fin heat sink for vertical mounting TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board. ORDERING INFORMATION Part Number 592502B03400G 592502U03400G Finish Black anodize Unfinished For additional options see page 82 Dia of PCB Plated Thru Hole for Tabs 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Grease Epo& xy page112 Mounting Kits page 99 THRU Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 Heat Sinks 5338, 5339, 5340 Extruded heat sink with radial fins Extruded heat sink with radial fins and channel clip attach feature make device attachment easy. Includes clip and two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights for TO-220 devices. 0 100 533802 534002 533902 ORDERING INFORMATION Part Number 533802B02554G 533902B02554G 534002B02554G “A” Dim For additional options see page 83 Dia of PCB Plated Thru Hole for Pins Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 5326, 5327, 5328 High power extruded heat sink with large radial fins High power extruded heat sink with large radial fins and increased fin count for additional cooling capacity. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights for TO-220 devices. 0 100 0 532602 532702 532802 ORDERING INFORMATION Part Number 532602B02500G 532702B02500G 532802B02500G “A” Dim For additional options see page 83 Dia of PCB Plated Thru Hole for Pins Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Grease Epo& xy page112 HIGH DITTIN SLOT TYP 2 CLIP 54 Material Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 THRU Material Aluminum Finish Black Anodize ML26AA Extruded channel style heat sink featuring serrated fins Extruded channel style heat sink features serrated fins for increased cooling capacity. The base of the heat sink is notched to clear the device leads when mounted horizontally on the printed circuit card. Narrow channel accommodates a TO-220 device. ORDERING INFORMATION Part Number Description ML26AAG Extruded channel style heat sink 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 4 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Grease Epo& xy page112 Mounting Kits page 99 THRU Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-262 Heat Sinks 5912 Plug in style heat sink featuring four spring action clips Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. FIGURE A FIGURE B Material Thick Aluminum Finish Black Anodize ORDERING INFORMATION Plug in style heat sink, no mounting tab 591202B03100G With horizontal mounting tab 591202B04000G With vertical mounting tab For additional options see page 84 Figure A B Dia of PCB Plated Thru Hole for Tabs 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 5913 Plug in style heat sink featuring four spring action clips Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Includes 2 integrated standoffs to steady the heat sink during wave soldering. Available with solderable mounting tabs for vertical mounting to the PC board. FIGURE A FIGURE B Material Thick Aluminum Finish Black Anodize ORDERING INFORMATION Part Number Description Plug in style heat sink with integrated standoffs, no mounting tab 591302B02800G With Shur-LockTM tab for vertical mounting 591302B04000G With tab for vertical mounting For additional options see page 84 Figure B A B Dia of PCB Plated Thru Hole for Tabs 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TO-220 & TO-262 Heat Sinks 5768 Plug in style heat sink featuring four spring action clips FIGURE A FIGURE B THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. Material Thick Aluminum Finish See Table ORDERING INFORMATION Part Number Description Slim plug in heat sink, no mounting tab Slim plug in heat sink, no mounting tab Slim plug in heat sink, no mounting tab 576802B03100G With single tab for horizontal mounting 576802V03100G With single tab for horizontal mounting 576802U03100G With single tab for horizontal mounting 576802B04000G With single tab for vertical mounting 576802V04000G With single tab for vertical mounting 576802U04000G With single tab for vertical mounting For additional options see page 84 Figure A B Finish Black anodize AavSHIELD3 Unfinished Black anodize AavSHIELD3 Unfinished Black anodize AavSHIELD3 Unfinished Dia of PCB Plated Thru Hole for Tabs 0 100 0 576802B 576802V 579602U Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to PF432, PF433, PF434, PF435, PF436 Plug in style heat sink features pre-blackened finish Plug in style heat sink features pre-blackened finish and two spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. FIGURE A FIGURE B Material Thick Aluminum Finish Pre-Black Anodize* ORDERING INFORMATION Part Number Description PF432G Plug in style heat sink with solderable tab, vertical mount PF433G With vertical mount no tab PF434G With solderable tab, horizontal mount PF435G With solderable tab, vertical mount PF436G With solderable tab offset from center, horizontal mount *Edges cut during the manufacturing process will be unfinished. See page 110 for more information Figure A B A C Dim “A” Dia of PCB Plated Thru Hole for Tabs 0 100 FIGURE C Air Per Minute 200 400 600 800 Heat 1000 10 Case Temp Rise Above Thermal Resistance From Case to AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5669 Plug in style heat sink with folded back fins TO-220 & TO-262 Heat Sinks FIGURE A FIGURE B Plug in style heat sink with folded back fins for extra cooling capacity. Features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with or without solderable mounting tabs for both horizontal and vertical mounting to the PC board. ORDERING INFORMATION Part Number Description Plug in style heat sink with no mounting tab 566902B03100G With horizontal mounting tab 566902B04000G With vertical mounting tab For additional options see page 82 Figure A B Dia of PCB Plated Thru Hole for Tabs Material Thick Aluminum Finish Black Anodize 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 TV96, TV97 Hat section heat sink with twisted fins TO-220 & TO-218 & TO-247 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 Hat section heat sink with twisted fins is low profile and perfect for use on circuit cards with spacing. The twisted fins increase air turbulence for better thermal performance. ORDERING INFORMATION Part Number “A” Dim TV96G TV97G 0 100 0 TV96 TV97 Air Per Minute 200 400 600 800 Heat 1000 25 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 Heat Sinks 5301 High rise style heat sink features twisted fins and Wave-OnTM solderable mounts Grease Epo& xy page112 Mounting Kits page 99 BASE PART FIGURE A FIGURE B High rise style heat sink features twisted fins and Wave-OnTM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices. THRU CLIP 50 x HIGH DITTIN CLIP 62 Ø x 2X HIGH DITTIN Material Thick Aluminum Finish Black Anodize Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to ORDERING INFORMATION Part Number Description 530101B00100G Heat sink twisted fin 530101B00150G With device clip #50 530102B00100G Heat sink twisted fin 530102B00150G With device clip #50 530161B00162G With two device clips #62 530162B00162G With two device clips #62 Device Figure “A” Dim TO-218, TO-247 TO-218, TO-247 TO-220 TO-220 Dual TO-218, TO-247 B Dual TO-220 Dia of PCB Plated Thru Hole for Tabs For additional options see page 82 5308 High rise style heat sink features twisted fins and solderable tabs 0 100 Air Per Minute 200 400 600 800 530161 or 530162 530101 or 530102 Heat 1000 5 1 0 20 Grease Epo& xy page112 Mounting Kits page 99 BASE PART FIGURE A FIGURE B High rise style heat sink features twisted fins and solderable tabs for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices. RECOMMENDED HOLE PATTERN THRU 2x CLIP 50 x HIGH DITTIN Material Thick Aluminum Finish Black Anodize CLIP 62 2X HIGH DITTIN Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to ORDERING INFORMATION Part Number Description 530801B05100G Heat sink twisted fin and solderable tabs 530801B05150G With device clip #50 530802B05100G Heat sink twisted fin and solderable tabs 530802B05150G With device clip #50 530861B05162G With two device clips #62 530862B05162G With two device clips #62 For additional options see page 82 Device TO-218, TO-247 TO-218, TO-247 TO-220 TO-220 Dual TO-218, TO-247 Dual TO-220 Figure “A” Dim Dia of PCB Plated Thru Hole for Tabs 0 100 Air Per Minute 200 400 600 800 530861 or 530862 530801 or 530802 Heat 1000 5 1 0 20 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TO-220 & TO-218 & TO-247 Heat Sinks 5304 High rise style heat sink features staggered fins and Wave-OnTM solderable mounts Grease Epo& xy page112 Mounting Kits page 99 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to High rise style heat sink features staggered fins and Wave-OnTM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 ORDERING INFORMATION Part Number 530401B00100G 530401B00150G 530402B00100G 530402B00150G Description High rise style heat sink staggered fins With device clip #50 High rise style heat sink staggered fins With device clip #50 For additional options see page 82 Device TO-218, TO-247 TO-218, TO-247 TO-220 TO-220 “A” Dim Dia of PCB Plated Thru Hole for Tabs 5330, 5331, 5332, 5333 Extruded heat sink with radial fins Mounting Surface Temp Rise Above 0 100 0 53300X 53310X Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Extruded heat sink with radial fins and clip attach feature makes device attachment easy. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218 and TO-247 devices. Mounting Surface Temp Rise Above 0 100 0 53320X 53330X Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number 533001B02551G 533002B02551G 533101B02551G 533102B02551G 533201B02551G 533202B02551G 533301B02551G 533302B02551G Device TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 “A” Dim For additional options see page 83 “B” Dim “C” Dim Dia of PCB Plated Thru Hole for Pins Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to CLIP 50 THRU HIGH DITTIN Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 X HIGH DITTIN NOTCH FOR CLIP 2x CLIP 51 Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 Heat Sinks SW25, SW38, SW50, SW63 Extruded heat sink with unequal channel widths Grease Epo& xy page112 Mounting Kits page 99 0 100 Air Per Minute 200 400 600 800 1000 10 Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Extruded heat sink with unequal channel widths front and back can accommodate a TO-220, TO-218, or TO-247 devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights. Version without hole uses clip 5901 sold separately to attach device. See page 97 for clip information. Mounting Surface Temp Rise Above 0 SW25 SW38 0 100 0 SW50 SW63 ORDERING INFORMATION Part Number SW25-2G SW25-4G SW38-2G SW38-4G SW50-2G SW50-4G SW63-2G SW63-4G Description Extruded heat sink with unequal channel widths front and back With device mounting holes Extruded heat sink with unequal channel widths front and back With device mounting holes Extruded heat sink with unequal channel widths front and back With device mounting holes Extruded heat sink with unequal channel widths front and back With device mounting holes “A” Dim Holes No Dia of PCB Plated Thru Hole for Pins 5297, 5298, 5299, 5300 Extruded heat sink with large radial fins Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to Extruded heat sink with large radial fins features equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218, and TO-247 devices. ORDERING INFORMATION Part Number Device “A” Dim 529701B02500G TO-218, TO-247 529702B02500G TO-220 529801B02500G TO-218, TO-247 529802B02500G TO-220 529901B02500G TO-218, TO-247 529902B02500G TO-220 530001B02500G TO-218, TO-247 530002B02500G TO-220 For additional options see page 83 0 100 Air Per Minute 200 400 600 800 Mounting Surface Temp Rise Above 52970X 52980X Heat 0 100 Air Per Minute 200 400 600 800 Mounting Surface Temp Rise Above 52990X 53000X Heat “B” Dim “C” Dim Dia of PCB Plated Thru Hole for Pins 1000 5 4 3 2 1 0 1000 5 4 3 2 1 0 SEE NOTE 1 NOTE 1 This hole not present in SW25 model Material Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 Heat Sinks 5334, 5335, 5336, 5337 Extruded heat sink with large radial fins ORDERING INFORMATION Device 533401B02552G TO-218, TO-247 533402B02552G TO-220 533421B02552G Dual TO-218, TO-247 533422B02552G Dual TO-220 533501B02552G TO-218, TO-247 533502B02552G TO-220 533521B02552G Dual TO-218, TO-247 533522B02552G Dual TO-220 533601B02552G TO-218, TO-247 533602B02552G TO-220 533621B02552G Dual TO-218, TO-247 533622B02552G Dual TO-220 533701B02552G TO-218, TO-247 533702B02552G TO-220 533721B02552G Dual TO-218, TO-247 533722B02552G Dual TO-220 For additional options see page 83 Description Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 “A” Dim “B” Dim Dia of PCB Plated Thru Hole for Pins AMERICA EUROPE USA Tel +1 603 224-9988 email: ORDERING INFORMATION Part Number BW38-2G BW38-4G BW50-2G BW50-4G BW63-2G BW63-4G Description Extruded heat sink with unequal channel widths front and back With device mounting hole Extruded heat sink with unequal channel widths front and back With device mounting hole Extruded heat sink with unequal channel widths front and back With device mounting hole “A” Dim Dia of PCB Plated Thru Holes Hole for Pins No Yes No Yes No Yes Material Aluminum Finish Black Anodize 5130, 5131, 5132, 5133 Extruded heat sink with radial fins Extruded heat sink with radial fins feature equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220,TO-218, and TO-247 devices. ORDERING INFORMATION Part Number 513001B02500G 513002B02500G 513101B02500G 513102B02500G 513201B02500G 513202B02500G 513301B02500G 513302B02500G Device TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 For additional options see page 83 “A” Dim Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above 0 100 0 51300X 51310X Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above 0 100 80 60 40 20 51320X 51330X “B” Dim Air Per Minute 200 400 600 800 Heat “C” Dim “D” Dim Thermal Resistance From MTG Surface to 1000 5 1 0 10 “E” Dim Dia of PCB Plated Thru Hole for Pins Grease Epo& xy page112 Mounting Kits page 99 "C" "A" Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-202 Heat Sinks 5310, 5311, 5312, 5313 Extruded heat sink with radial fins & notched base Grease Epo& xy page112 Mounting Kits page 99 0 100 ORDERING INFORMATION “A” Dim 531002B02500G 531002V02500G 531102B02500G 531102V02500G 531202B02500G 531202V02500G 531302B02500G 531302V02500G Finish Black anodize AavSHIELD3 Black anodize AavSHIELD3 Black anodize AavSHIELD3 Black anodize AavSHIELD3 Mounting Surface Temp Rise Above 0 531002 531102 0 100 80 0 531202 531302 Dia of PCB Plated Thru Hole for Pins Heat Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Thermal Resistance From MTG Surface to SEE NOTE 1 3x NOTE 1 This hole not present in 5310 series Material Aluminum Finish See Table For additional options see page 83 SW25-6, SW38-6 Extruded heat sink with unequal channel widths Grease Epo& xy page112 Mounting Kits page 99 Extruded heat sink with unequal channel widths front and back can accommodate a TO-220 or TO-202 device. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Clip 5901 sold separately can be used to attach device. See page 97 for clip information. 0 100 0 SW25 SW38 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description SW25-6G Extruded heat sink with unequal channel widths front and back SW38-6G Extruded heat sink with unequal channel widths front and back. “A” Dim Dia of PCB Plated Thru Hole for Pins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to SEE NOTE 1 NOTCH 11mm DEEP 10.4mm WIDE NOTE 1 This hole not present in SW25 series Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks 6396, 6398, 6399, 6400 High power extruded heat sink with large radial fins Grease Epo& xy page112 Mounting Kits page 99 High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical mounting without stress on the device leads. Available with shoulder pins to provide fixed clearance between the bottom of the heat sink and the board. Available in four heights for TO-220, TO-218, TO-247and multiwatt devices. Mounting Surface Temp Rise Above Mounting Surface Temp Rise Above 0 100 0 6396 6398 0 100 0 6399 6400 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 ORDERING INFORMATION Part Number Description 6396BG Extruded heat sink with large radial fins and straight pins 6396B-P2G With solderable shoulder pins 6398BG Extruded heat sink with large radial fins and straight pins 6398B-P2G With solderable shoulder pins 6399BG Extruded heat sink with large radial fins and straight pins 6399B-P2G With solderable shoulder pins 6400BG Extruded heat sink with large radial fins and straight pins 6400B-P2G With solderable shoulder pins For additional options see page 85 “A” Dim Dia of PCB Plated Thru Hole for Pins 6380, 6381, 6382 High power extruded heat sink Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to SEE DETAIL A P2 MODEL ONLY DETAIL A P2 MODEL ONLY Material Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 High power extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights. Can also be used for dual TO-220, TO-218, TO-247 and multiwatt devices. 0 100 0 6380 6381 6382 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 ORDERING INFORMATION Part Number 6380BG 6381BG 6382BG Description Extruded heat sink with solderable pins Extruded heat sink with solderable pins Extruded heat sink with solderable pins For additional options see page 85 “A” Dim Dia of PCB Plated Thru Hole for Pins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6374 Extruded heat sink for SIP packages Extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Can also be used for dual TO-220, TO-218, TO-247, and multiwatt devices. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 10 ORDERING INFORMATION Part Number 6374BG Description Extruded heat sink with solderable pins For additional options see page 85 Dia of PCB Plated Thru Hole for Pins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to YB32-4 High power flat back extruded channel style heat sink Grease Epo& xy page112 Mounting Kits page 99 DETAIL A SEE DETAIL A Material Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 High power flat back extruded channel style heat sink features a wide channel to accommodate several devices. Includes two solderable pins to allow vertical mounting without stress on the device leads. Can be used with TO-220, TO-218, TO-247, and multiwatt devices. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description YB32-4G High power flat back extruded heat sink Dia of PCB Plated Thru Hole for Pins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Ø THRU 5810, 5811, 5812 Flat back extruded heat sink featuring solderable pins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Flat back extruded heat sink features solderable pins which allow vertical mounting without stess on the device leads. Available in three heights for TO-220 and TO-218 devices. 0 100 0 58100X 58110X 58120X Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number 581001B02500G 581002B02500G 581101B02500G 581102B02500G 581201B02500G 581202B02500G Device TO-218 TO-220 TO-218 TO-220 TO-218 TO-220 “A” Dim For additional options see page 83 “B” Dim Dia of PCB Plated Thru Hole for Pins Material Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 #6 - 32 UNC THRU TYP 2 Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-218 Heat Sinks 5922 Plug in style heat sink Plug in style heat sink requires no hardware to attach to the device. The four spring action clips apply even pressure eliminating gaps between the heat sink and device which rob thermal performance. 0 100 80 60 Air Per Minute 200 400 600 800 Heat 1000 ORDERING INFORMATION 592201B03400G High power plug in heat sink with folded back fins and solderable mounting tabs For additional options see page 82 Dia of PCB Plated Thru Hole for Tabs 5931 Channel style heat sink with folded back fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Kits page 99 Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 Channel style heat sink with folded back fins for extra cooling capacity. The heat sink features solderable tabs for easy attachment to the PC board. 0 100 80 60 Air Per Minute 200 400 600 800 Heat 1000 10 8 ORDERING INFORMATION Part Number 593101B03600G Channel style heat sink with folded back fins and solderable tabs Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Thick Aluminum Finish Black Anodize POPULAR OPTIONS 593101B 0 0000G Base part no. A Position Code Description Details Kon-DuxTM pad Page 86 In-Sil-8TM pad Page 86 For additional options see page 82 7130 Copper slide on heat sink Copper slide on heat sink requires no hardware to attach the device. In addition, the copper heat sink is tin/lead plated to allow easy soldering to the PC board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 ORDERING INFORMATION Part Number Description 7130DG Slide on, channel style heat sink with integrated tabs Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Top cut away to show detail Material Thick Copper Finish Tin Plated AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: 5063 Low profile hat section heat sink Low profile hat section heat sink has a total height of making it perfect for mounting to printed circuit boards with centering between boards. 0 100 80 60 Air Per Minute 200 400 600 800 Heat 1000 20 16 ORDERING INFORMATION Hat section heat sink For additional options see page 84 5740 Low cost slide on heat sink Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to TO-202 Heat Sinks Grease Epo& xy page112 Mounting Kits page 99 THRU NOTCH IS WIDE X DEEP Material Thick Aluminum Finish Black Anodize Low cost slide on heat sink provides positive retention with an integral locking tab. The spring tension ensures excellent thermal contact for maximum performance. Requires no hardware to mount. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 16 ORDERING INFORMATION Finish Black anodize Unfinished 5742, 5796, 5797 Low cost slide on cooler heat sink Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to DITTIN Material Thick Aluminum Finish See Table FIGURE A FIGURE B Low cost slide on cooler heat sink is easy to assemble to the device and requires no mounting hardware. Models have fins on both sides, or the left or right. Available with or without staked on solderable tab for easy board mounting. Material Thick Aluminum Finish Black Anodize Note Fins on Left or Right. Right hand fin model shown. Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to ORDERING INFORMATION Low cost slide on cooler, no solderable tabs 574204B03300G With solderable tabs With left side fin only, no solderable tabs 579604B03300G With left side fin only and solderable tabs With right side fin only, no solderable tabs 579704B03300G With right side fin only and solderable tabs For additional options see page 84 Figure A B Dia of PCB Plated Thru Hole for Tabs 0 100 0 574204 579604 579704 Air Per Minute 200 400 600 800 Heat 1000 20 16 12 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-202 Heat Sinks 5769, 5773, 5774 Slim low profile channel style heat sink Slim low profile channel style heat sink is notched to accommodate the TO-202 center tab packages. Available in 3 heights. ORDERING INFORMATION “A” Dim For additional options see page 84 0 100 0 576904 577304 577404 Air Per Minute 200 400 600 800 Heat 1000 20 16 12 6034 Space saving staggered fin heat sink Space saving heat sink features staggered fins for increased cooling efficiency. This verticle mount heat sink features integrated matte tin plated tabs to solder directly to the PC board. 0 100 80 60 Air Per Minute 200 400 600 800 Heat 1000 10 8 2 0 10 ORDERING INFORMATION 6034DG Space saving staggered fin heat sink with integrated tin plated tabs Dia of PCB Plated Thru Hole for Tabs 6046, 6047 Compact slide on heat sink FIGURE A O.D. Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Grease Epo& xy page112 Mounting Kits page 99 THRU Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 Material Thick Copper Finish Tin Plated FIGURE B "A" O.D. Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Compact slide on heat sink makes assembly easy. The 6046 features a positive device catch to lock the heat sink to the device. SECTION ORDERING INFORMATION 6046PBG With device catch 6047PBG Compact slide on heat sink Figure A B *Edges cut during the manufacturing process will be unfinished. See page 110 for more information. SECTION Material Thick Aluminum Finish Pre-Black Anodize* 0 100 Air Per Minute 200 400 600 800 1000 20 Heat AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: 5775 Slip on heat sink TO-126 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Slip on heat sink requires no hardware to attach to the device. Spring pressure ensures excellent retention. May be assembled before or after the device is attached to the board. 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Finish Black anodize Unfinished Narrow channel style heat sink featuring twisted fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Narrow channel style heat sink features twisted fins for increased air turbulance for better cooling. Can be mounted horizontally or vertically. 0 100 80 60 Air Per Minute 200 400 600 800 Heat 1000 20 16 12 Material Thick Aluminum Finish See Table Grease Epo& xy page112 Mounting Kits page 99 ORDERING INFORMATION Part Number TV4G Description Narrow channel style heat sink with twisted fins Material Thick Aluminum Finish Black Anodize PF730, PF732 Slip on heat sink FIGURE A FIGURE B Mounting Surface Temp Rise Above Ambient Thermal Resistance From MTG Surface to Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. The tabbed version is made from tin plated copper and the no tab version is lightweight aluminum. ORDERING INFORMATION Part Number PF730G PF732G Description Slip on heat sink With solderable tabs Material Aluminum Copper Finish Black anodize Tin plated Figure B A 0 100 Air Per Minute 200 400 600 800 Heat 1000 50 10 0 5 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SIPS 5660 Plug in style heat sink FIGURE A TAB CL FIGURE B Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal contact. Available with or without solderable tabs for horizontal or vertical mounting to the PC board. ORDERING INFORMATION Part Number 566010B03100G 566010B03400G Figure Plug in style heat sink, no solderable tabs With solderable tab for horizontal mounting B With solderable tabs for vertical mounting Dia of PCB Plated Thru Hole for Tabs Material Thick Aluminum Finish Black Anodize POPULAR OPTIONS 566010B0 00 00G Base part no. A Position Code Description 28 Solderable Shur-LockTM Tab for vertical mounting For additional options see page 84 Details Page 91 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 5305 Channel style heat sink with integrated clip Channel style heat sink with integrated clip features strong spring tension and device locking catch to attach device securely to the heat sink. Available in two finishes. Mounting Surface Temp Rise Above 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 ORDERING INFORMATION Finish Unfinished Black anodize Thermal Resistance From MTG Surface to LOCKING CATCH Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SIPS 7038 Channel style slide on heat sink featuring an integrated clip and device retaining tab Channel style slide on heat sink features an integrated clip and device retaining tab to hold the heat sink to the device. Small footprint consumes less board space. ORDERING INFORMATION Part Number Description 7038BG Channel style slide on heat sink 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to SECTION Material Thick Aluminum Finish Black Anodize 7148 Copper channel style slide on heat sink featuring an integrated clip and solderable tabs 0 100 Air Per Minute 200 400 600 800 1000 10 Copper channel style slide on heat sink features an integrated clip and solderable tabs. Includes a device retaining tab to securely hold the heat sink to the device. Small footprint consumes less board space. Heat ORDERING INFORMATION Part Number 7148DG Description Slide on heat sink with integrated clip Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to SECTION MAX AT BASE DETAIL E Material Thick Copper Finish Tin Plated 5840 Clip on heat sink featuring louvers Clip on heat sink features louvers to provide excellent cooling in natural or forced air convection. Spring action provides strong clamping force to securely hold the heat sink to the device. Available with or without solderable tabs. 0 100 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 10 ORDERING INFORMATION Part Number Description Clip on heat sink. no solderable tabs 584000B03500G With solderable tabs for vertical mounting For additional options see page 84 Dia of PCB Plated Thru Hole for Tabs Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to DITTIN TYP 2 Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-92 Heat Sinks 5752, 5753, 5754 Low cost slip on heat sink Low cost slip on heat sink features an expandable collar that tightly grips the device meaning no extra mounting hardware is required. Three heights to choose from. ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above 0 100 20 0 575400 575200 Air Per Minute 200 400 600 800 Heat 1000 25 Mounting Surface Temp Rise Above 0 100 80 20 0 575300 Air Per Minute 200 400 600 800 Heat 1000 25 Low cost brass clip on heat sink 0 100 Mounting Surface Temp Rise Above Ambient °C Low cost brass clip on heat sink requires no hardware to attach to the device. Includes integrated tabs that can be soldered or twisted to attach the heat sink to the board reducing stress on the device leads. ORDERING INFORMATION Part Number 92FG Description Brass clip on heat sink Dia of PCB Plated Thru Hole for Tabs Air Velocity Feet Per Minute 200 400 600 800 Heat Dissipated Watts 1000 25 Thermal Resistance From MTG Surface to Ambient °C/Watt Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Black Anodize Material Thick Brass Finish Unfinished AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: 5203 Two piece heat sink FIGURE A THRU THRU Two piece heat sink adds extra cooling in the same amount of board space as other solutions. Base and top can be ordered separately. ORDERING INFORMATION Figure Two piece heat sink assembly, base and top Top only Base only For additional options see page 84 5791 Space saving expandable collar heat sink TO-3 Heat Sinks FIGURE B Grease Epo& xy page112 Mounting Kits page 99 THRU TYP 2 Material Thick Aluminum Finish Black Anodize 0 100 Mounting Surface Temp Rise Above 520327 520328 520329 0.160 THRU TYP 2 Air Per Minute 200 400 600 800 Heat 1000 10 Mounting Kits page 99 0 100 Mounting Surface Temp Rise Above Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device meaning no extra hardware is required. May also be used with any diamond or square basket heat sink to form a two piece heat sink for additional cooling. Available in conductive AavSHIELD3 or black anodize finish. ORDERING INFORMATION Finish Black anodize AavSHIELD3 5060 Low profile hat section heat sink Air Per Minute 200 400 600 800 Heat 1000 20 Thermal Resistance From MTG Surface to SLOT 1 5 4 0 REF Material Thick Aluminum Finish See Table Grease Epo& xy page112 Mounting Kits page 99 Low profile hat section heat sink is ideal for applications where low component heights are required such as card cages with PCBs mounted on centers. ORDERING INFORMATION Low profile hat section heat sink For additional options see page 84 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 0 100 80 60 Air Per Minute 200 400 600 800 Heat 1000 10 8 2 0 20 2x THRU THRU Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-3 Heat Sinks 5756, 5757, 5758, 5759 Space saver diamond shaped basket heat sink Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to Space saver diamond shaped basket heat sink featuring a narrow base with slanted fins to increase air turbulence in natural and forced convection applications. Made from heavy gauge material. Four heights to choose from. ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above 0 100 575703 575603 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above 0 100 0 575903 575803 Air Per Minute 200 400 600 800 Heat 1000 5 POPULAR OPTIONS 575_03B 0 00 00G Base part no. A B Position Code Kon-DuxTM pad In-Sil-8TM pad 6-23 Wave-OnTM threaded insert stand off For additional options see page 84 Location Hole X Details Page 86 Page 86 Page 89 5013, 5014, 5015, 5016 Low cost diamond shaped basket heat sink Grease Epo& xy page112 Mounting Kits page 99 CL1 "X" CL2 TYP 2 TYP 2 Material Thick Aluminum Finish Black Anodize Grease Epo& xy page112 Mounting Kits page 99 Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from. ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above Mounting Surface Temp Rise Above 0 100 80 60 40 20 0 0 501403 501303 0 100 80 60 40 20 0 0 501603 501503 Air Per Minute 200 400 600 800 Heat 1000 10 8 2 0 10 Air Per Minute 200 400 600 800 Heat 1000 10 8 2 0 10 POPULAR OPTIONS 501_03B 0 00 00G Base part no. A B C Position Code Kon-DuxTM pad 6-23 Wave-OnTM threaded insert stand off 6-32 x Solderable stud For additional options see page 84 Location Hole X Hole X Details Page 86 Page 89 Page 96 Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to CL "X" TYP 2 TYP 2 AT BASE AT BASE Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above Mounting Surface Temp Rise Above 0 100 80 60 40 0 519803 519703 0 100 80 60 40 0 520103 519903 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 25 Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to TYP 2 BASE TYP 2 Material Thick Aluminum Finish Black Anodize POPULAR OPTIONS 5_ _ _03B 0 00 00G Base part no. A B Position Code Location Kon-DuxTM pad 6-32 Wave-OnTM theaded insert stand off Hole X For additional options see page 84 Details Page 86 Page 89 5690, 5790 Square basket heat sink features folded back fins Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Square basket heat sink features folded back fins to increase surface area and power dissipation. Two heights are available. ORDERING INFORMATION “A” Dim 0 100 0 569003 579003 Air Per Minute 200 400 600 800 Heat 1000 5 4 1 0 20 THRU TYP 2 THRU TYP 2 Grease Epo& xy page112 Mounting Kits page 99 THRU TYP 8 SQ. REF Material Thick Aluminum Finish Black Anodize POPULAR OPTIONS 5_9003B 0 0000G Base part no. A Position A Code 1 3 Description Details Kon-DuxTM pad Page 86 In-Sil-8TM pad Page 86 For additional options see page 84 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-3 Heat Sinks 5001, 5002, 5003, 5004 Square basket heat sink featuring slanted fins Grease Epo& xy page112 Mounting Kits page 99 Square basket heat sink featuring a slanted fin design for increased air turbulence and four integrated mounting holes. Four heights to choose from. ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above Mounting Surface Temp Rise Above 0 100 80 60 40 20 0 0 500103 500203 0 100 80 60 40 20 0 0 500303 500403 POPULAR OPTIONS 500_03B 0 0000G Base part no. A Position A Code 1 3 Description Details Kon-DuxTM pad Page 86 In-Sil-8TM pad Page 86 For additional options see page 84 Air Per Minute 200 400 600 800 Heat 1000 5 4 1 0 20 Air Per Minute 200 400 600 800 Heat 1000 5 4 1 0 20 Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to TYP 2 THRU TYP 4 TYP 2 Material Thick Aluminum Finish Black Anodize 5051, 5053, 5054 Square basket heat sink featuring straight fins Grease Epo& xy page112 Mounting Kits page 99 Square basket heat sink features straight fins and thick aluminum for increased cooling capacity. Three heights to choose from. Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 0 100 505103 505303 505403 Air Per Minute 200 400 600 800 ORDERING INFORMATION “A” Dim POPULAR OPTIONS 505_03B0 00 00G Base part no. A Position Code 6-23 Wave-OnTM threaded insert stand off For additional options see page 84 Location Hole X Details Page 89 Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-3 Heat Sinks 5761, 5762, 5763, 5764 Square basket heat sink featuring slanted vane fins Square basket heat sink features slanted vane fins for efficient heat dissipation. Air movement from any direction is diverted into the center of the heat sink to create turbulence and improve heat transfer. Four heights to choose from. ORDERING INFORMATION “A” Dim POPULAR OPTIONS 576 _ 03B 0 00 00G Position Code Base part no. A B Description Location Kon-DuxTM pad 6-32 Wave-OnTM theaded insert Hole X stand off TYP 2 TYP 2 0 100 0 576103 576203 Details Page 86 Page 89 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 For additional options see page 84 Grease Epo& xy page112 Mounting Kits page 99 Material Thick Aluminum Finish Black Anodize 0 100 576303 576403 Air Per Minute 200 400 600 800 Heat 1000 5 1 0 20 PF523, PF526, PF527 Diamond shaped heat sink Approx DIA area flat around holes Diamond shaped heat sink is the same profile as the device which saves space on the board. This rugged design is made from cast aluminum and is available in three different heights. ORDERING INFORMATION “A” Dim PF523G PF526G PF527G CTRS DIA TYP 2 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to 0 100 0 PF523 PF526 PF527 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 15 Material Cast Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-66 Heat Sinks 5017, 5018, 5019, 5020 Low cost diamond shaped basket heat sink Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from. ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above 0 100 0 501706 501806 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above 0 100 0 501906 502006 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Grease Epo& xy page112 TYP 4 Mounting Kits page 99 BASE BASE Material Thick Aluminum Finish Black Anodize 5792 Space saving expandable collar heat sink Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device. ORDERING INFORMATION Finish Black anodize AavSHIELD3 0 100 Air Per Minute 200 400 600 800 Heat 1000 20 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Kits page 99 SLOT Material Thick Aluminum Finish See Table AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Thermal Resistance From MTG Surface to THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5781, 5782, 5783, 5784, 5785 Snap on cooler heat sink Snap on cooler features easy no tools installation. Folded back fins provide maximum surface area while preserving valuable board space. ORDERING INFORMATION “A” Dim Mounting Surface Temp Rise Above 0 100 20 0 578105 578205 Air Per Minute 200 400 600 800 Heat 1000 50 Mounting Surface Temp Rise Above 0 100 20 0 578405 578305 Air Per Minute 200 400 600 800 Heat 1000 50 6201, 6202, 6203 Space saving expandable heat sink Space saving expandable heat sink features a collar that tightly grips the device meaning no extra hardware is required. Heat sinks are constructed of pre-black anodize material to lower cost. ORDERING INFORMATION “A” Dim # Fins 6201PBG 6202PBG 6203PBG * Edges cut during the manufacturing process will be unfinished. See page 110 more information Mounting Surface Temp Rise Above 0 100 20 0 6201 6202 6203 Air Per Minute 200 400 600 800 Heat 1000 50 Low cost push on heat sink Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above TO-05 Heat Sinks 0 100 20 0 578505 Air Per Minute 200 400 600 800 Heat 1000 50 Material Thick Aluminum Finish Black Anodize I.D. Material Thick Aluminum Finish Pre Black Anodize* Low cost push on heat sink uses spring pressure to firmly grip the device case creating a good thermal interface. ORDERING INFORMATION Part Number Description Low cost push on heat sink 0 100 Air Per Minute 200 400 600 800 Heat 1000 50 Mounting Surface Temp Rise Above Ambient Thermal Resistance From MTG Surface to Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TO-5 Heat Sinks 3257, 3260 Extruded collar style heat sink with radial fins Extruded collar style heat sink with radial fins. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two heights. 0 100 326005 325705 Air Per Minute 200 400 600 800 Heat 1000 50 ORDERING INFORMATION “A” Dim 3201, 3202 Extruded collar style heat sink with swept back fins Extruded collar style heat sink with swept back fins for increased surface area in a small volume. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two inside diameters. ORDERING INFORMATION “A” Dim 0 100 Air Per Minute 200 400 600 800 Heat 1000 50 3230 Extruded collar style heat sink with mounting hole Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to THRU Material Aluminum Finish Black Anodize Material Aluminum Finish Black Anodize Extruded collar style heat sink with mounting hole for hardware attachment to the circuit card. The heat sink includes a mount boss that will accept a 4-40 screw for secure mounting in high vibration environments. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. 0 100 Air Per Minute 200 400 600 800 Heat 1000 50 ORDERING INFORMATION Description Extruded collar style heat sink with mounting boss Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 6000 Copper heat sink for axial lead devices Copper heat sink for axial lead device requires no extra board space to mount. One lead of the heat sink is soldered to the device while the other solders to the PC board. Available in two finishes. 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 ORDERING INFORMATION Part Number Description 6000UG Heat sink for axial lead device 6000DG Heat sink for axial lead device * See page 110 for more information Finish Unfinished Tin plated* Dia of PCB Plated Thru Hole for Tabs See figure A See figure A Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Axial Lead Devices CL SYM BASE FIGURE A DIA as required for lead size Material Thick Copper Finish See Table Bridge Rectifiers 6222, 6223, 6224 Square basket style heat sink for bridge rectifiers Square basket style heat sink for bridge rectifiers uses no additional board space. Available with three different mounting hole diameters. ORDERING INFORMATION Part Number 6222BG 6223BG “A” Dim Dia Thru Dia Thru 6224BG Dia Thru 0 100 Air Per Minute 200 400 600 800 Heat 1000 10 2 0 10 Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Material Thick Aluminum Finish Black Anodize AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: OPTIONS & ACCESSORIES CONTENTS Thermal solutions go beyond the heat dissipator itself. Aavid Thermalloy offers a total solution package, which includes a number of options and accessory items described in this section of the catalog. A total thermal solution includes an efficient thermal interface and means of mechanical attachment. Aavid Thermalloy has a full-line of interface materials that can be pre-applied or supplied as an accessory item. Mechanical assembly options include attachment of semiconductors to heat sinks, heat sinks to printed circuit boards, and heat sinks to sockets of CPUs. Aavid Thermalloy offers the most complete line of value added options of any supplier in the industry. Our full line of accessories includes mounting kits, shoulder washers, insulators, mounting pads, and various grease products and epoxies, which are sold separately, and can be used with a variety of Aavid heat sinks. This section will provide the most complete solution to your thermal requirement. CONTENTS How to decipher or construct an Aavid 12 digit part number....................... 80 How to decipher or construct a "Thermalloy" origin part number............... 81 82 Interface Materials Pads In-Sil-8TM 86 87 Alignment 87 Double Sided Tape Options factory applied 88 Labor Saving Heat Sink to Board and Device to Heat Sink Mounts Wave-OnTM 89 Semiconductor 90 Shur-LockTM 91 Solderable Staked on 91 Solderable Mounting 93 Solderable 94 Solderable 94 Clinch 95 Solderable 96 Device Mounting Clips Aavid 97 Thermal 98 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: OPTIONS & ACCESSORIES CONTENTS CONTENTS Accessories Mounting Kits TO-220/TO-3 Mounting 99 Insulating Shoulder Washers Polyphenylene Sulfide PPS Shoulder 100 Nylon Shoulder Insulators ThermalfilmTM Polymide Plastic ThermalfilmTM/ ThermalfilmTM 102 Mica, 103 Aluminum Oxide Ceramic 104 Stanchion Insulating Covers TO-3 Insulating 106 Teflon-Filled Acetal 106 Teflon-Filled Acetal Mounting Pads TO-5, TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion ................ 107 Ordering Codes Wave-OnTM mounts page 89 KonduxTM pads In-Sil-8TM pads Semiconductor mnts page 86 page 86 page 87 page 90 Studs page 96 504102 B U 53 54 55 56 57 01 02 03 05 1 504222 B U 01 02 03 05 2 506902 B U 01 02 03 05 1 507002 B U J 53 54 55 56 57 01 02 03 05 1 507102 B U J 507222 B U J V 53 54 55 56 57 01 02 03 05 1 2 507302 B U J V 33 36 39 40 01 02 03 05 1 530101 B U 50 01 04 05 07 1 2 530102 B U 50 01 04 05 07 1 2 530161 B U 62 01 04 05 07 1 2 530162 B U 62 01 04 05 07 1 2 530401 B U 50 01 04 05 07 1 2 530402 B U 50 01 04 05 07 1 2 530613 B U J V 53 54 55 56 57 530614 B U J 53 54 55 56 57 530714 B U V 53 54 55 56 57 530801 B U Ordering Codes Base part Finishes page 110 Clips KonduxTM pads In-Sil-8TM pads Semiconductor mounts Solderable pins Studs Clinch nuts page 86 page 86 page 87 page 90 page 94 page 96 page 95 513001 B U 03 21 25 513002 B U 21 25 513101 B U 21 25 513102 B U 01 02 03 21 25 513201 B U 01 05 21 25 513202 B U V 01 02 03 21 25 513301 B U 21 25 513302 B U V 01 02 21 25 529701 B 21 25 529702 B 21 25 529801 B 01 02 21 25 529802 B 01 02 21 25 529901 B 33 34 1 2 01 02 05 21 25 Ordering Codes In-Sil-8TM pads page 86 Semiconductor mounts page 90 Solderable tabs Solderable nuts page 94 13 14 13 14 28 31 34 37 31 37 39 40 3 32 33 3 31 32 33 37 39 40 01 05 32 33 32 33 35 31 33 28 40 37 38 39 40 Solderable studs page 96 06 08 09 06 08 09 06 08 09 06 08 09 06 07 08 09 06 08 17 06 08 17 08 17 08 06 08 17 09 11 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: OPTION INDEX Option Index D Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher a Thermalloy Origin part number" on page To find the appropriate Option Index for a selected part number, refer to the main product section in the front of the catalog or "How to use this catalog" on page Base part Finishes page 110 6021 B U PB 6022 B U PB 6025 PB 6109 B U PB 6110 B U PB 6225 B U PB 6230 B U PB D 6232 B U PB 6238 B U PB 6239 B U 6374 B Ordering Codes Solderable Device studs & pins mtg. studs page 96 SF1 SF2 SF1 SF3 SE3 SE1 SF1 SE1 SM3 SF1 MT MT3 MT5 TC-1 MT MT5 MT6 P2 P3 TC-6 TC-6 MT MT2 MT5 MT6 TC-10 TC-11 TC-12 SE3 MT MT5 MT6 TC-10 TC-11 TC-12 TC-1 TC-11 TC-12 SE3 TC-1 TC-6 TC-7 TC-12 MT MT3 MT6 TC-12 Clinch nuts page 95 CNM1 CNM1 CNE42 CNE42 CNE42 Solderable nuts page 94 Alignment pads page 87 pads page 86 CNE42 CNM1 CNM2 CNE42 CNE43 CNM2 CNM1 CNE42 SNM1 SNE2 8223-CL03 G5 G4 8223-CL03 8241-CL11 8223-CL03 8223-CL03 ORDERING INFORMATION example 12 digit part 507222B _ 0000G Ordering code The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional In-SilTM pads separate, or factory applied variations please contact an Aavid sales rep for inquiries. Ordering code No pads One In-Sil-8TM pad Two In-Sil-8TM pads MATERIAL PROPERTIES Color Grey Thickness Breakdown voltage 3500 Dielectric constant Thermal resistance approx. Screw size Torque TO-3 6-32 TO-220 4-40 TO-218 4-40 KonDux / Conducta-Pad** Kondux interface pads are a cost effective alternative to thermally conductive grease compounds. Kondux pads are electrically conductive and ideal for use with small, discrete semiconductors. Aavid pre-applies Kondux to your heatsink to enhance heat conductance from the semiconductor case and speed your manufacturing process. ORDERING INFORMATION example 12 digit part 575703B _ 0000G Ordering code The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. Figure A Figure B "C" Ordering code 1 or 2* 1 or 2* 1 or 2* Device TO-3 TO-218 TO-220 Figure A B "A" Dim *Factory applied only One KonDuxTM pad example Thermalloy origin part 6109B - G Suffix G1 G4 G5 G7 Device TO-3 TO-218 TO-220 Multiwatt Figure A B "A" Dim "B" Dim "C" Dim A = Model number B = pad C = RoHS compliant "B" Dim "C" Dim MATERIAL PROPERTIES Color Black metallic Thickness Thermal resistance See Graph pg 10 Electrical resistivity 15 x 10-6 Ohms Compression strength for 10% reduction in thickness 580 psi Tensile strength 650 psi Ultimate compression strength 12500 psi Service temperature -240°C to +300°C Liner None ** The name was originally marketed by Thermalloy and is the same material as KonduxTM is a registered trademark of the Union Carbide Company AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ORDERING INFORMATION example 12 digit part 530101B _ 5150G Ordering code The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional pads separate, or factory applied variations please contact an Aavid sales rep for inquiries. Ordering code Description No pads One pad Two pads * is a registered trademark of the Bergquist Company MATERIAL PROPERTIES Reinforcement carrier Polymide Thickness Continuous use temp °C Phase change temp °C Dielectric breakdown voltage Vac 5000 Dielectric constant 1000 Hz Volume resistivity Ohm-meter 1012 Thermal impedance vs. pressure Pressure TO-220 Thermal performance ºC/W Alignment Pads Solderable alignment pads are an innovative way to attach the heat sink to your transistor that could cut your assembly time by more than half. Alignment pads provide cost effective solderability, while providing numerous additional benefits. Alignment pads are factory applied and can be bought separately as well. Please refer to accessory Index D on page ORDERING INFORMATION example Thermalloy origin part G Suffix 8223-CL03G 8241-CL11G Device TO-220 TO-218 Figure B A A = Model number B = Alignment pad C = RoHS compliant Typical installation Shown with part number 8241-CL11 Figure A Figure B TYP THK Recommended hole pattern for 8223-CL03G Recommended hole pattern for 8241-CL11G CL1 CLIP ASSEMBLY PLATED THRU HOLE PER DEVICE MANUFACTURERS RECOMMENDATION DIA PLATED THRU HOLE DIA PLATED THRU HOLE TYP 3 DIA PLATED THRU HOLE TYP 2 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Interface Material / Double Sided Tape Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. They are easy to apply, require no curing time, can be electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. Aavid can apply one side to a heat sink. ORDERING INFORMATION example 12 digit part 375224B000 _ _G Ordering code 31 32 33 34 35 Tape option T414 T405R T412 T410R T411 Ordering code INTERFACE MATERIALS T414 for ceramic or metal packages Uses a inch mm Kapton MTTM filled polymide film coated on both sides with high-bond strength, pressuresensitive acrylic adhesive that is loaded with aluminum oxide particles. This provides both good thermal performance and excellent electrical isolation. Color Electrical function Thickness Carrier Thermal impedance Thermal conductivity Breakdown voltage Volume resistivity Lap shear adhesion Die shear adhesion Aluminum 25°C Aluminum 150°C Creep adhesion 25°C 12psi 150°C 12psi Beige Insulating mm Kapton MTTM °C-in2/w/m-k 5000 VAC 5 x 1015 Ohm-cm 125 psi 150 psi 15 psi >50 days >10 days T405R for ceramic or metal packages Uses a inch mm aluminum foil core coated on both sides with high-bond strength, pressure-sensitive acrylic adhesive that is loaded with aluminum oxide particles. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance. Color Electrical function Thickness Carrier Thermal impedance Thermal conductivity Breakdown voltage Volume resistivity UL flammability Rating Lap shear adhesion Die shear adhesion Aluminum 25°C Aluminum 150°C Alum.oxide 25°C Alum.oxide 150°C Creep adhesion 25°C 12 psi 150°C 12 psi White Conductive Aluminum °C-in2/w/m-k N/A 3 x 10-2 Ohm-cm 94V-0 U.L.94 134 psi 125 psi 55 psi 145 psi 60 psi >50 days >50 days T412 for ceramic or metal packages T410R / T411 for plastic packages Uses an expanded foil carrier coated on both sides with high-bond strength, pressure sensitive acrylic that is loaded with titanium diboride particles. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance. Color Electrical function Thickness Carrier Thermal impedance Thermal conductivity Breakdown voltage Volume resistivity UL flammability Lap shear adhesion Die shear adhesion Aluminum 25°C Aluminum 150°C Alum.oxide 25°C Alum.oxide 150°C Creep adhesion 25°C 12 psi 150°C 12 psi Grey Conductive Expanded aluminum °C-in2/w/m-k N/A N/A N/A 70 psi 135 psi 25 psi 125 psi 40 psi >50 days >10 days Note Double Sided Tapes are factory applied only. T410R thermally conductive tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a inch 0.05mm aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces. T411 thermally conductive tape consists of a high bond strength, pressure sensitive adhesive with an aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heat sinks. The high performance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces. Typical properties Construction Adhesive to heat sink side Color Carrier Adhesive onto component side Color to component side Thickness, mm inch Thermal impedance psi °C-cm2/w °C-in2/w Operating temperature range, °C Lap shear adhesion, psi MPa Die shear adhesion, psi MPa steel/FR4 25°C 125 °C T410R Acrylic White Aluminum foil Silicone Clear Silver -50 to + 150 60 170 40 T411 Silicone Clear silver Aluminum mesh Silicone Clear Silver -50 to + 150 14 80 20 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Wave-OnTM Mounts Wave-OnTM Mounts Solderable mounts can be factory installed to practically every board-mountable heat sink and flat sided extrusion. The female threaded through holes permit pre-assembly to the semiconductor via machine screws , allowing the heat sink/semiconductor package to be treated as one unit when fitted in PC board through holes for wave soldering. FEATURES Saves production time and cost • Cuts production steps by half • Factory installation eliminates steps • Permits soldering in one step • All the benefits of female threaded mount • Automated fastening • Excellent solderability Better thermal performance • Built in stand-off adds air space between PCB and heat sink for improved air flow and easier cleaning • No lockwashers, nuts or separate mounts with various thread lengths ORDERING INFORMATION example part 574802B0 _ 00G Ordering code Ordering code 01 02 03 04 05 07 09 Model E EA EG EH EK EM ER “A” Dim “B” Dim “C” Dim Typical Wave-OnTM mount installation HEAT SINK DIM "C" STAND-OFF LENGTH DIM "T" PC BOARD "D" "C" “D” Dim Threaded thru holes #6-32 #4-40 #4-40 #6-32 #6-32 3.5MM #6-32 Model EA, EG E, EK, EM, ER EH Dia of PCB plated thru hole PCB thickness “T” AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Semiconductor Mounts Female Semiconductor Mounts • Fastens semiconductor to heat sink fast and efficiently • Up to 10 times faster than fastening with standard nuts and bolts • Used with most JEDEC case sizes, factory installed "C" "A" ORDERING INFORMATION example 12 digit part 542502B000 _ _G Ordering code Ordering code Thread #6-32 #4-40 “A” Dim “B” Dim “C” Dim “D” Dim "D" "C" INSTALL MOUNT Male Semiconductor Mounts • Captive male studs for semiconductor attachments • Used with most JEDEC case sizes, factory installed ORDERING INFORMATION example 12 digit part 507302B000 _ _G Ordering code Ordering code 04 05 Thread #6-32 #4-40 MALE SEMICONDUCTOR MOUNT AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: TSMhur-LockTM Tabs Aavid’s Shur-Lock self locking stand-off tab U.S. Patent #5,437,561 positively secures any heat sink to the printed circuit board. This Shur-Lock tab exhibits many unique design features. The rounded and bifurcated tip of the Shur-Lock solderable tab has been designed to easily snap into any diameter hole. Once through the hole, the tab provides a positive resistance to backing or falling out of the hole. In addition, the spring action between the tab and the plated through hole prevents leaning or lift-off of the heat sink prior to or during the soldering process. The tip extension of the Shur-Lock tab has been designed to protrude less than beyond the back of a standard PC board, which is below the normal lead trimming allowance for assembled PCBs. Shur-Lock’s stand-off design facilitates the cleaning of assembled PCBs and permits electrical traces to be routed under the heat sink. The wide base supports of the tab further improve the stability of the heat sink assembly. ORDERING INFORMATION example 12 digit part 574802B0 _ 00G PRODUCT INFORMATION Ordering code Material Spring steel Finish Tin plating over a copper flash Pull-out force* 70 lbs/tab minimum Recommended PCB hole diameter PCB thickness Variations of the above specifications are possible. Contact Aavid Thermalloy for additional details for use with thicker PCB sizes, such as or other hole diameters. *Vertical force applied to the sink-tab joint. TSMolderable Staked on Tabs • Positive PCB engagement • Integrated PCB stand-off • Quick “snap-in” assembly design • Reduces installed assembly cost • Designed for rugged shock and vibration environments • Can be installed on a variety of stamped and extruded board level heat sinks Factory applied only Tab ordering code 28 Aavid solderable tabs stake onto heat sinks for solder mounting into the PC board. The tabs are available in a variety of lengths, widths and thicknesses. Tabs are factory applied for both vertical and horizontal mountings including step tabs, which keep the heat sink elevated above the board, and tabs with a triangular base for extra stability. Many of Aavid’s tabs are customized. Below are examples of standard tabs. Please consult Aavid’s customer service department for information about other tab options. ORDERING INFORMATION example 12 digit part 574802B0 _ 00G Ordering code Tab ordering code 31 Tab ordering code 32 Tabs AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Tabs Tab ordering code 33 Tab ordering code 35 Tab ordering code 34 Note The drawing above shows the right hand of a matched pair which are supplied mounted to the heat sink. Tab ordering code 36 Tab ordering code 37 Tab ordering code 39 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Tab ordering code 40 Tab ordering code 43 Tabs Solderable Mounting Tabs Heat sinks ordered with solderable mounting tabs have tin-plated spring steel tabs permanently locked onto the heat sink to provide wave solderability. The solderable tabs are mounted on the heat sink after anodizing, thus eliminating any special coating or handling. The result is a wave solderable heat sink with black anodized performance. FIGURE A "A" "B" ORDERING INFORMATION example 12 digit part 574802B0 _ 00G example Ordering code Thermalloy origin part G A = Model number B = Mounting tab suffix B C = RoHS compliant MT3 ONLY BEVELED CORNERS MT3 ONLY Typical Installation FIGURE B SEE DETAIL B DETAIL B ADD TO HEIGHT OF PART "A" REF TRIANGULAR TAB Suffix MT MT2 MT3 MT5 MT6 Ordering code Stand-off height Features Solderable mounting tab Solderable mounting tab 50 degree beveled corners on stand-off portion reducing board footprint from to width. Only tab with this feature. Bifurcated tabs in lieu of triangular shape Bifurcated tabs in lieu of triangular shape “A” Dim “B” Dim Figure A Recommended PCB plated thru hole: ± ± ± ± ± ± ± ± ± ± Notes Mounting tabs have unique locking features built into their design. Aavid Thermalloy adds to standard and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold separately. Please see page 85 for additional tab options. AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Solderable Pins / Solderable Nuts Solderable Pins Vertically mounted, extruded heat sinks are converted to wave solderable with the addition of solderable roll pins. Roll pins are available with stand-off shoulders in different heights for easier cleaning after wave soldering. FIGURE A Pin 25 "A" Pin P2-P3 FIGURE B Typical installation P2-P3 ORDERING INFORMATION example 12 digit part 529902B0 _ 00G example Ordering code Thermalloy origin part G A = Model number B = Solid pin suffix B C = RoHS compliant 0.097 REF Heat sink "A" Suffix Ordering code Description Solid pin w/stand-off shoulder Solid pin w/stand-off shoulder Solid solderable pin “A” Dim Figure A B PC Board Stand-Off Shoulder Solderable Nuts Solderable nuts are permanently swaged into the heat sink for quick pre-assembly with the transistor. Screws are used to mount to the heat sink and are installed from the top. Solderable nuts feature a closed end that prevents solder from wicking into threads and trapping contaminants or flux. Heat sink and transistor are then handled as a single component and dropped into plated-thru holes in the PC board for wave soldering. Solderable nuts require slightly larger printed circuit board hole sizes ORDERING INFORMATION example 12 digit part 506003B0 _ 00G example Thermalloy origin part Ordering code A = Model number B = Solderable nut suffix C = RoHS compliant Suffix SNM-1 SNE-1 SNE-2 Ordering code N/A 14 13 Dia of PCB thru hole Thread M3X0.5 4-40 UNC-2B 6-32 UNC-2B Note If a part number requires 2 solderable nuts, simply add a "/2" after the solderable nut character suffix on Thermalloy origin parts. Mechanical drawings showing heat sinks with solderable nuts SOLDERABLE NUT FEATURES • Pre-mounted to heat sink at factory • Ease of pre-assembly in production • Mechanical and electrical integrity • Wave solderability THREAD SOLDERABLE NUT AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Clinch Nuts Clinch nuts are threaded nuts that allow quick assembly of the transistor to the heat sink. A single screw mounts the transistor to the heat sink, reducing your hardware requirements. Clinch nuts are permanently pressed into the heat sink, and come in a variety of English and Metric designates an English thread, and CNM designates a Metric thread. FIGURE A SECTION A-A Clinch Nuts FIGURE B "A" "B" ORDERING INFORMATION example 12 digit part 529801B000 _ G example Thermalloy origin part Ordering code G A = Model number B = Clinch nut suffix B C = RoHS compliant Suffix CNE42 CNE43 CNM1 CNM2 Ordering code 12 N/A 13 N/A Thread 4-40 UNC-2B 4-40 UNC-2B M3 X M3 X “A” Dim “B” Dim Figure A B Mechanical drawing showing heat sink with clinch nut CLINCH NUT CLINCH NUT INSTALLED AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Studs Solderable Studs Threaded solderable studs are permanently swaged in place for quick pre-assembly with the transistor. The device is placed over the stud s followed by the lock washer and nut. This entire component is then dropped into plated-thru holes in the printed circuit board for wave soldering. The end of the stud is tin-plated for excellent solderability and extends only below a PC board to clear lead trimming saws. "A" "B" ORDERING INFORMATION example 12 digit part 501303B000 _ G example Thermalloy origin part Ordering code A = Model number B = Stud suffix C = RoHS compliant Suffix SE-1 SE-2 SE-3 SE-4 SM-1 SM-3 Ordering code 08 06 09 14 17 07 Dia of PCB thru hole “A” Dim “B” Dim 6-32 6-32 4-40 6-32 M3 x M3 x “C” Dim Figure Note Factory installed only Typical installation FIGURE A FIGURE B HEAT SINK PC BOARD HEAT SINK "C" "C" PC BOARD Device Mounting Studs Device mounting studs for "Thermalloy-origin" items are available as options on certain vertical and board mount heat sinks as a labor-saving aid for mounting semiconductors. This optional feature speeds production assembly time and reduces hardware requirements. ORDERING INFORMATION example 12 digit part 529801B000 _ _G example Thermalloy origin part Ordering code G A = Model number B = Stud suffix B C = RoHS compliant Suffix SF1 SF2 SF3 Ordering code 11 N/A N/A Note Factory installed only “A” Dim “B” Dim 4-40 UNC-2A M3 x 6-32 UNC-2A “C” Dim “D” Dim "A" "D" "B" "C" Mechanical drawing showing heat sink with device mounting studs CL Device Mounting Stud AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Aavid Kool-KlipsTM These one piece stainless steel clips eliminate the need for screws, lock washers and nuts in the assembly process, therefore reducing assembly time and cost. These can be bought separately, or found in the 11th or 12th position when deciphering an Aavid Standard product. Please reference Indexes to see which clips are popular with which product offering. 6801G Clips ORDERING INFORMATION To order clips seperately use part number below. To order a clip as an option use ordering code. example 12 digit part 530101B000 _ G Ordering code Part number 5901G 6801G 7701G Transistor case style TO-220, TO-218 TO-220, TO-218 TO-220, TO-218 TO-220, TO-218 TO-220 TO-220, TO-218 TO-220, TO-218, TO-247 TO-220, TO-218, TO-247 TO-220 Ordering code 50 51 52 53 54 62 Sold separately only Sold separately only Sold separately only Code 50 Code 52 5901G 7701G Code 51 Code 53 Code 54 Code 62 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS Clips Thermal Clips Factory-Installed ONLY thermal clips, available on many standard heat sinks shown below eliminate the use of screws and nuts in assembling the heat sink and transistor. Plastic case transistors slip into place for easy assembly. Thermal clips are available in a variety of configurations. Locking clips have an internal tab to lock the transistor permanently in place. ORDERING INFORMATION example 12 digit part 530600B000 _ G example Ordering code Thermalloy origin part G A = Model number B = Clip suffix C = RoHS compliant Suffix TC1 TC6 TC7 TC10 TC11 TC12 Ordering code Transistor case style TO-220 TO-218, TO-220, Multiwatt N/A TO-218, TO-220, Multiwatt TO-220, TO-218 TO-220 TO-218, TO-220 Clip/Cover features Locking Insulated Locking Insulated Locking TC-1 Code 32 TC-6 Code 36 TC-7 Code N/A TC-10 Code 33 TC-11 Code 34 TC-12 Code 35 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Mounting Kits Mounting Kits • Pre-packaged in heat-sealed plastic bags for use on assembly line. • Stock mounting hardware using one number for better control and identification. • Three different insulating materials available Low cost ThermalfilmTM High temperature Mica High performance ThermalsilTM lll • Other insulator materials available for special order include hard anodized aluminum and aluminum oxide. • Individually packaged for convenient stocking and handling of mounting hardware. Kits contain all hardware necessary to electrically isolate the transistor from the heat sink. TO-220 Mounting kit part number 4880 ORDERING INFORMATION Part number 4880G 4880MG 4880SG Description Kit with ThermalfilmTM Kit with Mica Insulator Kit with ThermalsilTM III EACH KIT INCLUDES: 43-77-9 56-77-9 53-77-9 7721-7PPS MS15795-804 MS35649-244 MS51957-17 MS35338-135 Item Qty Insulator ThermalfilmTM see page 101 Mica see page 103 ThermalsilTM III see page 103 Shoulder washer Flat washer #4 No. 4-40 UNC-2B Hex nut No. 4-40 UNC-2A X 1/2 Long phillips pan head screw Lock washer, No. 4 Note Smooth side of flat washer should be placed against insulator when using the kit. TO-3 Mounting kit part number 4804 ORDERING INFORMATION Part number 4804G 4804MG 4804SG Description Kit with ThermalfilmTM Kit with Mica Insulator Kit with ThermalsilTM III EACH KIT INCLUDES: Item 43-03-2 56-03-2 53-03-2 7721-5PPS MS15795-805 MS35649-264 MS 51957-30 MS35338-136 322-156 Description Insulator ThermalfilmTM see page 101 Mica see page 103 ThermalsilTM III see page 103 Shoulder washer Flat washer #6 No. 6-32 UNC-2B Hex nut No. 6-32 UNC-2A X 1/2 Long phillips pan head screw Lock washer, No. 6 Solder lug Note Smooth side of flat washer should be placed against insulator when using the kit. TRANSISTOR NOT INCLUDED TRANSISTOR NOT INCLUDED AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES ACCESSORIES Insulating Shoulder Washers FEATURES • Available in nylon or polyphenylene sulfide • Chemically inert [no known solvents under 200°C 392°F ] • Maximum recommended service temperature of 260°C 500°F • Recommended torque is 0.565Nm to 0.678Nm 5 to 6 inch-pounds on all shoulder washers except which has recommended torque of 0.452Nm 4 inch-pounds Polyphenylene Sulfide PPS Shoulder Washers FIGURE A FIGURE B Part number 7721-1PPSG 7721-2PPSG 7721-3PPSG 7721-5PPSG 7721-6PPSG 7721-7PPSG* 7721-10PPSG “A” Dim “B” Dim “C" Dim "D" Dim "E" Dim Note A single gate extension, not to exceed in length, is allowable on the outside of all shoulder washers. * Design allows insertion in the tab of a TO-220. ** Also for M3 screw. Nylon Shoulder Washers Screw size 4 6 4** Figure A B ORDERING INFORMATION For standard pre-cut sizes of ThermalfilmTM and ThermafilmTM MT see page ELECTRICAL TYPICAL VALUE 25° C PROPERTY THERMALFILM Dielectric strength 0.03mm 1-mil 240 x 103 volts/mm 6,100 volts/mil Dielectric constant Dissipation factor Volume resistivity 1017 ohm-cm Surface resistivity 1016 ohms Corona start voltage 0.025mm 1-mil 465 volts Insulation resistance megohm mfds. THERMALFILM MT x 103 volts/mm 4500 volts/mm 1017 ohm-cm 1016 ohms 465 volts megohm mfds. Material thickness Ultimate tensile strength MD Bursting strength test Mullen Tear strength initial Density Folding endurance MIT Melting point Zero strength temperature Cut through temperature Service temperature Thermal conductivity Flammability PHYSICAL 0.05mm 0.05mm x 108 Pa 25,000 psi 103 MPa 1500 psi x 105 Pa 45 psi MPa 45 psi 27,559 gm/mm 700 gm/mil gm/cm3 lb/ft3 >10,000 cycles 35,433 gm/mm 900 gm/mil gm/cm3 lb/ft3 >10,000 cycles THERMAL NONE NONE 815ºC 1499ºF 815ºC 1499ºF 435ºC 815ºF 435ºC 815ºF 525ºC 977ºF ORDERING INFORMATION Part number “A” Dim “B” Dim 43-03-2G 43-03-4G “C” Dim “D” Dim ThermalfilmTM information on page 101 Dimensional tolerances are ± 0.38mm hole diameters are ± 0.25mm and angularity is ± 1/2° unless otherwise specified. "D" DIA TYP 2 "C" DIA TYP 2 Thermalfilm for TO-5 and TO-18 ORDERING INFORMATION Part number 43-05-1G 43-05-2G 43-18-1G Device TO-5 TO-5 TO-18 Figure A B A “A” Dim “B” Dim ThermalfilmTM information on page 101 Dimensional tolerances are ± 0.38mm hole diameters are ± 0.25mm and angularity is ± 1/2° unless otherwise specified. “C” Dim FIGURE A "A" FIGURE B "A" DIA TYP 4 Thermalfilm for TO-220, TO-126, Case 77, Case 199, Case 90, TO-218 and TO-3P ORDERING INFORMATION Device 43-77-1G TO-126, Case 77 43-77-2G Case 90, Case 199 43-77-8G Case 90, Case 199 43-77-9G TO-220 46-77-9G* TO-220 43-77-20G TO-220, TO-218, TO-3P “A” Dim “B” Dim “C” Dim * ThermalfilmTM MT part numbers begin with “46” ThermalfilmTM information on page 101 Dimensional tolerances are ± 0.38mm hole diameters are ± 0.25mm and angularity is ± 1/2° unless otherwise specified. “D” Dim "A" "D" DIA "C" DIA TYP 3 AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES Mica and ThermalsilTM III Thermalsil III provides excellent thermal conductivity and electrical resistance. It is used as an electrically-isolating interface material composed of silicone elastomer binder with a thermally conductive filler. It is reinforced with glass cloth to resist tearing and cut-through due to burrs on transistors or heat sinks. Thermalsil III eliminates the need for grease application and conforms to mounting surfaces under clamping pressure for optimum heat conduction. The finely woven glass cloth provides the thinnest possible matrix for enhanced thermal resistance. Thermalsil III is available in any configuration with adhesive backing. Mica insulators provide high maximum operating temperatures 550°C and excellent electrical properties. Insulators Mica and ThermalsilTM III FIGURE A FIGURE B "D" DIA TYP 2 "C" DIA TYP 2 "D" DIA "B" "A" "B" ORDERING INFORMATION 56-77-9G Mica 56-03-2G Mica 53-77-9G ThermalsilTM III 53-03-2G ThermalsilTM III Device TO-220 TO-3 TO-220 TO-3 "A" Dim "B" Dim "C" Dim "D" Dim Figure B A B A TYPICAL PROPERTIES FOR MICA INSULATORS Property Electrical Dielectric strength 172 X 103 volts/mm 4500 volts/mil mm to mm thick in air 1 to 3 mils thick in air Dielectric constant Dissipation factor 106 Hz Volume resistivity 1015 ohm-cm Physical Modules of elasticity in tension 172 X 103 Mpa 25 X 106 psi Tensile strength 310 Mpa 45,000 psi Hardness mohs, shore Compressive strength X 108 Pa 32,000 psi Specific gravity Thermal Thermal conductivity W/ m °C Btu/hr-ft °F Coefficient of thermal expansion X 10-5 °C X 10-5 °F ORDERING INFORMATION Part number Thickness “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim 4103G* 4104G* DIA TYP 4 "C" RAD TYP 2 "D" RAD TYP 2 Aluminum Oxide Ceramic for TO-220 ORDERING INFORMATION Part number Thickness “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim 4169G* 4170G** 4171G** 4177G** "A" "E" DIA Aluminum Oxide Ceramic for TO-218, TO-247, and TO-3P ORDERING INFORMATION Part number Thickness “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim 4180G* "B" "D" "C" "E" AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Insulators Stanchion Pads 8923-1, 8923-2, 8924 Stanchion Pads • Reduces stress on leads during wave solder and post-soldering operations • Provides stable mount to resist shock and vibration damage to leads • 8923-1, 8923-2, and 8924 fit the TO-220 SEE DETAIL "D" 8924 ONLY ORDERING INFORMATION “A” Dim “B” Dim 8923-1G 8923-2G 8924G “C” Dim Note Tolerances ± unless otherwise specified. Material is nylon 6/6 rated 94 V-O DETAIL "D" 8924 ONLY DIA THRU TYP 3 SQ TYP 4 ACCESSORIES AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES Insulating Covers TO-3 Insulating Covers Insulating covers are designed to provide protection from accidental shock during field service or repair. Pan head screws not 51957-30 or equivalent the cover to the TO-3. At the typical mounting screw torque of Nm 6-8 inch pounds , the TO-3 cover material cold-flows around the screw head to securely fasten the cover. Included are No.6 split washers as inserts to provide electrical connection of mounting screws to the TO-3 collector and an insulating snap-in cover for the screw heads. A test probe hole is provided in the top of the cover. The 8903VB is made from thermoplastic polyester that meets the requirements of UL Bulletin 94 V-O. In addition to its excellent flammability rating, thermoplastic polyester offers resistance to most chemical environments, heat deflection temperature to 215.6°C 420°F and UL continuous use temperature of 130°C 266°F . ORDERING INFORMATION Material 8903NWG Nylon 8903VBG Thermoplastic polyester Color White Black Flammability standards Self-extinguishing UL 94 V-2 Self-extinguishing UL 94 V-0 UL 492 Type 1 DIA THRU DIA THRU TYP 2 Teflon-filled Acetal Insulators for TO-3 Part number 103G 109G Fits notch “A” Dim Ø Ø Teflon-filled Acetal Bushings for TO-3 Part number 110G 113G “I.D.” “O.D.” “T” "O.D." "T" "I.D." AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES Mounting Pads FEATURES • Prevent heat damage during soldering • Facilitate board clean-up • Prevent solder bridges • Assure uniform device height PRODUCT INFORMATION Suffix Base material MAXIMUM OPERATING TEMPERATURE Continuous Deflection Color Nylon base resin per ASTM STD D4066-82-PA111 121.0°C 250°F 243.3°C 470°F ORDERING INFORMATION 7717-130G 7717-247G 7717-26G 7717-44G Converts lead spacing from # of Leads For epoxy transistors In-Line TO-92 & TO-15 For TO-18 TO-18 TO-5 TO-18 TO-5 TO-18 TO-5 See pages 108 and 109 for mechanical drawings Outside dia Thickness Index of Semiconductor Mounting Pads ORDERING INFORMATION Part number Leads Outside dia For TO-5 7717-86G 7717-178G 7717-79G 7717-3G 7717-15G 7717-5G 7717-4G For TO-18 7717-16G 7717-18G 7717-108G 7717-89G 7717-7G For integrated circuits 7717-122G 7717-8G 7717-156G Misc. mounting pads 7717-175G Crystal Can Relay / x Thickness See pages 108 and 109 for mechanical drawings AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES Mounting Pads 7717-3G 7717-5G Ø TYP 8 Ø Ø C SINK TYP 4 7717-8G Ø TYP 4 7717-16G B.C. TYP 4 Ø TYP 8 Ø B.C. Ø TYP 8 Ø TYP 4 7717-4G Ø Ø TYP 4 7717-7G ORDERING INFORMATION Aavid Thermalloy code Finish option must be noted by one of the above letters in the 7th position. Aavid's standard finish is black anodize B unless otherwise noted. example 12 digit part A = Base part B = Finish code C = RoHS compliant Thermalloy origin suffix The suffixes should be added after the model number to indicate the desired finish. example Thermalloy origin part 6396B G A = Model number B = Finish suffix C = RoHS compliant Note All thermal graphs reflect black anodize finish. AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES Snap-On Ejectors / Pullers FEATURES • Saves time no roll pin required • Excellent for retrofit applications • Material is nylon per ASTM D4066-82PA162F11 • Cost no more than conventional ejector/puller • Rated at 222.5N 50 lbs. / ejector force per pair • One piece no assembly required • May be heat stamped ORDERING INFORMATION Part number 5021NG Card Ejectors 5021NG Ejector Standard Ejectors / Pullers FEATURES • Lever action releases card from its connector safely and quickly • Cards, their components and connectors are less frequently damaged when extracting PC boards • No special extraction tools are needed for board removal • Material is nylon per ASTM D4066-82 PA120B4413F24, UL 94 V-O rated natural color • Roll pins are provided NAS 561-P3-4 ORDERING INFORMATION Part number 5005-09NG 5005-08NG 5005-25NG Figure A B C FIGURE A 5005-09NG PULLER * DIA TYP 2 *No roll pins provided FIGURE B 5005-08NG SLIM FACE/ FLAT FIGURE C 5005-25NG COMBINATION EJECTOR/PULLER AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES Grease & Epoxy Sil-FreeTM Sil-FreeTM 1020 is a metal-oxide-filled, silicone-free synthetic grease specially formulated to enhance heat transfer across the interface between the semiconductor case and the heat sink without the migration or contamination associated with silicone-based products. Dry interface case-to-sink thermal resistance is typically reduced 50% to 75% with proper application of Sil-FreeTM This virtually "no-bleed", high-performance compound will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to 200°C. Even in a vacuum atmosphere 10-5 Torr, 24 Sil-FreeTM 1020 exhibits virtually "no bleed" or evaporation. ORDERING INFORMATION Package Syringe Tube Jar Size 43 grams oz 57 grams oz 57 grams oz Tube Jar 143 grams oz 457 grams oz Ther-O-LinkTM Ther-O-LinkTM is a silicone-based thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-LinkTM substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. ORDERING INFORMATION Package Size Ampule 1 gram oz Syringe grams oz Tube 57 grams oz Tube 143 grams oz Tube grams oz kg 1 lb kg 5 lb kg 20 lb UltrastickTM Aavid's UltrastickTM is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffinbased thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces. UltrastickTM comes in a convenient applicator bar, allowing for neat, fast application to both heat sink and component surfaces. One cost-effective application leaves a thin, film-like deposit, providing excellent heat transfer and low interface thermal resistance. ORDERING INFORMATION Package Bar Size grams oz PRODUCT INFORMATION Color Thermal conductivity Operating temperature range Volume Weight Dielectric strength Consistency Bleed Specific gravity Shelf life White W/ m-°C -40°C to +200°C 1012 Ohm-cm ± grams 225 volts/mil Paste max % after 24hr 200°C ± Indefinite unopened * * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing PRODUCT INFORMATION Color Thermal conductivity Operating temperature range Volume resistivity Dielectric strength Consistency Bleed Specific gravity Shelf life White W/ m-°C -40°C to +200°C x 1015 Ohm-cm 250 volts/mil Paste max Indefinite unopened * * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing PRODUCT INFORMATION Temperature range Volume resistivity Dielectric strength Consistency Bleed Specific gravity Color Thermal resistance Shelf life -40°C to +200°C X Ohm-cm 250 volts/mil Paste max Opaque White 0.03°C/W per square inch 20 psi 0.02°C/W per square inch 100 psi Indefinite* * Recommended max. storage temperature 40ºC 105ºF AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: ACCESSORIES ThermalcoteTM ThermalcoteTM is a superior thermal joint compound of thermally loaded silicone based grease for use with all heat sinks. It improves the transfer of thermal energy across the metal to metal interfaces between the transistor or rectifier case and the heat sink. ThermalcoteTM conducts heat approximately 15 times better than air and more than 4 times better than unloaded silicone grease. It is non-toxic, extremely stable, and neither cakes or runs from -40° to 204°C -40°F to 399°F . ORDERING INFORMATION Part number 249G 250G 251G 252G 253G Net weight 28 grams 1 oz tube 57 grams 2 oz tube kg 1 lb can 2.27kg 5 lb can kg 10 lb can ThermalcoteTM ll Thermalcote II was developed as the sensible alternative to silicone-based thermal greases. ThermalcoteTM II employs a highly conductive synthetic base fluid that enables the finished product to exhibit the same thermal characteristics as the silicone-based products. Thermalcote II contains no silicone. The high lubricity of the base oil permits efficient application to both semiconductor case or heat sink, and it will effectively fill the microscopic air gaps on the metal-to-metal mating surfaces. It is non-toxic, extremely stable, and neither cakes or runs from -40° to 200°C -40°F to 392°F . ORDERING INFORMATION Part number 349G 350G Net weight 28 grams 1 oz tube 57 grams 2 oz jar 351G kg 1 lb can Grease & Epoxy PRODUCT INFORMATION Color Operating temperature range Thermal conductivity Dielectric strength Cleaning solvent Specific gravity Evaporation 24 392°F , wt% Shelf life Opaque white -40°C to 204°C -40°F to 399°F 0.765W/ m °C Btu/hr ft °F x 103 volts/mm 300 volts/mil mm gap Mineral spirits or turpentine 1 Indefinite unopened * * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing PRODUCT INFORMATION Color Blue Operating temperature range -40°C to 200°C -40°F to 392°F Thermal conductivity 0.699W/ M °C Btu/hr ft °F Dielectric strength x 103volts/mm 200volts/mil mm gap Cleaning solvent Mineral spirits or turpentine Specific gravity 15.6°C Evaporation, 24 392°F , wt% max Shelf life Indefinite unopened * * It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing AMERICA EUROPE USA Tel +1 603 224-9988 email: ASIA Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email: Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email: Grease & Epoxy Ther-O-BondTM Adhesive ORDERING INFORMATION Description Ther-O-BondTM 1500 Ther-O-BondTM 1600 Ther-O-BondTM 1600 Ther-O-BondTM 2000 Package/Kit Resin and hardener 2-Part plastic kit 2-Part plastic kit Adhesive syringe Activator bottle Size liter 1 qt 10gm oz 40gm oz 25ml 13ml ACCESSORIES Ther-O-BondTM 1500 Ther-O-BondTM 1500 is a versatile epoxy casting system developed for high performance, production potting and encapsulating applications where low shrinkage and rapid air evacuation are required. This formulation has a very low surface tension and a flowable viscosity, which affords excellent air release. Ther-O-BondTM 1500 adhers to rigid plastics and laminates, metals and ceramics, has a low coefficient of thermal expansion and is readily machined and shaped with ordinary shop tools. The fully cured epoxy system is an excellent electrical insulator which provides good resistance to electrolysis, leakage and corrosion room water, weather, gases and chemical compounds. HANDLING CHARACTERISTICS Mix ratio by weight, resin to hardener Mixed viscosity 25°C, cps Work-life 25°C Gel time 25°C 100 to 15 1000 - 1500 45 Minutes 3-6 Hours Cure schedule 25°C Cure schedule 65°C Cure schedule 100°C 8 Hours 1 Hour Ther-O-BondTM 1600 For smaller applications, Ther-O-BondTM 1600 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic smooth paste thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. Ther-O-bondTM 1600 bonds readily to itself, to metals, silica, steatie, alumina, sapphire and other ceramics, glass, plastics and many other materials because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. HANDLING CHARACTERISTICS Mix ratio by weight, resin to hardener: 100 to 5 Mixed viscosity 25°C, cps Work-life 25°C Gel time 25°C Cure schedule 25°C Cure schedule 65°C 33,000 45 Minutes 3-6 Hours 8 Hours 1 Hour Cure schedule 100°C Hour PHYSICAL PROPERTIES Color Specific gravity Operating temp, °C Heat distortion temp, °C Hardness, shore D Thermal conductivity W/ m°C Compressive strength, psi Dissipation factor, Self extinguishing C.T.E. ppm/°C Tensile strength Dielectric Shelf life Black -60 to 155 100 88 14,000 yes 25 9200 psi 800 18 months* * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. Ther-O-BondTM 2000 Ther-O-BondTM 2000 acrylic adhesive cures rapidly at room temperature, while providing a repairable, thermally conductive bond. PHYSICAL PROPERTIES Color Specific gravity Operating temp, °C Hardness, shore D Izod impact, F1 Lbs/Inch of notch Thermal conductivity W/ m-°C.T.E. ppm/°C Tensile strength Tensile lap shear, psi Dielectric strength volts/mil Dielectric constant 1 KHz 25°C Dissipation factor, 25°C Shelf life Blue -70 to 115 90 25 9200 psi 2900 410 18 months* PRODUCT INFORMATION Color Thermal conductivity W/ m-°C.T.E. ppm/°C Tensile strength Dielectric strength volts/mil Shelf life White 25 2360 psi 220 18 months* * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. AMERICA EUROPE ORDERING INFORMATION Net weight 4949G oz 25 gram kit 4950G oz 50 gram kit 4951G oz 100 gram kit 4952G oz 200 gram kit 4953G 4 lbs 1814 grams MIXING INSTRUCTIONS Mix resin thoroughly before removing material. Add parts of RT-7 hardener to 100 parts of resin by weight, or 17 parts of RT-7 hardener to 100 parts of resin by volume. Adhesive will set up in: 24 hrs at 25°C 77°F 2 hrs. at 65°C 149°F 1 hr. at 100°C 212°F 30min. at 130°C 266°F Note For maximum electrical and physical properties, a post cure is neccessary. Post cure at room temperature for 4 days or for 4 hours at 93°C 200°F . HANDLING CHARACTERISTICS Typical electrical and physical properties at room temperature with RT-7 hardener Color Green Specific gravity Working viscosity 25,000 cps Thermal conductivity 1.34W/ m °C Btu/hr •ft• °F Thermal resistivity 29.4°C in/watt Tensile strength x 107 Pa 9,2000 psi Compressive strength x 108 Pa 20,9000 psi Bond shear strength aluminum to aluminum, 25.4mm 1" overlap 25°C, 77°F x 107 Pa 4,6000 psi Thermal coefficient of expansion 24 x 10-6/°C x 10-6/°F Water absorption, % after 10 25°C 77°F Hardness, Shore D Volume resistivity x 1016 Dielectric strength |
| More datasheets: 116600F00000 | 4804 REV D-G | 4804M REV D-G | 8223-CL03 | 115600F00000 | 115900F00000 | 4804S REV D-G | 116100F00000 | MAX15NG | 115100F00000G |
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