7717-21DAPG

7717-21DAPG Datasheet


Part Number 574102B03300G 574204B03300G 574402B03200G 574502B03300G 574602B03300G 574802B03300G 574902B03300G 576802B03100G 576802B04000G 576802V03100G 576802V04000G 576802U03100G 576802U04000G 577002B04000G 577102B04000G 577202B04000G 578622B03200G 579604B03300G 579704B03300G 579802B03300G 579902B03300G 581001B02500G

Part Datasheet
7717-21DAPG 7717-21DAPG 7717-21DAPG (pdf)
Related Parts Information
563202D00000G 563202D00000G 563202D00000G
502403B00000 502403B00000 502403B00000
2281B 2281B 2281B
519703B00000G 519703B00000G 519703B00000G
568115B00000 568115B00000 568115B00000
500503B00000G 500503B00000G 500503B00000G
2333B 2333B 2333B
520103B00000G 520103B00000G 520103B00000G
1116BG 1116BG 1116BG
519803B00000G 519803B00000G 519803B00000G
6261B-MT5G 6261B-MT5G 6261B-MT5G
6382BG 6382BG 6382BG
2285B 2285B 2285B
B-375-120-62G B-375-120-62G B-375-120-62G
116600F00000 116600F00000 116600F00000
4804 REV D-G 4804 REV D-G 4804 REV D-G
4804M REV D-G 4804M REV D-G 4804M REV D-G
8223-CL03 8223-CL03 8223-CL03
115600F00000 115600F00000 115600F00000
115900F00000 115900F00000 115900F00000
4804S REV D-G 4804S REV D-G 4804S REV D-G
116100F00000 116100F00000 116100F00000
MAX15NG MAX15NG MAX15NG
115100F00000G 115100F00000G 115100F00000G
MAX23NG MAX23NG MAX23NG
110500F00000G 110500F00000G 110500F00000G
7701G 7701G 7701G
MAX04-HNG MAX04-HNG MAX04-HNG
8909NBG 8909NBG 8909NBG
7721-12N 7721-12N 7721-12N
MAX11NG MAX11NG MAX11NG
115200F00000G 115200F00000G 115200F00000G
CLP-214G CLP-214G CLP-214G
1130B 1130B 1130B
TV-4G TV-4G TV-4G
6230B-TTG 6230B-TTG 6230B-TTG
576802B00000 W/TAB038326 576802B00000 W/TAB038326 576802B00000 W/TAB038326
576203B00000G 576203B00000G 576203B00000G
6273B 6273B 6273B
575502B00000G 575502B00000G 575502B00000G
575400B00000G 575400B00000G 575400B00000G
591302B04000G 591302B04000G 591302B04000G
501000B00000G 501000B00000G 501000B00000G
574802B00000G 574802B00000G 574802B00000G
592502B00000G 592502B00000G 592502B00000G
335314B00000G 335314B00000G 335314B00000G
508600B00000G 508600B00000G 508600B00000G
6109BG 6109BG 6109BG
7129DG 7129DG 7129DG
566902B04000G 566902B04000G 566902B04000G
7024BG 7024BG 7024BG
574402B00000G 574402B00000G 574402B00000G
573902B03900G 573902B03900G 573902B03900G
6271B 6271B 6271B
575300B00000G 575300B00000G 575300B00000G
513101B00000 513101B00000 513101B00000
513002B00000 513002B00000 513002B00000
566902B00000G 566902B00000G 566902B00000G
7717-30N 7717-30N 7717-30N
7717-79NG 7717-79NG 7717-79NG
7717-175NG 7717-175NG 7717-175NG
7717-19N 7717-19N 7717-19N
7717-30DAP 7717-30DAP 7717-30DAP
7717-6DAP 7717-6DAP 7717-6DAP
56-77-2G 56-77-2G 56-77-2G
7717-245N 7717-245N 7717-245N
7717-129DAP 7717-129DAP 7717-129DAP
7717-44DAPG 7717-44DAPG 7717-44DAPG
7717-86DAPG 7717-86DAPG 7717-86DAPG
7717-26DAPG 7717-26DAPG 7717-26DAPG
7717-114N 7717-114N 7717-114N
7717-10DAP 7717-10DAP 7717-10DAP
7717-156NG 7717-156NG 7717-156NG
7717-46DAP 7717-46DAP 7717-46DAP
7717-149N 7717-149N 7717-149N
7717-239N 7717-239N 7717-239N
7717-15NG 7717-15NG 7717-15NG
7717-152N 7717-152N 7717-152N
7717-8NG 7717-8NG 7717-8NG
7717-44NG 7717-44NG 7717-44NG
7717-155N 7717-155N 7717-155N
7717-133DAP 7717-133DAP 7717-133DAP
7717-8DAPG 7717-8DAPG 7717-8DAPG
7717-6N 7717-6N 7717-6N
7717-4NG 7717-4NG 7717-4NG
7717-139N 7717-139N 7717-139N
7717-46N 7717-46N 7717-46N
7717-79DAP 7717-79DAP 7717-79DAP
7717-86NG 7717-86NG 7717-86NG
7717-7NG 7717-7NG 7717-7NG
7717-122DAPG 7717-122DAPG 7717-122DAPG
56-02-10 56-02-10 56-02-10
7717-89DAPG 7717-89DAPG 7717-89DAPG
56-77-20G 56-77-20G 56-77-20G
7717-3DAPG 7717-3DAPG 7717-3DAPG
7717-89NG 7717-89NG 7717-89NG
7717-15DAPG 7717-15DAPG 7717-15DAPG
56-02-93 56-02-93 56-02-93
43-18-1G 43-18-1G 43-18-1G
7717-43DAP 7717-43DAP 7717-43DAP
7717-18DAPG 7717-18DAPG 7717-18DAPG
43-05-2G 43-05-2G 43-05-2G
56-02-20 56-02-20 56-02-20
43-02-4G 43-02-4G 43-02-4G
7717-112DAP 7717-112DAP 7717-112DAP
7717-94N 7717-94N 7717-94N
43-05-1G 43-05-1G 43-05-1G
7717-5DAPG 7717-5DAPG 7717-5DAPG
7717-149DAP 7717-149DAP 7717-149DAP
7717-130NG 7717-130NG 7717-130NG
7717-153N 7717-153N 7717-153N
56-77-9G 56-77-9G 56-77-9G
7717-3NG 7717-3NG 7717-3NG
568403B00000 568403B00000 568403B00000
321127B00000 321127B00000 321127B00000
2268B 2268B 2268B
2207/PR11B ASSY 2207/PR11B ASSY 2207/PR11B ASSY
2207/PR11B-2 ASSYG 2207/PR11B-2 ASSYG 2207/PR11B-2 ASSYG
622851F00000 622851F00000 622851F00000
2240B ASSY 2240B ASSY 2240B ASSY
782653B01000G 782653B01000G 782653B01000G
2321BG 2321BG 2321BG
2342B 2342B 2342B
6260B-MT5 6260B-MT5 6260B-MT5
567103B00000 567103B00000 567103B00000
553003B00000 553003B00000 553003B00000
560700B00000 560700B00000 560700B00000
529901B00000 529901B00000 529901B00000
508222B00000 508222B00000 508222B00000
6381BG 6381BG 6381BG
506003B01300 506003B01300 506003B01300
530801B05100G 530801B05100G 530801B05100G
550202D00000G 550202D00000G 550202D00000G
502303B00000 502303B00000 502303B00000
579003B00000G 579003B00000G 579003B00000G
505303B00000G 505303B00000G 505303B00000G
576303B00000G 576303B00000G 576303B00000G
2332BG 2332BG 2332BG
500303B00000G 500303B00000G 500303B00000G
2334BG 2334BG 2334BG
6032DG 6032DG 6032DG
530001B00000 530001B00000 530001B00000
533701B02552G 533701B02552G 533701B02552G
529801B02100G 529801B02100G 529801B02100G
580300B00000G 580300B00000G 580300B00000G
335214B00000G 335214B00000G 335214B00000G
513101B02500G 513101B02500G 513101B02500G
2328BG 2328BG 2328BG
530614B05300G 530614B05300G 530614B05300G
529902B00000 529902B00000 529902B00000
550302B00000 550302B00000 550302B00000
7106D/TRG 7106D/TRG 7106D/TRG
6239BG 6239BG 6239BG
6399B-P2G 6399B-P2G 6399B-P2G
533202B02500G 533202B02500G 533202B02500G
533201B02500G 533201B02500G 533201B02500G
550102B00000 550102B00000 550102B00000
335814B00000G 335814B00000G 335814B00000G
550402B00000 550402B00000 550402B00000
574802B03700G 574802B03700G 574802B03700G
513302B02500G 513302B02500G 513302B02500G
533002B02500G 533002B02500G 533002B02500G
529801B00000 529801B00000 529801B00000
581102B00000 581102B00000 581102B00000
532602B00000 532602B00000 532602B00000
566102B00000G 566102B00000G 566102B00000G
6000DG 6000DG 6000DG
580100W00000G 580100W00000G 580100W00000G
7130DG 7130DG 7130DG
533522B02552G 533522B02552G 533522B02552G
533302B02551G 533302B02551G 533302B02551G
502203B00000 502203B00000 502203B00000
566010B02800G 566010B02800G 566010B02800G
581002B02100G 581002B02100G 581002B02100G
6045B 6045B 6045B
335314B00032G 335314B00032G 335314B00032G
533402B02500G 533402B02500G 533402B02500G
7021B-MT6G 7021B-MT6G 7021B-MT6G
552703B00000 552703B00000 552703B00000
6038DG 6038DG 6038DG
6232B-MTG 6232B-MTG 6232B-MTG
335214B00032G 335214B00032G 335214B00032G
533722B02552G 533722B02552G 533722B02552G
552844B00000 552844B00000 552844B00000
552803B00000G 552803B00000G 552803B00000G
584000B03300G 584000B03300G 584000B03300G
533602B02500G 533602B02500G 533602B02500G
533202B02551G 533202B02551G 533202B02551G
530802B05100G 530802B05100G 530802B05100G
325705R00000G 325705R00000G 325705R00000G
7717-5NG 7717-5NG 7717-5NG
7717-7DAPG 7717-7DAPG 7717-7DAPG
7717-18NG 7717-18NG 7717-18NG
534302B03553G 534302B03553G 534302B03553G
6230DG (COPPER) 6230DG (COPPER) 6230DG (COPPER)
504222B00000G 504222B00000G 504222B00000G
7109D/TRG 7109D/TRG 7109D/TRG
576802B03700G 576802B03700G 576802B03700G
7106DG 7106DG 7106DG
501100B00000G 501100B00000G 501100B00000G
591302B02800G 591302B02800G 591302B02800G
529802B00000 529802B00000 529802B00000
320205B00000G 320205B00000G 320205B00000G
568300B00000 568300B00000 568300B00000
2227B 2227B 2227B
7721-10PPSG 7721-10PPSG 7721-10PPSG
7721-15NG 7721-15NG 7721-15NG
7721-3PPSG 7721-3PPSG 7721-3PPSG
7721-6PPSG 7721-6PPSG 7721-6PPSG
7721-13NG 7721-13NG 7721-13NG
7721-11NG 7721-11NG 7721-11NG
7717-107DAP 7717-107DAP 7717-107DAP
7717-156DAPG 7717-156DAPG 7717-156DAPG
7717-175DAPG 7717-175DAPG 7717-175DAPG
B-470-235-40 B-470-235-40 B-470-235-40
43-02-37G 43-02-37G 43-02-37G
118300F00000G 118300F00000G 118300F00000G
MAX09NG MAX09NG MAX09NG
MAX01NG MAX01NG MAX01NG
MAX07NG MAX07NG MAX07NG
7721-7PPSG 7721-7PPSG 7721-7PPSG
4880G 4880G 4880G
4880MG 4880MG 4880MG
125800D00000G 125800D00000G 125800D00000G
125700D00000G 125700D00000G 125700D00000G
115000F00000G 115000F00000G 115000F00000G
4880SG 4880SG 4880SG
MAX13NG MAX13NG MAX13NG
MAX08NG MAX08NG MAX08NG
116200F00000G 116200F00000G 116200F00000G
MAX04NG MAX04NG MAX04NG
115300F00000G 115300F00000G 115300F00000G
MAX12NG MAX12NG MAX12NG
CLP-212G CLP-212G CLP-212G
MAX03-HNG MAX03-HNG MAX03-HNG
MAX01-HNG MAX01-HNG MAX01-HNG
MAX02-HNG MAX02-HNG MAX02-HNG
MAX10NG MAX10NG MAX10NG
MAX02NG MAX02NG MAX02NG
MAX03NG MAX03NG MAX03NG
PDF Datasheet Preview
TABLE OF CONTENTS

Table of Contents

General Information How to Use This Standard Part Index by Part 3 Index by Device and Thermal Index by Style and Thermal How to Select a Heat How to Read a Thermal

Board Mounted Heat Sinks Heat Sinks for IC Packages Surface Mount Discrete Semiconductor Packages 24 SMT 26 Thru-Hole Discrete Semiconductor Packages TO-220 and TO-220, TO-218, and TO-220 and 59 TO-220, TO-218, TO-247, and 62 65 68 74 Axial Lead Bridge 77

Options Table of How to Decipher an Aavid 12 Digit Part 80 How to Decipher a "Thermalloy" Origin Part Index A, B, C = Aavid Standard Parts Index D = "Thermalloy" Origin Parts 85

Interface Materials In-Sil , Kondux , 86 Alignment 87 Double Sided Tape Options Factory 88

Labor Saving Heat Sink to Board and Semiconductor Mounts Wave-On Mounts, Semiconductor Mounts, Shur-Lock Tabs, Solderable Tabs, Solderable Nuts, Clinch Nuts, Solderable Studs, Device Mounting

Clips 97 Thermal

Accessories Mounting 99 Insulating Shoulder 100 and Thermalfilm and Thermasil Insulating Washers/Aluminum Insulating Stanchion 105 Insulating Mounting 110 Card Ejectors & 111 Thermal Greases and

AMERICA USA Tel +1 603 224-9988 email:

ASIA Singapore Tel +65 6362 8388 email:

EUROPE Italy Tel +39 051 764011 email:

Taiwan Tel +886 2 2698-9888 email:

United Kingdom Tel +44 1793 401400 email:

GENERAL INFORMATION

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

How to Use This Catalog

Base part number

Semiconductor device

Style description for heat sink

TO-220 Heat Sinks
7022

Channel style heat sink with folded back fins

Semiconductor devices have been included in photos to assist in determining mounting
position.

Thermal graphs show natural and forced convection based on black anodize finish. For information on how to use a thermal graph,
please refer to page

Icons indicate that a mounting kit, grease or epoxy can be used
with the heat sink

Grease Epo& xy page112

Mounting Kits page 99

Mechanical drawing dimensions as shown
are mm inches

Detailed description illustrates the heat sink’s differentiating features.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
Ordering information will specify the base heat sink with
available accessories.
ORDERING INFORMATION

Part Number 7022BG 7022PBG 7022B-MTG 7022PB-MTG

Description Channel heat sink with folded back fins Channel heat sink with folded back fins With solderable tabs With solderable tabs

Finish Black anodize Pre-black anodize* Black anodize Pre-black anodize*

Dia of PCB Plated Thru Hole for Tabs
* Edges cut during the manufacturing process will be unfinished. See page XX for more information

POPULAR OPTIONS 7022B-

Base part no. A RoHS Compliant

Position Code Description

Location

TC11-MT Insulated device mounting clip for T0-220 and solderable tabs Hole X

Details Page

For additional options see page xx

Material and finish information is shown
for each part

Material Thick Aluminum Finish See Table

Aavid has a large selection of popular options to enhance your heat sink selection. This section will indicate the most popular
options available.

Detailed indexes are available to select additional options.

AMERICA USA Tel +1 603 224-9988 email:

ASIA Singapore Tel +65 6362 8388 email:

EUROPE Italy Tel +39 051 764011 email:

Taiwan Tel +886 2 2698-9888 email:

United Kingdom Tel +44 1793 401400 email:

INDEX
10-5597-02G
10-5597-22G
10-5597-33G
10-5607-04G
10-5607-05G
10-5634-01G
10-6326-27G
10-6326-28G
10-6327-01G
10-BRD1-01G
10-BRD1-03G
10-BRD1-04G
10-BRD1-05G
10-BRD1-07G
10-BRD2-01G
10-CLS1-01G
ORDERING INFORMATION

IC Pkg Size mm IC Pkg Style
23 x 23
23 x 23
23 x 23
27 x 27
27 x 27
27 x 27
35 x 35

Flip chip
35 x 35

Flip chip
35 x 35
35 x 35
35 x 35

Flip chip

Flip chip

Flip chip

Flip chip

Flip chip

Flip chip
40 x 40
40 x 40
42 x 40

Flip chip

Flip chip

Part Number “W” mm
374024B60023G
374124B60023G
374224B60023G
374324B60023G
374424B60023G
374524B60023G
10-5634-01G
10-THMA-01G
374624B60024G
374724B60024G
374824B60024G
10-BRD2-01G
10-BRD1-01G
10-BRD1-03G
ORDERING INFORMATION

IC Pkg. Size mm 28 x 28 x 28 x 28 35 x 35 x 45 x 45 x 45 x 45

Part Number “W” mm
10-6326-27G
10-6326-28G
10-6327-01G
10-TNT2-01G
10-5597-02G
10-5597-22G
10-5597-33G
10-5607-04G
10-5607-05G
372924M02000G
10-L4LB-03G
10-L4LB-05G
10-L4LB-11G
“L” mm
“H” mm
“S” mm
“T” mm

Push pin mechanical drawings and board mounting drawings see page 15 Natural convection thermal resistance based on a 75° C heat sink temperature rise. Forced convection thermal resistance based on an entering m/s 200LFM airflow.

Finish Black anodize Black anodize Black anodize Black anodize Green anodize Gold anodize Gold anodize Black anodize Black anodize Green anodize Black anodize Black anodize Black anodize

Fig. PCB Fig.1 Pin Style Pad

Plastic

Brass

Plastic

Plastic

Plastic

Plastic

Brass

Plastic

Brass

Plastic

Plastic

Brass

Plastic

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

ASIA

Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email:
ORDERING INFORMATION

IC Pkg. Size mm IC Pkg. Style
10 x 10

Plastic
15 x 15

Plastic
23 x 23

Plastic
23 x 23

Plastic
23 x 23

Plastic
25 x 25

Plastic
27 x 27

Plastic
27 x 27

Plastic
27 x 27

Plastic
28 x 28

Plastic
28 x 28

Plastic
31 x 31

Plastic
35 x 35

Plastic
35 x 35

Plastic
35 x 35

Plastic
35 x 35

Plastic
35 x 35

Plastic
40 x 40

Plastic
40 x 40

Plastic
40 x 40
ORDERING INFORMATION

IC Pkg. Size mm IC Pkg. Style
10 x 10

Metal / Ceramic
23 x 23

Metal / Ceramic
23 x 23

Metal / Ceramic
23 x 23

Metal / Ceramic
25 x 25

Metal / Ceramic
27 x 27

Metal / Ceramic
27 x 27

Metal / Ceramic
27 x 27

Metal / Ceramic
27 x 27

Metal / Ceramic
28 x 28

Metal / Ceramic
28 x 28

Metal / Ceramic
28 x 28

Metal / Ceramic
31 x 31

Metal / Ceramic
31 x 31

Metal / Ceramic

Metal / Ceramic
35 x 35

Metal / Ceramic
35 x 35

Metal / Ceramic
35 x 35

Metal / Ceramic
35 x 35

Metal / Ceramic
35 x 35

Metal / Ceramic
ORDERING INFORMATION

IC Pkg. Size mm 27 x 27 35 x 35 x

Part Number 2317B-EP11-BGS1G 2518B-EP11-BGS2G 2519B-EP11-BGS5G 2520B-EP04-BGS5G 2522B-EP04-BGS5G
“W” mm
“L” mm
“H” mm

IC Pkg. Style All

Natural convection thermal resistance based on a 75° C heat sink temperature rise. Forced convection thermal resistance based on an entering m/s 200LFM airflow.

Interface

Clip

EP11

BGS1

EP11

BGS2

EP11

BGS5

EP04

BGS5

EP04

BGS5

THERMALCOTETM GREASE

TAPE TYPE AND INTERFACE MATERIAL INFORMATION

Material EP11 EP04

Description ThermalcoteTM grease with release liner ThermalcoteTM grease with release liner

Adhesive None

Thermal Resistance

Color White

For more information on ThermalcoteTM see page

Carrier None

PULL TAB "D"
“D” Dim
“E” Dim

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

ASIA

Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email:

HEAT SINKS FOR IC PACKAGES

Bi Directional

BGA Bi Directional

Designed for applications with airflow traveling in a single direction, these heat sinks are suitable for a variety of standard square IC packages. Models are available with pre-applied thermal tape for easy attachment to the IC. Epoxy attach models are also available.
ORDERING INFORMATION

IC Pkg Size IC Pkg Style
10 X 10
615653B00250G
10 X 10
709203B00400G
24 X 24

Metal
335114B00032G
25 X 25

Metal
335214B00032G
25 X 25

Metal
335211B00032G
25 X 25
25 X 25
25 X 25

Plastic
335214B00034G
27 X 27

Plastic
335314B00035G
27 X 27

Metal
335314B00032G
27 X 27
28 X 28
700353U01100G
30 X 30
30 X 30
30 X 30

Metal
335814B00032G
30 X 30

Metal
335714B00032G
799403B01500G
“W” mm
“L” mm
“H” mm
ORDERING INFORMATION

Finish

Black anodize Black anodize with black paint on bottom side
5010

Angle fin heat sink

Angle fin heat sink is a simple low cost solution for cooling DIP devices. Suitable for 14 and 16 pin packages and available in two finish options. Easily attaches using thermal epoxy.
0 100

Air Per Minute 200 400 600 800

Heat
1000 100
ORDERING INFORMATION

Finish Pre black anodize* Black anodize
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information.
5602, 5802 Slide on heat sink with angled fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

LOCKING CATCH

Material Thick Aluminum Finish See Table

Grease Epo& xy page112

Material Thick Aluminum Finish See Table

Slide on heat sink with angled fins attaches to 14 and 16 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Part Number Device Pkg Style

Ceramic

Ceramic

Plastic

Plastic

Finish Black anodize Black anodize with black paint on bottom side Black anodize Black anodize with black paint on bottom side
“A” Dim

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

LOCKING CATCH

Material Thick Aluminum Finish See Table

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

ASIA

Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email:

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5806

Slide on heat sink with staggered fins

Slide on heat sink with staggered fins attaches to 28 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Description Slide on heat sink with staggered fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

DIPS

LOCKING CATCH

Material Thick Aluminum Finish Black Anodize
5803

Slide on heat sink with staggered fins

Slide on heat sink with staggered fins attaches to 18 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Slide on heat sink with staggered fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

LOCKING CATCH

Material Thick Aluminum Finish Black Anodize

AMERICA EUROPE

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

DIPS
5804

Slide on heat sink with staggered fins

Slide on heat sink with staggered fins attaches to 20 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Slide on heat sink with staggered fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

LOCKING CATCH

Material Thick Aluminum Finish Black Anodize
5805

Slide on heat sink with staggered fins

Slide on heat sink with staggered fins attaches to 24 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Slide on heat sink with staggered fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

LOCKING CATCH

Material Thick Aluminum Finish Black Anodize

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5085, 5086, 5087

Extruded epoxy attach on heat sink with straight fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Extruded epoxy attach on heat sink with straight fins attaches to 24, 28, and 40 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required.
ORDERING INFORMATION

Part Number DIP Package “A” Dim
24 pin
28 pin
40 pin

For epoxy information see pages
0 100
0 508700 508600 508500

Air Per Minute 200 400 600 800

Heat
1000 20
6284

Extruded epoxy attach heat sink

DIPS

Grease Epo& xy page112
"A" Material Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
0 100

Extruded epoxy attach heat sink
which requires no additional board
space is suitable for narrow DIP
packages. May be added before
or after final board assembly. No
additional board space is required.

Attaches to 28 pin DIP.
ORDERING INFORMATION

Part Number 6284BG

Description Extruded epoxy attach heat sink for 28 pin DIP

For epoxy information see pages

Air Per Minute 200 400 600 800

Heat
1000 25
5011, 5012

Extruded epoxy attach heat sink with straight fins

Material Aluminum Finish Black Anodize

Grease Epo& xy page112

FIGURE A

Extruded epoxy attach heat sink with straight fins attaches to 14 and 16 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. Available in two fin directions.
ORDERING INFORMATION

Figure

Extruded epoxy attach heat sink with straight fins A Extruded epoxy attach heat sink with straight fins B

For epoxy information see pages

FIGURE B

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Aluminum Finish Black Anodize
0 100
501100 501200

Air Per Minute 200 400 600 800

Heat
1000 100

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5731 Surface mount heat sink for D-PAK TO-252 package semiconductors

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

Surface mount heat sink for D-PAK TO-252 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.
ORDERING INFORMATION

Packaging
573100D00010G 13" Reel, 250 per reel

Bulk, 500 per bag

See page 25 for tape and reel information
0 100

Air Per Minute 200 400 600 800

Heat
1000 25

Case Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Copper Finish Tin Plated

Refer to Figure A and B on page 26 for board footprint information
5733 Surface mount heat sink for D2 PAK TO-263 package semiconductors

Surface mount heat sink for D2 PAK TO-263 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.
ORDERING INFORMATION

Part Number 573300D00010G

Packaging 13" Reel, 250 per reel Bulk, 500 per bag

See page 25 for tape and reel information

Air Per Minute 200 400 600 800

Heat
1000 20
16 12

Case Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Copper Finish Tin Plated

Refer to Figure A and B on page 26 for board footprint information
7106 Surface mount heat sink for D2 PAK TO-263 , power SO-10 MO-184 and SO-10 package semiconductors

Surface mount heat sink for D2 PAK TO-263 , power SO-10 MO-184 and SO-10 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.
ORDERING INFORMATION

Part Number Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG

Bulk, 500 per bag

See page 25 for tape and reel information
0 100

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Copper Finish Tin Plated

Refer to Figure C on page 26 for board footprint information

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7109 Surface mount heat sink for D2 PAK TO-263 package semiconductors

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Surface mount heat sink for D2 PAK TO-263 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.
ORDERING INFORMATION

Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG

Bulk, 500 per bag

See below for tape and reel information
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
5734 Surface mount heat sink for D3 PAK TO-268 package semiconductors

Refer to Figure D on page 26 for board footprint information

Material Thick Copper Finish Tin Plated

Surface mount heat sink for D3 PAK TO-268 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.
ORDERING INFORMATION

Part Number 573400D00010G

Packaging 13" Reel, 250 per reel Bulk, 500 per bag

See below for tape and reel information

Tape and Reel information

Air Per Minute 200 400 600 800

Heat
1000 20
16 12

Case Temp Rise Above Thermal Resistance From MTG Surface to

Refer to Figure A and B on page 26 for board footprint information

Material Thick Copper Finish Tin Plated
ORDERING INFORMATION
“A” Dim
7106D/TRG
7109D/TRG
573100D00010G
573300D00010G
573400D00010G
“B” Dim
“C” Dim
“D” Dim

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SMT Footprints

FIGURE A Recommended copper heat speader drain pad footprint

Note The thickness of the drain pad is variable depending on the amount of heat generated by the SMT device, design limitations and process.

Part Number 573100 573300 573400
“L”
“W”

FIGURE B Recommended heat sink solder mask opening

W1 W2

Part Number “L”
573100
573300
573400
“W1”
“W2”

FIGURE C

Recommended copper pad size for heat sink and device mounting footprint

FIGURE D

Recommended copper pad size for heat sink and device mounting footprint

For D Pak TO-263

For MO-184 and SO-10

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ORDERING INFORMATION

Part Number Description
7025BG

Channel heat sink with no solderable tabs
7025B-MTG

With solderable mounting tabs

For additional options see page 85

Dia of PCB Plated Thru Hole for Tabs
7019 Narrow channel style heat sink with folded back fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99
0 100

Air Per Minute 200 400 600 800

Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Heat
ORDERING INFORMATION

Part Number 7019BG

Finish

Channel heat sink with no solderable tabs Black anodize
7019PBG 7019B-MTG

Channel heat sink with no solderable tabs Pre black anodize*

With solderable tabs

Black anodize

Dia of PCB Plated Thru Hole for Tabs
*Edges cut during the manufacturing process will be unfinished. See page 110 for more information

For additional options see page 85
1000 10
2 0 10
7020 Narrow channel style heat sink with folded back fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Aluminum Finish See Table

Grease Epo& xy page112

Mounting Kits page 99

Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description
7020BG

Narrow channel heat sink with no solderable tabs
7020B-MTG

With solderable tabs

Dia of PCB Plated Thru Hole for Tabs

POPULAR OPTIONS 7020B- G

Base part no. A

Position Code

TC10-MT Insulating device mounting clip
and solderable tabs

For additional options see page 85

Location Hole X

Details Page 93, 98

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Black Anodize

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Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

TO-220 Heat Sinks
7021 Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 10
ORDERING INFORMATION

Dia of PCB Plated Thru Hole for Tabs
7021BG

Channel heat sink with no solderable tabs
7021B-MTG

With solderable tabs

POPULAR OPTIONS 7021B- G

Base part no. A

Position A

Code TC10-MT

MT5 MT6 TC10-MT5

Description Locking device mounting clip and solderable tabs Bifurcated tabs with stand off Bifurcated tabs with stand off Locking device mounting clip and bifurcated tabs

Location Details Hole X Page 93, 98 Page 93 Page 93 Hole X Page 93, 98

For additional options see page 85

Grease Epo& xy page112

Mounting Kits page 99

Material Thick Aluminum Finish Black Anodize

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
7023 Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 10
ORDERING INFORMATION

Part Number 7023BG 7023B-MTG

Description Channel heat sink with no solderable tabs With solderable tabs

Dia of PCB Plated Thru Hole for Tabs

POPULAR OPTIONS 7023B-

Base part no. A

Position Code Description

Location Details

TC6-MT Locking device mounting clip and solderable tabs Hole X Page 93, 98

TC7-MT Insulating device mounting clip and solderable tabs Hole X Page93, 98

For additional options see page 85

Grease Epo& xy page112
2x THRU

Mounting Kits page 99

SECTION A-A

Material Thick Aluminum Finish Black Anodize

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7022

Channel style heat sink with folded back fins

TO-220 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20
ORDERING INFORMATION

Part Number Description
7022BG

Channel heat sink with no solderable tabs
7022PBG

Channel heat sink with no solderable tabs
7022B-MTG

With solderable tabs
7022PB-MTG With solderable tabs
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information

Finish Black anodize Pre black anodize* Black anodize Pre black anodize*

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish See Table

POPULAR OPTIONS 7022B- G

Base part no. A

Position

Code

TC11-MT Insulated device mounting clip for T0-220 and solderable tabs

For additional options see page 85

Location Hole X

Details Page 93, 98
5510

High performance channel style heat sink with folded back fins

Grease Epo& xy page112

Mounting Kits page 99

High performance channel style heat sink with folded back fins for greater cooling capacity in a minimum of space when mounted horizontally. Folded back fin design maximizes surface area without increasing the vertical space required by the heat sink.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number Description High performance channel style heat sink with folded back fins

POPULAR OPTIONS 551002B0 00 00G

Base part no. A

Position A

Code 01
6-32 Wave On threaded insert stand off

Details Page 89

For additional options see page 82

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Aluminum Finish Black Anodize

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

TO-220 Heat Sinks
6021, 6221

Channel style heat sink with straight fins

FIGURE A

FIGURE B

WIDE X LONG SLOT

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink with straight fins features integrated solderable tabs for easy mounting to the printed circuit card. Available with a single device mounting hole or slotted hole to accomodate varying device lead lengths.
"B" "A"

Material Thick Aluminum Finish See Table
0 100

Air Per Minute 200 400 600 800
1000 10
ORDERING INFORMATION

Part Number Description

Finish

Dia of PCB

Heat

Plated Thru

Figure Hole for Tabs
“A” Dim
“B” Dim
6021BG

Channel heat sink with straight fins and integrated tabs Black anodize
6021PBG

Channel heat sink with straight fins and integrated tabs Pre-black anodize*
6221PBG

With slotted device mounting hole

Pre-black anodize*
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information

POPULAR OPTIONS 6021- - G

Available on the 6021 only

Base part no. A

Position Code Description

Location

Black anodize

PB Pre-black anodize*

SF1 4-40 UNC-2A device mounting stud Hole X

For additional options for part 6021 see page 85

Details Page 96
6230

Copper channel style heat sink with straight fins

Grease Epo& xy page112

Mounting Kits page 99

Copper channel style heat sink with straight fins features integrated tabs which can be twisted to attach the heat sink to the board prior to wave solder.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description
6230DG

Channel heat sink with straight fins and integrated tabs

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Copper Finish Tin Plated

AMERICA EUROPE

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TV35

Narrow channel style heat sink features twisted fins

TO-220 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number TV35G

Description Channel style heat sink with twisted fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
2X THRU

Material Thick Aluminum Finish Black Anodize

TV46, TV47, TV58 Narrow channel style heat sink features twisted fins

Grease Epo& xy page112

Mounting Kits page 99

Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally.
0 100
0 TV58 TV46, TV47

Air Velocity Per Minute 200 400 600 800

Heat Dissipated
1000 20
ORDERING INFORMATION

Part Number TV46G TV47G TV58G
“A” Dim
“B” Dim

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU CL
“B”

Material Thick Aluminum Finish Black Anodize

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 Heat Sinks

TV265, TV1500, TV1505 Channel style heat sink features twisted fins

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above
0 100
0 TV1500 TV1505

Air Per Minute 200 400 600 800

Heat
1000 20
4 0 10

Thermal Resistance From MTG Surface to

Channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. Models are available with integrated twist tabs or mounting solderable tabs.

Mounting Surface Temp Rise Above
0 100
0 TV 265

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Part Number Description

TV265G

Channel style heat sink with twisted fins and solderable tabs

TV1500G

Channel style heat sink with twisted fins

TV1505G

With integrated twist tabs

Figure A B

Dia of PCB Plated Thru Hole for Tabs

Grease Epo& xy page112

FIGURE A

Mounting Kits page 99

FIGURE B

TAB TV1505 ONLY

Material Thick Aluminum Finish Black Anodize
5900

Channel style heat sink features solderable tabs and twisted fins

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink features solderable tabs and twisted fins for increased air turbulence for better cooling. For ease of assembly use with clip 7701 sold separately to attach device. See page 97 for clip information.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description
5900PBG

Channel style heat sink with twisted fins and solderable tabs

Dia of PCB Plated Thru Hole for Tabs
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information.

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Slots for clip attach

Material Thick Aluminum Finish Pre Black Anodize*

AMERICA EUROPE

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TO-220 Heat Sinks
5929, 5930 Channel style heat sink featuring twisted fins

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink features twisted fins for increased air turbulence for better cooling. Two heights are available and include wave solderable tin plated tabs for easy attachment to the PC board.
0 100
0 593002 592902

Air Per Minute 200 400 600 800

Heat
1000 20
4 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU
ORDERING INFORMATION

Part Number 592902B03400G
“A” Dim
593002B03400G

Dia of PCB Plated Thru Hole for Tabs

POPULAR OPTIONS 59 _ 02B034 00G

Base part no.

Position Code Description

Location Details
05 4-40 male semiconductor mount LG Hole X Page 90

For additional options see page 82
5630, 5766 Channel style heat sink featuring three integrated tabs

Channel style heat sink features three integrated tabs for greater stability and slotted mounting hole to accommodate a variety of device lead lengths. Available in two heights. Mounting tabs are designed for either soldering tin finish or twisted.
0 100
0 563002 576602
ORDERING INFORMATION
“A” Dim

Finish Black anodize Tin plated Black anodize Tin plated

Dia of PCB Plated Thru Hole for Tabs

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
"X" "A"

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

Material Thick Aluminum Finish See Table
5750

Channel style heat sink with two integrated tabs

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink features two integrated tabs and slotted mounting hole to accommodate a variety of device lead lengths. Mounting tabs are designed for either soldering tin finish or twisted.
ORDERING INFORMATION

Finish Black anodize Tin plated

Dia of PCB Plated Thru Hole for Tabs
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish See Table

AMERICA EUROPE

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 Heat Sinks
5901

Channel style heat sink featuring recessed lower fins

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink features recessed lower fins to allow closer component spacing and longer upper fins for maximum cooling. Includes two solderable tabs for easy attachment to the PC card.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number Description 590102B03600G High performance heat sink with recessed lower fins

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
x SLOT

Material Thick Aluminum Finish Black Anodize

For additional options see page 82
5903

Channel style heat sink featuring slotted mounting hole

Grease Epo& xy page112

Mounting Kits page 99
0 100

Air Per Minute 200 400 600 800
1000 10

Channel style heat sink features slotted mounting hole to accommodate a variety of
devices and lead lengths. Includes two solder-

Heat
able tabs for easy attachment to the PC card.
ORDERING INFORMATION

Part Number Description 590302B03600G High performance heat sink with solderable tabs

Dia of PCB Plated Thru Hole for Tabs

For additional options see page 82

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Black Anodize
5770, 5771, 5772

Slim low cost channel style heat sink

Grease Epo& xy page112

Mounting Kits page 99

Slim low cost channel style heat sink is ideal where space and cost are limited. Available in 3 fin heights with or without solderable mounting tab.
0 100
0 577002 577102 577202

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Part Number 577002B04000G 577102B04000G 577202B04000G

Description Slim, low cost channel style heat sink with no solderable tabs With solderable tab Slim, low cost channel style heat sink with no solderable tabs With solderable tab Slim, low cost channel style heat sink with no solderable tabs With solderable tab
“A” Dim

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Aluminum Finish Black Anodize

POPULAR OPTIONS 577_ _02B 0 4000G

Base part no. A

Position

Code

In-Sil-8TM pad

For additional options see page 82

Details Page 86

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TO-220 Heat Sinks
6109, 6110 Low cost channel style heat sink featuring integrated alignment tabs

Grease Epo& xy page112

Mounting Kits page 99

FIGURE A

FIGURE B

AT BASE

Low cost channel style heat sink features integrated alignment tabs to prevent the device from rotating while applying torque to the mounting hardware. Available in two lengths with a pre-black anodized finish.

Material Thick Aluminum Finish Pre-Black Anodize*
ORDERING INFORMATION

Part Number Description

Figure
6109PBG

Low cost channel heat sink with device locating tabs A
6110PBG

Low cost channel heat sink with device locating tabs B
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information

POPULAR OPTIONS 61_ _PB - G

Position

Code

Base part no. A Description

Solderable mounting tabs

For additional options see page 85

Details Page 93

AT BASE

Mounting Surface Temp Rise Above
0 100
0 6109 6110

Air Per Minute 200 400 600 800

Heat
1000 20
7178

Copper narrow channel style heat sink with a single integrated tab

Grease Epo& xy page112

Mounting Kits page 99

Copper narrow channel style heat sink includes a single integrated tab to allow easy attachment to the PC board. Tin plated finish ensures easy solderability.

Mounting Surface Temp Rise Above
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number 7178DG

Description Narrow channel copper heat sink

Dia of PCB Plated Thru Hole for Tabs

Thermal Resistance From MTG Surface to

AT BASE

Material Thick Copper Finish Tin Plated
7136, 7139 Copper channel style slide on heat sink featuring integrated mounting clip

FIGURE A

FIGURE B

Top is cut away to show detail

Copper channel style slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also includes solderable mounting tabs for easy attachment to the PC board.
ORDERING INFORMATION

Part Number 7136DG 7139DG

Description Vertical mount Horizontal mount

Figure A B

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Copper Finish Tin Plated
0 100

Air Per Minute 200 400 600 800
7136 7139

Heat
1000 20

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Thermal Resistance From MTG Surface to

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TO-220 Heat Sinks
7128 Copper channel style heat sink with integrated clip

Copper channel style heat sink with integrated clip and locking tab for secure attachment to the device. Narrow profile uses less board space. Includes tin plated solderable tabs for easy attachment to the printed circuit card.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Dia of PCB Plated Thru Hole for Tabs
7128DG

Slide on channel heat sink with integrated clip and locking tabs

Case Temp Rise Above Thermal Resistance From Case to

Top is cut away to show detail

Material Thick Copper Finish Tin Plated
6038 Channel style heat sink with integrated clip

Channel style heat sink with integrated clip and locking tab for secure attachment to the device. Tabs can be bent for mounting.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number Description
6038BG

Slide on channel heat sink with integrated clip and locking tabs

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

AT BASE

Material Thick Aluminum Finish Black Anodize
7142 Narrow channel style heat sink with integrated clip

Narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Device can be mounted horizontally using a single center tab that can be soldered directly to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number 7142DG

Description Slide on narrow channel heat sink with integrated clip and locking tabs

Dia of PCB Plated Thru Hole for Tabs

Case Temp Rise Above Thermal Resistance From Case to

Top is cut away to
show detail

Material Thick Copper Finish Tin Plated

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Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

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TO-220 Heat Sinks
6238, 6239 Channel style heat sink with integrated clip

Channel style heat sink with integrated clip features strong spring tension and device locking tab to attach device securely to the heat sink. Available with solderable tabs for vertical mount or without tabs for mounting horizontally.
"A" B

AT BASE
ORDERING INFORMATION

Part Number 6238BG 6238B-MTG 6239B-MTG

Description Channel heat sink with integral clip, no solderable tab With solderable mounting tabs With solderable mounting tabs

For additional options see page 85
“A” Dim

Dia of PCB Plated Thru Hole for Tabs

SECTION B-B

Material Thick Aluminum Finish Black Anodize
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
5342

Channel style heat sink with convenient clip

FIGURE A
“A”

CLIP 53

Grease Epo& xy page112

FIGURE B
“A”

Mounting Kits page 99

Channel style heat sink features a dittin to locate the device and a convenient clip to eliminate the need for mounting hardware. The twisted fins increase cooling efficiency. Available in two solderable mounting tab styles. Can be ordered without the ditton if electrical isolation is required or for mounting tabless packages.

Material Thick Aluminum Finish Black Anodize

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
ORDERING INFORMATION

Part Number 534202B02853G 534202B03453G 534265B02853G 534265B03453G

Description With Shur-LockTM tabs and clip With solderable mounting tabs and clip With Shur-LockTM tabs and clip With solderable mounting tabs and clip

Figure A B A B
“A” Dim

Dia of PCB Plated Thru Hole for Tabs

Dia x High Dittin

Dia x High Dittin

No Dittin

No Dittin

For additional options see page 82
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

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TO-220 Heat Sinks

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7141

Copper narrow channel style heat sink with integrated clip

Case Temp Rise Above Thermal Resistance From Case to

Copper narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Single center tab can be soldered directly to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number 7141DG

Description Narrow channel heat sink with integrated clip

Dia of PCB Plated Thru Hole for Tabs
5073

Economy, narrow base, low profile channel style heat sink

Top is cut away to show detail

Material Thick Copper Finish Tin Plated

Grease Epo& xy page112

Mounting Kits page 99

Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with inch centering. When mounted horizontally, the total height of the heat sink is just
0 100

Air Per Minute 200 400 600 800

Heat
1000 20

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU
ORDERING INFORMATION

Part Number Finish Black anodize Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 110 for more information

POPULAR OPTIONS 507302 _ 000 00G

Base part no.

Position Code Description

Location
09 Stud x LG

For additional options see page 82

Hole X

Details Page 96
5041, 5042

Economy, narrow base, low profile channel style heat sink

FIGURE A

THRU

FIGURE B

Material Thick Aluminum Finish See Table

Grease Epo& xy page112

THRU TYP 2

Mounting Kits page 99

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with tight component spacing. Models are available for single and dual device mounting.
ORDERING INFORMATION

Part Number Description

Figure

Economy, narrow base channel style heat sink A

For dual devices

POPULAR OPTIONS 504_ _2B0 00 00G

Base part no. A

Position Code Description
01 6-32 Wave On threaded insert stand off

For additional options see page 82

Location Hole X

Details Page 89

Material Thick Aluminum Finish Black Anodize
0 100 80

Air Per Minute 200 400 600 800
1000 10
504102 504222

Heat

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TV40

Narrow channel style heat sink features twisted fins

TO-220 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number TV40G

Description Narrow channel style heat sink with twisted fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
2X THRU

Material Thick Aluminum Finish Black Anodize
7173

Copper channel style heat sink featuring two integrated tabs

Grease Epo& xy page112

Mounting Kits page 99

Copper channel style heat sink features two integrated tabs. The heat sink is tin plated and can be soldered to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number 7173DG

Description Copper channel style heat sink

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Copper Finish Tin Plated
6236

Channel style heat sink featuring an integrated device retaining clip

Channel style heat sink features an integrated device retaining clip that eliminates the need for attachment hardware. Available in two finish options.
ORDERING INFORMATION

Part Number 6236BG 6236PBG

Finish Black anodize Pre-black anodize*
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
4 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Locking Catch

Top is cut away to show detail

Material Thick Aluminum Finish See Table

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TO-220 Heat Sinks
5306, 5307, 5760

Channel style heat sink with wide mounting surface

FIGURE A

THRU

FIGURE B

Grease Epo& xy page112

Mounting Kits page 99

THRU 2X

Lightweight, low cost channel style
heat sink with wide mounting surface
and selection of lengths to accept a
variety of packages. Models accomodate
one or two devices.
ORDERING INFORMATION

Figure
“A” Dim

For additional options see page 82
“B” Dim
“C” Dim
5779, 5786 Twin channel style heat sink

FIGURE A

TYP 2

AT BASE

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Black Anodize

AT BASE
0 100

Air Per Minute 200 400 600 800

Heat
576012, 530714 or 576014 530613 or 530614

Grease Epo& xy page112
1000 10 8 6 4 2 0

Mounting Kits page 99

THRU TYP 2

FIGURE B

THRU TYP 2

Twin channel style heat sink vertically mounts two TO-220 devices to a single heat sink. Center fins increase cooling capacity. Available with integrated twist tabs or staked on solder tabs for easy attachment to the PC board.
ORDERING INFORMATION

Twin channel style heat sink with integrated tabs
578622B03200G With staked on solderable tabs

For additional options see page 82

TYP 2

Figure A B

Dia of PCB Plated Thru Hole for Tabs

TYP 2

Material Thick Aluminum Finish Black Anodize
0 100

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

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Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 Heat Sinks
5069, 5070, 5071, 5072 Hat section style heat sink

FIGURE A

FIGURE B

Grease Epo& xy page112

Mounting Kits page 99

THRU TYP 2

Hat section style heat sinks are low profile and perfect for use on printed circuit cards with inch centering between boards. For higher power applications the 5071 hat can be added to the 5070 or 5072 for double sided cooling of a TO-220 device.
ORDERING INFORMATION

Description Hat section heat sink Wide hat section heat sink Hat section heat sink with cut out Dual device hat section heat sink

Figure A C B

POPULAR OPTIONS 50_ _ _2B 0 0000G

Base part no. A

Position

Code

Details

Kon DuxTM pad

Page 86

For additional options see page 82
“A” Dim

THRU

Material Thick Aluminum Finish Black Anodize

FIGURE C
0 100

Air Per Minute 200 400 600 800
507222

Heat
507222 with 507102 attached
1000 10
2 0 10
0 100
0 506902 507102 507002

Air Per Minute 200 400 600 800

Heat
1000 10
7137, 7140

Copper, hat section, slide on heat sink

Copper, hat section, slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also included are solderable mounting tabs for easy attachment to the PC card.
ORDERING INFORMATION

Part Number 7137DG 7140DG

Description Vertical mount Horizontal mount

Figure A B

FIGURE A

Dia of PCB Plated Thru Hole for Tabs

Top is cut away to show detail

Material Thick Copper Finish Tin Plated

FIGURE B
0 100

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

AMERICA EUROPE

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TO-220 Heat Sinks
6237 Hat section style heat sink featuring an integrated clip

Hat section style heat sink features an integrated clip for secure attachment to the device without added hardware. Available in two finishes.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
4 0 10
ORDERING INFORMATION

Part Number Finish
6237BG

Black anodize
6237PBG

Pre-black anodize*
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Top is cut away to show detail

Material Thick Aluminum Finish See Table
5690 High power, square basket heat sink with folded back fins

Grease Epo& xy page112

Mounting Kits page 99

High power, square basket heat sink accommodates two TO-220 devices. Features folded back fins for increased surface area for maximum cooling.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20
ORDERING INFORMATION

Part Number Description High power, square basket, folded back fin heat sink

POPULAR OPTIONS 569022B0 00 00G

Base part no. A

Position A

Code 01

Description Wave On threaded insert, stand off Bd

For additional options see page 82

Location Hole X

Details Page 89

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

BASE

SEE DETAIL "A"

THRU TYP 8

SQ. REF

TYP 2

TYP 2

TYP 2

TYP 6

TYP 2

DETAIL-A

Material Thick Aluminum Finish Black Anodize

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Thermal Resistance From MTG Surface to

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TO-220 Heat Sinks
5748, 5798, 5799

Clip on style heat sink featuring an integrated clip

FIGURE A

LOCKING CATCH

FIGURE B

LOCKING CATCH

Clip on style heat sink features an integrated clip to retain the device meaning no mounting hardware is required. Models have fins on both sides, left or right side and are available with solderable tabs for easy attachment to the PC board.

Material Thick Aluminum Finish Black Anodize

Note Fins on left or right. Right hand side model shown
ORDERING INFORMATION

Part Number Description Clip on heat sink, left & right side fins, no solderable tabs 574802B03300G Left & right side fins with solderable tabs Left side fin, no solderable tabs 579802B03300G Left side fin with solderable tab Right side fin, no solderable tabs 579902B03300G Right side fin with solderable tab For additional options see page 82

Figure A B

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above
0 100
0 574802 579902 579802

Air Per Minute 200 400 600 800

Heat
1000 20
6043, 6049, 6094

Low cost, clip on style heat sink featuring a locking tab
0 100

Air Per Minute 200 400 600 800
1000 20

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above

Low cost, clip on style heat sink
features a locking tab to prevent the device from dislodging from
6094

Heat
6049
the heat sink. Also includes slide
6043
runners to ensure proper device
alignment. Available in a pre-black
anodize finish.
ORDERING INFORMATION

Part Number “A” Dim
6043PBG
6049PBG
6094PBG
“B” Dim
“C” Dim
*Edges cut during the manufacturing process will be unfinished. See page 110 for more information
“D” Dim
“E” Dim
"B" "C"

Material Thick Aluminum Finish Pre-Black Anodize*

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TO-220 Heat Sinks

PF750, PF758 Slip on heat sink featuring integrated tabs

Slip on heat sink is tin plated and has integrated tabs for soldering to the PC board. Locating features provide simple device alignment and spring action holds the device for good thermal contact.
0 100
0 PF750 PF758

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Part Number PF750G PF758G

Description Slip on heat sink with tabs Slip on heat sink with tabs
“A” Dim
“B” Dim

PF752

Slip on heat sink

Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact.
ORDERING INFORMATION

Part Number PF752G

Description Slip on heat sink
0 100

Air Per Minute 200 400 600 800

Heat
1000 20

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Tin Plate

Material Thick Aluminum Finish Black Anodize

PF720, PF723 Slip on heat sink

Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. Available with or without solderable mounting tabs
ORDERING INFORMATION

Part Number PF720G PF723G

Description Slip on heat sink, no solderable tabs With solderable tabs
* Edges cut during manufacturing process will be unfinished

Mounting Surface Temp Rise Above

Heat Dissipated Watts

Material Thick Aluminum Finish Pre-Black Paint*

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Thermal Resistance From MTG Surface to

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TO-220 Heat Sinks
5744, 5745, 5746, 5749 Low cost, labor saving, slide on heat sink featuring spring action

FIGURE A

HOLDING TABS

DITTIN

FIGURE B

HOLDING TABS

DITTIN

Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum metal
to metal contact and good thermal
conduction. Available with solder-
able tabs for horizontal or vertical
mounting to the PC board.
ORDERING INFORMATION

Part Number 574402B03200G 574502B03300G 574602B03300G 574902B03300G

Description Low cost slide on heat sink, no solderable tabs With solderable tabs for horizontal mounting Low cost slide on heat sink, no solderable tabs With solderable tabs for vertical mounting Low cost slide on heat sink , no solderable tabs With solderable tabs for vertical mounting Low cost slide on heat sink , no solderable tabs With solderable tabs for vertical mounting

For additional options see page 82

Figure A B

Material Thick Aluminum Finish Black Anodize
“A” Dim

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above
0 100
0 574402 574502
0 100

Air Per Minute 200 400 600 800

Heat

Air Per Minute 200 400 600 800
1000 20 16 12 8 4 0
1000 20 16

Mounting Surface Temp Rise Above
574602 574902

Heat
5741

Low cost, labor saving, slide on heat sink featuring spring action

Mounting Kits page 99

Thermal Resistance From MTG Surface to

Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Includes a clearance hole in the top side to allow the use of optional hardware to attach device and heat sink to circuit board or other surface. Also available with solderable tabs for vertical mounting to the PC board.

Mounting Surface Temp Rise Above
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Dia of PCB Plated Thru Hole for Tabs

Low cost slide on heat sink, no solderable tabs
574102B03300G With solderable tabs

POPULAR OPTIONS 574102B0 00 00G

Base part no. A

Position A

Code 37

Details

Solderable tab with step to limit insertion depth Page 92

For additional options see page 82

Thermal Resistance From MTG Surface to

CLEARANCE

DITTIN

THRU

Material Thick Aluminum Finish Black Anodize

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TO-220 Heat Sinks
5751, 5793, 5794

Snap down style heat sink featuring two side fins

FIGURE A

FIGURE B

LOCKING CATCH

Snap down style heat sink features two side fins that act as springs to hold the semiconductor firmly to the heat sink. Models include an integrated clip and device locking catch for more robust applications. Available for both standard and bevel edged TO-220 packages.

THRU
ORDERING INFORMATION

Description Snap down heat sink With integrated clip and locking catch With integrated clip and locking catch for TO-220 with beveled edge

For additional options see page 82

Figure A B

Material Thick Aluminum Finish Black Anodize

View A-A 579302

View A-A 579402

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above
0 100
0 579302 579402

Air Per Minute 200 400 600 800

Heat
1000 10

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above
0 100
0 575102

Air Per Minute 200 400 600 800

Heat
1000 20

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6225

Space saving staggered fin heat sink

TO-220 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION
6225B-MTG

Space saving staggered fin heat sink

For additional options see page 85

Dia of PCB Plated Thru Hole for Tabs
6032

Copper, space saving staggered fin heat sink

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

Copper, space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description

Dia of PCB Plated Thru Hole for Tabs
6032DG

Copper space saving staggered fin heat sink
6022

Space saving staggered fin heat sink

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Copper Finish Tin Plated

Grease Epo& xy page112

Mounting Kits page 99

Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board.
ORDERING INFORMATION

Part Number Finish

Dia of PCB Plated Thru Hole for Tabs
6022PBG

Pre-black anodize*
6022BG

Black anodize
*Edges cut during the manufacturing process will be unfinished. See page 110 for more information

For additional options see page 85
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish See Table

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

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Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 Heat Sinks
6232 Space saving staggered fin heat sink

Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs with triangular base for easy attachment to the PC board.
ORDERING INFORMATION

Finish

Dia of PCB Plated Thru Hole for Tabs
6232B-MTG

Black anodize
6232PB-MTG

Pre-black anodize*
*Edges cut during the manufacturing process will be unfinished. See page 110 for more information

For additional options see page 85
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 10
6025 Copper, space saving staggered fin heat sink

Copper, space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs for easy attachment to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number Description
6025DG

Copper, space saving staggered fin heat sink with solderable tabs

Dia of PCB Plated Thru Hole for Tabs

For additional options see page 85
5932 Space saving twisted fin heat sink

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Grease Epo& xy page112

Mounting Kits page 99

Material Thick Aluminum Finish See Table

THRU

Grease Epo& xy page112

Mounting Kits page 99

Material Thick Copper Finish Tin Plated

Grease Epo& xy page112

Mounting Kits page 99

Space saving twisted fin heat sink for vertical mounting TO-220 devices. Features solderable mounting tabs for easy attachment to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number 593202B03500G

Description Space saving twisted fin heat sink with solderable tabs

Dia of PCB Plated Thru Hole for Tabs

POPULAR OPTIONS 593202B0 00 00G

Base part no. A

Position A

Code 34

Description Solderable tab for plated thru hole

For additional options see page 82

Details Page 92

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU TYP 2

Material Thick Aluminum Finish Black Anodize

AMERICA EUROPE

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5425

Space saving staggered fin heat sink

Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs that can be twisted for attachment to the PC board. Heat sink is also available with tin plating for soldering directly to the PC board.
ORDERING INFORMATION

Finish

Black anodize

Tin plated

For additional options see page 82

Dia of PCB Plated Thru Hole for Tabs
0 100

Air Per Minute 200 400 600 800

Heat
1000 20

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

TO-220 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

THRU

Material Thick Aluminum Finish See Table
5925

Space saving twisted fin heat sink

Space savings twisted fin heat sink for vertical mounting TO-220 devices. Features staked on solderable mounting tabs for easy attachment to the PC board.
ORDERING INFORMATION

Part Number 592502B03400G 592502U03400G

Finish Black anodize Unfinished

For additional options see page 82

Dia of PCB Plated Thru Hole for Tabs
0 100

Air Per Minute 200 400 600 800

Heat
1000 20

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Grease Epo& xy page112

Mounting Kits page 99

THRU

Material Thick Aluminum Finish See Table

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

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Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email:

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TO-220 Heat Sinks
5338, 5339, 5340

Extruded heat sink with radial fins

Extruded heat sink with radial fins and channel clip attach feature make device attachment easy. Includes clip and two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights for TO-220 devices.
0 100
533802 534002 533902
ORDERING INFORMATION

Part Number 533802B02554G 533902B02554G 534002B02554G
“A” Dim

For additional options see page 83

Dia of PCB Plated Thru Hole for Pins

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
5326, 5327, 5328

High power extruded heat sink with large radial fins

High power extruded heat sink with large radial fins and increased fin count for additional cooling capacity. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights for TO-220 devices.
0 100
0 532602 532702 532802
ORDERING INFORMATION

Part Number 532602B02500G 532702B02500G 532802B02500G
“A” Dim

For additional options see page 83

Dia of PCB Plated Thru Hole for Pins

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Grease Epo& xy page112

HIGH DITTIN

SLOT TYP 2

CLIP 54

Material Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

THRU

Material Aluminum Finish Black Anodize

ML26AA

Extruded channel style heat sink featuring serrated fins

Extruded channel style heat sink features serrated fins for increased cooling capacity. The base of the heat sink is notched to clear the device leads when mounted horizontally on the printed circuit card. Narrow channel accommodates a TO-220 device.
ORDERING INFORMATION

Part Number Description

ML26AAG

Extruded channel style heat sink
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
4 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Grease Epo& xy page112

Mounting Kits page 99

THRU

Material Aluminum Finish Black Anodize

AMERICA EUROPE

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ASIA

Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

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Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 & TO-262 Heat Sinks
5912 Plug in style heat sink featuring four spring action clips

Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board.

FIGURE A

FIGURE B

Material Thick Aluminum Finish Black Anodize
ORDERING INFORMATION

Plug in style heat sink, no mounting tab
591202B03100G With horizontal mounting tab
591202B04000G With vertical mounting tab

For additional options see page 84

Figure A B

Dia of PCB Plated Thru Hole for Tabs
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
5913 Plug in style heat sink featuring four spring action clips

Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Includes 2 integrated standoffs to steady the heat sink during wave soldering. Available with solderable mounting tabs for vertical mounting to the PC board.

FIGURE A

FIGURE B

Material Thick Aluminum Finish Black Anodize
ORDERING INFORMATION

Part Number Description Plug in style heat sink with integrated standoffs, no mounting tab 591302B02800G With Shur-LockTM tab for vertical mounting 591302B04000G With tab for vertical mounting

For additional options see page 84

Figure B A B

Dia of PCB Plated Thru Hole for Tabs
0 100

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

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TO-220 & TO-262 Heat Sinks
5768

Plug in style heat sink featuring four spring action clips

FIGURE A

FIGURE B

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board.

Material Thick Aluminum Finish See Table
ORDERING INFORMATION

Part Number Description Slim plug in heat sink, no mounting tab Slim plug in heat sink, no mounting tab Slim plug in heat sink, no mounting tab 576802B03100G With single tab for horizontal mounting 576802V03100G With single tab for horizontal mounting 576802U03100G With single tab for horizontal mounting 576802B04000G With single tab for vertical mounting 576802V04000G With single tab for vertical mounting 576802U04000G With single tab for vertical mounting

For additional options see page 84

Figure A B

Finish Black anodize AavSHIELD3 Unfinished Black anodize AavSHIELD3 Unfinished Black anodize AavSHIELD3 Unfinished

Dia of PCB Plated Thru Hole for Tabs
0 100
0 576802B 576802V 579602U

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

PF432, PF433, PF434, PF435, PF436 Plug in style heat sink features pre-blackened finish

Plug in style heat sink features pre-blackened finish and two spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board.

FIGURE A

FIGURE B

Material Thick Aluminum Finish Pre-Black Anodize*
ORDERING INFORMATION

Part Number Description

PF432G

Plug in style heat sink with solderable tab, vertical mount

PF433G

With vertical mount no tab

PF434G

With solderable tab, horizontal mount

PF435G

With solderable tab, vertical mount

PF436G

With solderable tab offset from center, horizontal mount
*Edges cut during the manufacturing process will be unfinished. See page 110 for more information

Figure A B A C

Dim “A”

Dia of PCB Plated Thru Hole for Tabs
0 100

FIGURE C

Air Per Minute 200 400 600 800

Heat
1000 10

Case Temp Rise Above Thermal Resistance From Case to

AMERICA EUROPE

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Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5669

Plug in style heat sink with folded back fins

TO-220 & TO-262 Heat Sinks

FIGURE A

FIGURE B

Plug in style heat sink with folded back fins for extra cooling capacity. Features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with or without solderable mounting tabs for both horizontal and vertical mounting to the PC board.
ORDERING INFORMATION

Part Number Description Plug in style heat sink with no mounting tab 566902B03100G With horizontal mounting tab 566902B04000G With vertical mounting tab For additional options see page 82

Figure A B

Dia of PCB Plated Thru Hole for Tabs

Material Thick Aluminum Finish Black Anodize
0 100

Air Per Minute 200 400 600 800

Heat
1000 10

TV96, TV97 Hat section heat sink with twisted fins

TO-220 & TO-218 & TO-247 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

Hat section heat sink with twisted fins is low profile and perfect for use on circuit cards with spacing. The twisted fins increase air turbulence for better thermal performance.
ORDERING INFORMATION

Part Number “A” Dim

TV96G

TV97G
0 100
0 TV96 TV97

Air Per Minute 200 400 600 800

Heat
1000 25

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Black Anodize

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 & TO-218 & TO-247 Heat Sinks
5301 High rise style heat sink features twisted fins and Wave-OnTM solderable mounts

Grease Epo& xy page112

Mounting Kits page 99

BASE PART

FIGURE A

FIGURE B

High rise style heat sink features twisted fins and Wave-OnTM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices.

THRU

CLIP 50
x HIGH DITTIN

CLIP 62
Ø x 2X HIGH DITTIN

Material Thick Aluminum Finish Black Anodize

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
ORDERING INFORMATION

Part Number Description 530101B00100G Heat sink twisted fin 530101B00150G With device clip #50 530102B00100G Heat sink twisted fin 530102B00150G With device clip #50 530161B00162G With two device clips #62 530162B00162G With two device clips #62

Device

Figure “A” Dim

TO-218, TO-247

TO-218, TO-247

TO-220

TO-220

Dual TO-218, TO-247 B

Dual TO-220

Dia of PCB Plated Thru Hole for Tabs

For additional options see page 82
5308 High rise style heat sink features twisted fins and solderable tabs
0 100

Air Per Minute 200 400 600 800
530161 or 530162 530101 or 530102

Heat
1000 5
1 0 20

Grease Epo& xy page112

Mounting Kits page 99

BASE PART

FIGURE A

FIGURE B

High rise style heat sink features twisted fins and solderable tabs for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices.

RECOMMENDED HOLE PATTERN

THRU 2x

CLIP 50
x HIGH DITTIN

Material Thick Aluminum Finish Black Anodize

CLIP 62
2X HIGH DITTIN

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
ORDERING INFORMATION

Part Number Description 530801B05100G Heat sink twisted fin and solderable tabs 530801B05150G With device clip #50 530802B05100G Heat sink twisted fin and solderable tabs 530802B05150G With device clip #50 530861B05162G With two device clips #62 530862B05162G With two device clips #62

For additional options see page 82

Device TO-218, TO-247 TO-218, TO-247 TO-220 TO-220 Dual TO-218, TO-247 Dual TO-220

Figure
“A” Dim

Dia of PCB Plated Thru Hole for Tabs
0 100

Air Per Minute 200 400 600 800
530861 or 530862 530801 or 530802

Heat
1000 5
1 0 20

AMERICA EUROPE

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Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email:

TO-220 & TO-218 & TO-247 Heat Sinks
5304 High rise style heat sink features staggered fins and Wave-OnTM solderable mounts

Grease Epo& xy page112

Mounting Kits page 99

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

High rise style heat sink features staggered fins and Wave-OnTM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20
ORDERING INFORMATION

Part Number 530401B00100G 530401B00150G 530402B00100G 530402B00150G

Description High rise style heat sink staggered fins With device clip #50 High rise style heat sink staggered fins With device clip #50

For additional options see page 82

Device TO-218, TO-247 TO-218, TO-247 TO-220 TO-220
“A” Dim

Dia of PCB Plated Thru Hole for Tabs
5330, 5331, 5332, 5333 Extruded heat sink with radial fins

Mounting Surface Temp Rise Above
0 100
0 53300X 53310X

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Extruded heat sink with radial fins and clip attach feature makes device attachment easy. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218 and TO-247 devices.

Mounting Surface Temp Rise Above
0 100
0 53320X 53330X

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number 533001B02551G 533002B02551G 533101B02551G 533102B02551G 533201B02551G 533202B02551G 533301B02551G 533302B02551G

Device TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220
“A” Dim

For additional options see page 83
“B” Dim
“C” Dim

Dia of PCB Plated Thru Hole for Pins

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

CLIP 50

THRU

HIGH DITTIN

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

X HIGH DITTIN

NOTCH FOR CLIP 2x

CLIP 51

Material Aluminum Finish Black Anodize

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 & TO-218 & TO-247 Heat Sinks

SW25, SW38, SW50, SW63

Extruded heat sink with unequal channel widths

Grease Epo& xy page112

Mounting Kits page 99
0 100

Air Per Minute 200 400 600 800
1000 10

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above

Thermal Resistance From MTG Surface to

Extruded heat sink with unequal channel widths front and back can accommodate a TO-220, TO-218, or TO-247 devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights. Version without hole uses clip 5901 sold separately to attach device. See page 97 for clip information.

Mounting Surface Temp Rise Above
0 SW25 SW38
0 100
0 SW50 SW63
ORDERING INFORMATION

Part Number SW25-2G SW25-4G SW38-2G SW38-4G SW50-2G SW50-4G SW63-2G SW63-4G

Description Extruded heat sink with unequal channel widths front and back With device mounting holes Extruded heat sink with unequal channel widths front and back With device mounting holes Extruded heat sink with unequal channel widths front and back With device mounting holes Extruded heat sink with unequal channel widths front and back With device mounting holes
“A” Dim

Holes No

Dia of PCB Plated Thru Hole for Pins
5297, 5298, 5299, 5300

Extruded heat sink with large radial fins

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

Extruded heat sink with large radial fins features equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220, TO-218, and TO-247 devices.
ORDERING INFORMATION

Part Number Device
“A” Dim
529701B02500G TO-218, TO-247
529702B02500G TO-220
529801B02500G TO-218, TO-247
529802B02500G TO-220
529901B02500G TO-218, TO-247
529902B02500G TO-220
530001B02500G TO-218, TO-247
530002B02500G TO-220

For additional options see page 83
0 100

Air Per Minute 200 400 600 800

Mounting Surface Temp Rise Above
52970X 52980X

Heat
0 100

Air Per Minute 200 400 600 800

Mounting Surface Temp Rise Above
52990X 53000X

Heat
“B” Dim
“C” Dim

Dia of PCB Plated Thru Hole for Pins
1000 5 4 3 2 1 0
1000 5 4 3 2 1 0

SEE NOTE 1

NOTE 1 This hole not present in SW25 model

Material Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

Material Aluminum Finish Black Anodize

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 & TO-218 & TO-247 Heat Sinks
5334, 5335, 5336, 5337 Extruded heat sink with large radial fins
ORDERING INFORMATION

Device
533401B02552G

TO-218, TO-247
533402B02552G

TO-220
533421B02552G

Dual TO-218, TO-247
533422B02552G

Dual TO-220
533501B02552G

TO-218, TO-247
533502B02552G

TO-220
533521B02552G

Dual TO-218, TO-247
533522B02552G

Dual TO-220
533601B02552G

TO-218, TO-247
533602B02552G

TO-220
533621B02552G

Dual TO-218, TO-247
533622B02552G

Dual TO-220
533701B02552G

TO-218, TO-247
533702B02552G

TO-220
533721B02552G

Dual TO-218, TO-247
533722B02552G

Dual TO-220

For additional options see page 83

Description Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52 Extruded heat sink with radial fins and device clip #52 Extruded heat sink with radial fins and device clip #52 With 2 device clips #52 With 2 device clips #52
“A” Dim
“B” Dim

Dia of PCB Plated Thru Hole for Pins

AMERICA EUROPE

USA Tel +1 603 224-9988 email:
ORDERING INFORMATION

Part Number BW38-2G BW38-4G BW50-2G BW50-4G BW63-2G BW63-4G

Description Extruded heat sink with unequal channel widths front and back With device mounting hole Extruded heat sink with unequal channel widths front and back With device mounting hole Extruded heat sink with unequal channel widths front and back With device mounting hole
“A” Dim

Dia of PCB Plated Thru Holes Hole for Pins No Yes No Yes No Yes

Material Aluminum Finish Black Anodize
5130, 5131, 5132, 5133 Extruded heat sink with radial fins

Extruded heat sink with radial fins feature equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-220,TO-218, and TO-247 devices.
ORDERING INFORMATION

Part Number 513001B02500G 513002B02500G 513101B02500G 513102B02500G 513201B02500G 513202B02500G 513301B02500G 513302B02500G

Device TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220 TO-218, TO-247 TO-220

For additional options see page 83
“A” Dim

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above
0 100
0 51300X 51310X

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above
0 100 80 60 40 20
51320X 51330X
“B” Dim

Air Per Minute 200 400 600 800

Heat
“C” Dim
“D” Dim

Thermal Resistance From MTG Surface to
1000 5
1 0 10
“E” Dim

Dia of PCB Plated Thru Hole for Pins

Grease Epo& xy page112

Mounting Kits page 99
"C" "A"

Material Aluminum Finish Black Anodize

AMERICA EUROPE

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 & TO-202 Heat Sinks
5310, 5311, 5312, 5313 Extruded heat sink with radial fins & notched base

Grease Epo& xy page112

Mounting Kits page 99
0 100
ORDERING INFORMATION
“A” Dim
531002B02500G
531002V02500G
531102B02500G
531102V02500G
531202B02500G
531202V02500G
531302B02500G
531302V02500G

Finish Black anodize AavSHIELD3 Black anodize AavSHIELD3 Black anodize AavSHIELD3 Black anodize AavSHIELD3

Mounting Surface Temp Rise Above
0 531002 531102
0 100 80
0 531202 531302

Dia of PCB Plated Thru Hole for Pins

Heat

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Thermal Resistance From MTG Surface to

SEE NOTE 1 3x

NOTE 1 This hole not present in 5310 series

Material Aluminum Finish See Table

For additional options see page 83

SW25-6, SW38-6

Extruded heat sink with unequal channel widths

Grease Epo& xy page112

Mounting Kits page 99

Extruded heat sink with unequal channel widths front and back can accommodate a TO-220 or TO-202 device. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Clip 5901 sold separately can be used to attach device. See page 97 for clip information.
0 100
0 SW25 SW38

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description

SW25-6G

Extruded heat sink with unequal channel widths front and back

SW38-6G

Extruded heat sink with unequal channel widths front and back.
“A” Dim

Dia of PCB Plated Thru Hole for Pins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

SEE NOTE 1

NOTCH 11mm DEEP 10.4mm WIDE

NOTE 1 This hole not present in SW25 series

Material Aluminum Finish Black Anodize

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
6396, 6398, 6399, 6400 High power extruded heat sink with large radial fins

Grease Epo& xy page112

Mounting Kits page 99

High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical mounting without stress on the device leads. Available with shoulder pins to provide fixed clearance between the bottom of the heat sink and the board. Available in four heights for TO-220, TO-218, TO-247and multiwatt devices.

Mounting Surface Temp Rise Above

Mounting Surface Temp Rise Above
0 100
0 6396 6398
0 100
0 6399 6400

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20
ORDERING INFORMATION

Part Number Description
6396BG

Extruded heat sink with large radial fins and straight pins
6396B-P2G

With solderable shoulder pins
6398BG

Extruded heat sink with large radial fins and straight pins
6398B-P2G

With solderable shoulder pins
6399BG

Extruded heat sink with large radial fins and straight pins
6399B-P2G

With solderable shoulder pins
6400BG

Extruded heat sink with large radial fins and straight pins
6400B-P2G

With solderable shoulder pins

For additional options see page 85
“A” Dim

Dia of PCB Plated Thru Hole for Pins
6380, 6381, 6382

High power extruded heat sink

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

SEE DETAIL A P2 MODEL ONLY

DETAIL A P2 MODEL ONLY

Material Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

High power extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights. Can also be used for dual TO-220, TO-218, TO-247 and multiwatt devices.
0 100
0 6380 6381 6382

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20
ORDERING INFORMATION

Part Number 6380BG 6381BG 6382BG

Description Extruded heat sink with solderable pins Extruded heat sink with solderable pins Extruded heat sink with solderable pins

For additional options see page 85
“A” Dim

Dia of PCB Plated Thru Hole for Pins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Aluminum Finish Black Anodize

AMERICA EUROPE

USA Tel +1 603 224-9988 email:

ASIA

Italy Tel +39 051 764011 email United Kingdom Tel +44 1793 401400 email:

Singapore Tel +65 6362 8388 email Taiwan Tel +886 2 2698-9888 email:

TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6374

Extruded heat sink for SIP packages

Extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Can also be used for dual TO-220, TO-218, TO-247, and multiwatt devices.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 10
ORDERING INFORMATION

Part Number 6374BG

Description Extruded heat sink with solderable pins

For additional options see page 85

Dia of PCB Plated Thru Hole for Pins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

YB32-4

High power flat back extruded channel style heat sink

Grease Epo& xy page112

Mounting Kits page 99

DETAIL A

SEE DETAIL A

Material Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

High power flat back extruded channel style heat sink features a wide channel to accommodate several devices. Includes two solderable pins to allow vertical mounting without stress on the device leads. Can be used with TO-220, TO-218, TO-247, and multiwatt devices.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description

YB32-4G

High power flat back extruded heat sink

Dia of PCB Plated Thru Hole for Pins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
Ø THRU
5810, 5811, 5812 Flat back extruded heat sink featuring solderable pins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Flat back extruded heat sink features solderable pins which allow vertical mounting without stess on the device leads. Available in three heights for TO-220 and TO-218 devices.
0 100
0 58100X 58110X 58120X

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number 581001B02500G 581002B02500G 581101B02500G 581102B02500G 581201B02500G 581202B02500G

Device TO-218 TO-220 TO-218 TO-220 TO-218 TO-220
“A” Dim

For additional options see page 83
“B” Dim

Dia of PCB Plated Thru Hole for Pins

Material Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99
#6 - 32 UNC THRU

TYP 2

Material Aluminum Finish Black Anodize

AMERICA EUROPE

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-218 Heat Sinks
5922 Plug in style heat sink

Plug in style heat sink requires no hardware to attach to the device. The four spring action clips apply even pressure eliminating gaps between the heat sink and device which rob thermal performance.
0 100
80 60

Air Per Minute 200 400 600 800

Heat
1000
ORDERING INFORMATION
592201B03400G

High power plug in heat sink with folded back fins and solderable mounting tabs

For additional options see page 82

Dia of PCB Plated Thru Hole for Tabs
5931 Channel style heat sink with folded back fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Kits page 99

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

Channel style heat sink with folded back fins for extra cooling capacity. The heat sink features solderable tabs for easy attachment to the PC board.
0 100
80 60

Air Per Minute 200 400 600 800

Heat
1000 10 8
ORDERING INFORMATION

Part Number 593101B03600G

Channel style heat sink with folded back fins and solderable tabs

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Thick Aluminum Finish Black Anodize

POPULAR OPTIONS 593101B 0 0000G

Base part no. A

Position Code

Description Details

Kon-DuxTM pad Page 86

In-Sil-8TM pad Page 86

For additional options see page 82
7130 Copper slide on heat sink

Copper slide on heat sink requires no hardware to attach the device. In addition, the copper heat sink is tin/lead plated to allow easy soldering to the PC board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
ORDERING INFORMATION

Part Number Description
7130DG

Slide on, channel style heat sink with integrated tabs

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Top cut away to show detail

Material Thick Copper Finish Tin Plated

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5063

Low profile hat section heat sink

Low profile hat section heat sink has a total height of making it perfect for mounting to printed circuit boards with centering between boards.
0 100
80 60

Air Per Minute 200 400 600 800

Heat
1000 20 16
ORDERING INFORMATION

Hat section heat sink

For additional options see page 84
5740

Low cost slide on heat sink

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

TO-202 Heat Sinks

Grease Epo& xy page112

Mounting Kits page 99

THRU

NOTCH IS WIDE X DEEP

Material Thick Aluminum Finish Black Anodize

Low cost slide on heat sink provides positive retention with an integral locking tab. The spring tension ensures excellent thermal contact for maximum performance. Requires no hardware to mount.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20 16
ORDERING INFORMATION

Finish

Black anodize

Unfinished
5742, 5796, 5797 Low cost slide on cooler heat sink

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

DITTIN

Material Thick Aluminum Finish See Table

FIGURE A

FIGURE B

Low cost slide on cooler heat sink is easy to assemble to the device and requires no mounting hardware. Models have fins on both sides, or the left or right. Available with or without staked on solderable tab for easy board mounting.

Material Thick Aluminum Finish Black Anodize

Note Fins on Left or Right. Right hand fin model shown.

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
ORDERING INFORMATION

Low cost slide on cooler, no solderable tabs
574204B03300G With solderable tabs

With left side fin only, no solderable tabs
579604B03300G With left side fin only and solderable tabs

With right side fin only, no solderable tabs
579704B03300G With right side fin only and solderable tabs

For additional options see page 84

Figure A B

Dia of PCB Plated Thru Hole for Tabs
0 100
0 574204 579604 579704

Air Per Minute 200 400 600 800

Heat
1000 20
16 12

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TO-202 Heat Sinks
5769, 5773, 5774 Slim low profile channel style heat sink

Slim low profile channel style heat sink is notched to accommodate the TO-202 center tab packages. Available in 3 heights.
ORDERING INFORMATION
“A” Dim

For additional options see page 84
0 100
0 576904 577304 577404

Air Per Minute 200 400 600 800

Heat
1000 20
16 12
6034

Space saving staggered fin heat sink

Space saving heat sink features staggered fins for increased cooling efficiency. This verticle mount heat sink features integrated matte tin plated tabs to solder directly to the PC board.
0 100
80 60

Air Per Minute 200 400 600 800

Heat
1000 10 8
2 0 10
ORDERING INFORMATION
6034DG

Space saving staggered fin heat sink with integrated tin plated tabs

Dia of PCB Plated Thru Hole for Tabs
6046, 6047

Compact slide on heat sink

FIGURE A

O.D.

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Grease Epo& xy page112

Mounting Kits page 99

THRU

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

Material Thick Copper Finish Tin Plated

FIGURE B
"A" O.D.

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Compact slide on heat sink makes assembly easy. The 6046 features a positive device catch to lock the heat sink to the device.

SECTION
ORDERING INFORMATION
6046PBG

With device catch
6047PBG

Compact slide on heat sink

Figure A B
*Edges cut during the manufacturing process will be unfinished. See page 110 for more information.

SECTION

Material Thick Aluminum Finish Pre-Black Anodize*
0 100

Air Per Minute 200 400 600 800
1000 20

Heat

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5775

Slip on heat sink

TO-126 Heat Sinks

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Slip on heat sink requires no hardware to attach to the device. Spring pressure ensures excellent retention. May be assembled before or after the device is attached to the board.
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Finish Black anodize Unfinished

Narrow channel style heat sink featuring twisted fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Narrow channel style heat sink features twisted fins for increased air turbulance for better cooling. Can be mounted horizontally or vertically.
0 100
80 60

Air Per Minute 200 400 600 800

Heat
1000 20
16 12

Material Thick Aluminum Finish See Table

Grease Epo& xy page112

Mounting Kits page 99
ORDERING INFORMATION

Part Number TV4G

Description Narrow channel style heat sink with twisted fins

Material Thick Aluminum Finish Black Anodize

PF730, PF732

Slip on heat sink

FIGURE A

FIGURE B

Mounting Surface Temp Rise Above Ambient Thermal Resistance From MTG Surface to

Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. The tabbed version is made from tin plated copper and the no tab version is lightweight aluminum.
ORDERING INFORMATION

Part Number PF730G PF732G

Description Slip on heat sink With solderable tabs

Material Aluminum

Copper

Finish Black anodize

Tin plated

Figure B A
0 100

Air Per Minute 200 400 600 800

Heat
1000 50
10 0 5

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SIPS
5660 Plug in style heat sink

FIGURE A

TAB CL

FIGURE B

Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal contact. Available with or without solderable tabs for horizontal or vertical mounting to the PC board.
ORDERING INFORMATION

Part Number 566010B03100G 566010B03400G

Figure

Plug in style heat sink, no solderable tabs

With solderable tab for horizontal mounting B

With solderable tabs for vertical mounting

Dia of PCB Plated Thru Hole for Tabs

Material Thick Aluminum Finish Black Anodize

POPULAR OPTIONS 566010B0 00 00G

Base part no. A

Position Code Description
28 Solderable Shur-LockTM Tab for vertical mounting

For additional options see page 84

Details Page 91

Mounting Surface Temp Rise Above

Thermal Resistance From MTG Surface to
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
5305 Channel style heat sink with integrated clip

Channel style heat sink with integrated clip features strong spring tension and device locking catch to attach device securely to the heat sink. Available in two finishes.

Mounting Surface Temp Rise Above
0 100

Air Per Minute 200 400 600 800

Heat
1000 20
ORDERING INFORMATION

Finish Unfinished

Black anodize

Thermal Resistance From MTG Surface to

LOCKING CATCH

Material Thick Aluminum Finish See Table

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SIPS
7038 Channel style slide on heat sink featuring an integrated clip and device retaining tab

Channel style slide on heat sink features an integrated clip and device retaining tab to hold the heat sink to the device. Small footprint consumes less board space.
ORDERING INFORMATION

Part Number Description
7038BG

Channel style slide on heat sink
0 100

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

SECTION

Material Thick Aluminum Finish Black Anodize
7148 Copper channel style slide on heat sink featuring an integrated clip and solderable tabs
0 100

Air Per Minute 200 400 600 800
1000 10

Copper channel style slide on heat sink features an integrated clip and solderable tabs. Includes a device retaining tab to securely hold the heat sink to the device. Small footprint consumes less board space.

Heat
ORDERING INFORMATION

Part Number 7148DG

Description Slide on heat sink with integrated clip

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

SECTION

MAX AT BASE

DETAIL E

Material Thick Copper Finish Tin Plated
5840 Clip on heat sink featuring louvers

Clip on heat sink features louvers to provide excellent cooling in natural or forced air convection. Spring action provides strong clamping force to securely hold the heat sink to the device. Available with or without solderable tabs.
0 100

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 10
ORDERING INFORMATION

Part Number Description Clip on heat sink. no solderable tabs 584000B03500G With solderable tabs for vertical mounting For additional options see page 84

Dia of PCB Plated Thru Hole for Tabs

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

DITTIN TYP 2

Material Thick Aluminum Finish Black Anodize

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-92 Heat Sinks
5752, 5753, 5754 Low cost slip on heat sink

Low cost slip on heat sink features an expandable collar that tightly grips the device meaning no extra mounting hardware is required. Three heights to choose from.
ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above
0 100
20 0 575400 575200

Air Per Minute 200 400 600 800

Heat
1000 25

Mounting Surface Temp Rise Above
0 100 80
20 0 575300

Air Per Minute 200 400 600 800

Heat
1000 25

Low cost brass clip on heat sink
0 100

Mounting Surface Temp Rise Above Ambient °C

Low cost brass clip on heat sink
requires no hardware to attach
to the device. Includes integrated
tabs that can be soldered or twisted
to attach the heat sink to the board
reducing stress on the device leads.
ORDERING INFORMATION

Part Number 92FG

Description Brass clip on heat sink

Dia of PCB Plated Thru Hole for Tabs

Air Velocity Feet Per Minute 200 400 600 800

Heat Dissipated Watts
1000 25

Thermal Resistance From MTG Surface to Ambient °C/Watt

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Black Anodize

Material Thick Brass Finish Unfinished

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5203 Two piece heat sink

FIGURE A

THRU

THRU

Two piece heat sink adds extra cooling in the same amount of board space as other solutions. Base and top can be ordered separately.
ORDERING INFORMATION

Figure

Two piece heat sink assembly, base and top

Top only

Base only

For additional options see page 84
5791 Space saving expandable collar heat sink

TO-3 Heat Sinks

FIGURE B

Grease Epo& xy page112

Mounting Kits page 99

THRU TYP 2

Material Thick Aluminum Finish Black Anodize
0 100

Mounting Surface Temp Rise Above
520327 520328 520329
0.160 THRU TYP 2

Air Per Minute 200 400 600 800

Heat
1000 10

Mounting Kits page 99
0 100

Mounting Surface Temp Rise Above

Space saving expandable collar heat sink
has the same footprint as the device being
cooled meaning no extra board space is
required to fit the heat sink. The expandable
collar tightly grips the device meaning no
extra hardware is required. May also be used
with any diamond or square basket heat sink
to form a two piece heat sink for additional cooling. Available in conductive AavSHIELD3
or black anodize finish.
ORDERING INFORMATION

Finish

Black anodize AavSHIELD3
5060 Low profile hat section heat sink

Air Per Minute 200 400 600 800

Heat
1000 20

Thermal Resistance From MTG Surface to

SLOT
1 5 4 0 REF

Material Thick Aluminum Finish See Table

Grease Epo& xy page112

Mounting Kits page 99

Low profile hat section heat sink is ideal for applications where low component heights are required such as card cages with PCBs mounted on centers.
ORDERING INFORMATION

Low profile hat section heat sink

For additional options see page 84

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
0 100
80 60

Air Per Minute 200 400 600 800

Heat
1000 10 8
2 0 20
2x THRU

THRU

Material Thick Aluminum Finish Black Anodize

AMERICA EUROPE

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Thermal Resistance From MTG Surface to

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TO-3 Heat Sinks
5756, 5757, 5758, 5759 Space saver diamond shaped basket heat sink

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

Space saver diamond shaped basket heat sink featuring a narrow base with slanted fins to increase air turbulence in natural and forced convection applications. Made from heavy gauge material. Four heights to choose from.
ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above
0 100
575703 575603

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above
0 100
0 575903 575803

Air Per Minute 200 400 600 800

Heat
1000 5

POPULAR OPTIONS 575_03B 0 00 00G

Base part no. A B

Position Code

Kon-DuxTM pad

In-Sil-8TM pad
6-23 Wave-OnTM threaded insert
stand off

For additional options see page 84

Location Hole X

Details Page 86 Page 86 Page 89
5013, 5014, 5015, 5016 Low cost diamond shaped basket heat sink

Grease Epo& xy page112

Mounting Kits page 99

CL1 "X" CL2

TYP 2

TYP 2

Material Thick Aluminum Finish Black Anodize

Grease Epo& xy page112

Mounting Kits page 99

Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from.
ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above

Mounting Surface Temp Rise Above
0 100
80 60
40 20 0
0 501403 501303
0 100
80 60
40 20 0
0 501603 501503

Air Per Minute 200 400 600 800

Heat
1000 10 8
2 0 10

Air Per Minute 200 400 600 800

Heat
1000 10 8
2 0 10

POPULAR OPTIONS 501_03B 0 00 00G

Base part no. A B C

Position Code

Kon-DuxTM pad
6-23 Wave-OnTM threaded insert stand off
6-32 x Solderable stud

For additional options see page 84

Location

Hole X Hole X

Details Page 86 Page 89 Page 96

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

CL "X"

TYP 2

TYP 2

AT BASE

AT BASE

Material Thick Aluminum Finish Black Anodize

AMERICA EUROPE

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ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above

Mounting Surface Temp Rise Above
0 100 80
60 40
0 519803 519703
0 100 80
60 40
0 520103 519903

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 25

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

TYP 2

BASE

TYP 2

Material Thick Aluminum Finish Black Anodize

POPULAR OPTIONS 5_ _ _03B 0 00 00G

Base part no. A B

Position Code

Location

Kon-DuxTM pad
6-32 Wave-OnTM theaded insert stand off Hole X

For additional options see page 84

Details Page 86 Page 89
5690, 5790

Square basket heat sink features folded back fins

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Square basket heat sink features folded back fins to increase surface area and power dissipation. Two heights are available.
ORDERING INFORMATION
“A” Dim
0 100
0 569003 579003

Air Per Minute 200 400 600 800

Heat
1000 5 4
1 0 20

THRU TYP 2

THRU TYP 2

Grease Epo& xy page112

Mounting Kits page 99

THRU TYP 8

SQ. REF

Material Thick Aluminum Finish Black Anodize

POPULAR OPTIONS 5_9003B 0 0000G

Base part no. A

Position A

Code 1 3

Description Details Kon-DuxTM pad Page 86 In-Sil-8TM pad Page 86

For additional options see page 84

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TO-3 Heat Sinks
5001, 5002, 5003, 5004 Square basket heat sink featuring slanted fins

Grease Epo& xy page112

Mounting Kits page 99

Square basket heat sink featuring a slanted fin design for increased air turbulence and four integrated mounting holes. Four heights to choose from.
ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above

Mounting Surface Temp Rise Above
0 100
80 60
40 20 0
0 500103 500203
0 100
80 60
40 20 0
0 500303 500403

POPULAR OPTIONS 500_03B 0 0000G

Base part no. A

Position A

Code 1 3

Description Details Kon-DuxTM pad Page 86 In-Sil-8TM pad Page 86

For additional options see page 84

Air Per Minute 200 400 600 800

Heat
1000 5 4
1 0 20

Air Per Minute 200 400 600 800

Heat
1000 5 4
1 0 20

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

TYP 2

THRU TYP 4

TYP 2

Material Thick Aluminum Finish Black Anodize
5051, 5053, 5054

Square basket heat sink featuring straight fins

Grease Epo& xy page112

Mounting Kits page 99

Square basket heat sink features straight fins and thick aluminum for increased cooling capacity. Three heights to choose from.

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
0 100
505103 505303 505403

Air Per Minute 200 400 600 800
ORDERING INFORMATION
“A” Dim

POPULAR OPTIONS 505_03B0 00 00G

Base part no. A

Position Code
6-23 Wave-OnTM threaded insert stand off

For additional options see page 84

Location Hole X

Details Page 89

Material Thick Aluminum Finish Black Anodize

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Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES

TO-3 Heat Sinks
5761, 5762, 5763, 5764 Square basket heat sink featuring slanted vane fins

Square basket heat sink features slanted vane fins for efficient heat dissipation. Air movement from any direction is diverted into the center of the heat sink to create turbulence and improve heat transfer. Four heights to choose from.
ORDERING INFORMATION
“A” Dim

POPULAR OPTIONS 576 _ 03B 0 00 00G

Position Code

Base part no. A B Description

Location

Kon-DuxTM pad
6-32 Wave-OnTM theaded insert Hole X
stand off

TYP 2

TYP 2
0 100
0 576103 576203

Details Page 86 Page 89

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20

For additional options see page 84

Grease Epo& xy page112

Mounting Kits page 99

Material Thick Aluminum Finish Black Anodize
0 100
576303 576403

Air Per Minute 200 400 600 800

Heat
1000 5
1 0 20

PF523, PF526, PF527 Diamond shaped heat sink

Approx DIA area flat around holes

Diamond shaped heat sink is the same profile as the device which saves space on the board. This rugged design is made from cast aluminum and is available in three different heights.
ORDERING INFORMATION
“A” Dim

PF523G

PF526G

PF527G

CTRS

DIA TYP 2

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to
0 100
0 PF523 PF526 PF527

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 15

Material Cast Aluminum Finish Black Anodize

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TO-66 Heat Sinks
5017, 5018, 5019, 5020 Low cost diamond shaped basket heat sink

Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from.
ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above
0 100
0 501706 501806

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above
0 100
0 501906 502006

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Grease Epo& xy page112

TYP 4

Mounting Kits page 99

BASE

BASE

Material Thick Aluminum Finish Black Anodize
5792

Space saving expandable collar heat sink

Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device.
ORDERING INFORMATION

Finish

Black anodize AavSHIELD3
0 100

Air Per Minute 200 400 600 800

Heat
1000 20

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Kits page 99

SLOT

Material Thick Aluminum Finish See Table

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Thermal Resistance From MTG Surface to

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5781, 5782, 5783, 5784, 5785 Snap on cooler heat sink

Snap on cooler features easy no tools installation. Folded back fins provide maximum surface area while preserving valuable board space.
ORDERING INFORMATION
“A” Dim

Mounting Surface Temp Rise Above
0 100
20 0 578105 578205

Air Per Minute 200 400 600 800

Heat
1000 50

Mounting Surface Temp Rise Above
0 100
20 0 578405 578305

Air Per Minute 200 400 600 800

Heat
1000 50
6201, 6202, 6203

Space saving expandable heat sink

Space saving expandable heat sink features a collar that tightly grips the device meaning no extra hardware is required. Heat sinks are constructed of pre-black anodize material to lower cost.
ORDERING INFORMATION
“A” Dim
# Fins
6201PBG
6202PBG
6203PBG
* Edges cut during the manufacturing process will be unfinished. See page 110 more information

Mounting Surface Temp Rise Above
0 100
20 0 6201 6202 6203

Air Per Minute 200 400 600 800

Heat
1000 50

Low cost push on heat sink

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above

TO-05 Heat Sinks
0 100
20 0 578505

Air Per Minute 200 400 600 800

Heat
1000 50

Material Thick Aluminum Finish Black Anodize

I.D. Material Thick Aluminum Finish Pre Black Anodize*

Low cost push on heat sink uses spring pressure to firmly grip the device case creating a good thermal interface.
ORDERING INFORMATION

Part Number Description

Low cost push on heat sink
0 100

Air Per Minute 200 400 600 800

Heat
1000 50

Mounting Surface Temp Rise Above Ambient Thermal Resistance From MTG Surface to

Material Aluminum Finish Black Anodize

AMERICA EUROPE

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TO-5 Heat Sinks
3257, 3260 Extruded collar style heat sink with radial fins

Extruded collar style heat sink with radial fins. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two heights.
0 100
326005 325705

Air Per Minute 200 400 600 800

Heat
1000 50
ORDERING INFORMATION
“A” Dim
3201, 3202 Extruded collar style heat sink with swept back fins

Extruded collar style heat sink with swept back fins for increased surface area in a small volume. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two inside diameters.
ORDERING INFORMATION
“A” Dim
0 100

Air Per Minute 200 400 600 800

Heat
1000 50
3230

Extruded collar style heat sink with mounting hole

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

THRU

Material Aluminum Finish Black Anodize

Material Aluminum Finish Black Anodize

Extruded collar style heat sink with mounting hole for hardware attachment to the circuit card. The heat sink includes a mount boss that will accept a 4-40 screw for secure mounting in high vibration environments. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path.
0 100

Air Per Minute 200 400 600 800

Heat
1000 50
ORDERING INFORMATION

Description Extruded collar style heat sink with mounting boss

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Aluminum Finish Black Anodize

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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6000

Copper heat sink for axial lead devices

Copper heat sink for axial lead device requires no extra board space to mount. One lead of the heat sink is soldered to the device while the other solders to the PC board. Available in two finishes.
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10
ORDERING INFORMATION

Part Number Description
6000UG

Heat sink for axial lead device
6000DG

Heat sink for axial lead device
* See page 110 for more information

Finish Unfinished Tin plated*

Dia of PCB Plated Thru Hole for Tabs

See figure A

See figure A

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Axial Lead Devices

CL SYM

BASE

FIGURE A

DIA as required for lead size

Material Thick Copper Finish See Table

Bridge Rectifiers
6222, 6223, 6224 Square basket style heat sink for bridge rectifiers

Square basket style heat sink for bridge rectifiers uses no additional board space. Available with three different mounting hole diameters.
ORDERING INFORMATION

Part Number 6222BG 6223BG
“A” Dim Dia Thru Dia Thru
6224BG

Dia Thru
0 100

Air Per Minute 200 400 600 800

Heat
1000 10
2 0 10

Mounting Surface Temp Rise Above Thermal Resistance From MTG Surface to

Material Thick Aluminum Finish Black Anodize

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OPTIONS & ACCESSORIES CONTENTS

Thermal solutions go beyond the heat dissipator itself. Aavid Thermalloy offers a total solution package, which includes a number of options and accessory items described in this section of the catalog.

A total thermal solution includes an efficient thermal interface and means of mechanical attachment. Aavid Thermalloy has a full-line of interface materials that can be pre-applied or supplied as an accessory item. Mechanical assembly options include attachment of semiconductors to heat sinks, heat sinks to printed circuit boards, and heat sinks to sockets of CPUs.

Aavid Thermalloy offers the most complete line of value added options of any supplier in the industry. Our full line of accessories includes mounting kits, shoulder washers, insulators, mounting pads, and various grease products and epoxies, which are sold separately, and can be used with a variety of Aavid heat sinks.

This section will provide the most complete solution to your thermal requirement.

CONTENTS

How to decipher or construct an Aavid 12 digit part number....................... 80 How to decipher or construct a "Thermalloy" origin part number............... 81 82

Interface Materials

Pads In-Sil-8TM 86 87 Alignment 87

Double Sided Tape Options factory applied 88

Labor Saving Heat Sink to Board and Device to Heat Sink Mounts

Wave-OnTM 89 Semiconductor 90 Shur-LockTM 91 Solderable Staked on 91 Solderable Mounting 93 Solderable 94 Solderable 94 Clinch 95 Solderable 96 Device Mounting

Clips Aavid 97 Thermal 98

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OPTIONS & ACCESSORIES CONTENTS

CONTENTS

Accessories

Mounting Kits TO-220/TO-3 Mounting 99

Insulating Shoulder Washers Polyphenylene Sulfide PPS Shoulder 100 Nylon Shoulder Insulators ThermalfilmTM Polymide Plastic ThermalfilmTM/ ThermalfilmTM 102 Mica, 103 Aluminum Oxide Ceramic 104 Stanchion Insulating Covers TO-3 Insulating 106 Teflon-Filled Acetal 106 Teflon-Filled Acetal

Mounting Pads TO-5, TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion ................ 107
Ordering Codes

Wave-OnTM mounts page 89

KonduxTM pads In-Sil-8TM pads Semiconductor mnts
page 86
page 86
page 87
page 90

Studs page 96
504102 B U
53 54 55 56 57
01 02 03 05 1
504222 B U
01 02 03 05 2
506902 B U
01 02 03 05 1
507002 B U J
53 54 55 56 57
01 02 03 05 1
507102 B U J
507222 B U J V 53 54 55 56 57
01 02 03 05 1 2
507302 B U J V 33 36 39 40
01 02 03 05 1
530101 B U
50 01 04 05 07 1 2
530102 B U
50 01 04 05 07 1 2
530161 B U
62 01 04 05 07 1 2
530162 B U
62 01 04 05 07 1 2
530401 B U
50 01 04 05 07 1 2
530402 B U
50 01 04 05 07 1 2
530613 B U J V 53 54 55 56 57
530614 B U J
53 54 55 56 57
530714 B U

V 53 54 55 56 57
530801 B U
Ordering Codes

Base part

Finishes page 110

Clips

KonduxTM pads In-Sil-8TM pads Semiconductor mounts Solderable pins Studs Clinch nuts
page 86
page 86
page 87
page 90
page 94 page 96 page 95
513001 B U
03 21 25
513002 B U
21 25
513101 B U
21 25
513102 B U
01 02 03 21 25
513201 B U
01 05
21 25
513202 B U V
01 02 03 21 25
513301 B U
21 25
513302 B U V
01 02
21 25
529701 B
21 25
529702 B
21 25
529801 B
01 02
21 25
529802 B
01 02
21 25
529901 B
33 34 1 2
01 02 05 21 25
Ordering Codes

In-Sil-8TM pads
page 86

Semiconductor mounts page 90

Solderable tabs

Solderable nuts
page 94
13 14
13 14
28 31 34 37 31 37 39 40 3 32 33 3 31 32 33 37 39 40
01 05
32 33 32 33 35 31 33 28 40
37 38
39 40

Solderable studs
page 96
06 08 09 06 08 09 06 08 09 06 08 09 06 07 08 09 06 08 17 06 08 17
08 17
08 06 08 17
09 11

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OPTION INDEX

Option Index D

Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher a Thermalloy Origin part number" on page To find the appropriate Option Index for a selected part number, refer to the main product section in the front of the catalog or "How to use this catalog" on page

Base part

Finishes page 110
6021 B U PB
6022 B U PB
6025 PB
6109 B U PB
6110 B U PB
6225 B U PB
6230 B U PB D
6232 B U PB
6238 B U PB
6239 B U
6374 B
Ordering Codes

Solderable Device studs & pins mtg. studs page 96

SF1 SF2 SF1 SF3 SE3 SE1 SF1 SE1 SM3 SF1

MT MT3 MT5

TC-1

MT MT5 MT6

P2 P3

TC-6

TC-6

MT MT2 MT5 MT6 TC-10 TC-11 TC-12 SE3

MT MT5 MT6

TC-10 TC-11 TC-12

TC-1

TC-11 TC-12 SE3

TC-1 TC-6 TC-7 TC-12

MT MT3 MT6

TC-12

Clinch nuts page 95

CNM1

CNM1

CNE42

CNE42

CNE42

Solderable nuts
page 94

Alignment pads
page 87
pads
page 86

CNE42

CNM1 CNM2

CNE42 CNE43

CNM2

CNM1 CNE42

SNM1

SNE2
8223-CL03

G5 G4
8223-CL03
8241-CL11 8223-CL03
8223-CL03
ORDERING INFORMATION example 12 digit part 507222B _ 0000G
Ordering code
The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional In-SilTM pads separate, or factory applied variations please contact an Aavid sales rep for inquiries.
Ordering code

No pads

One In-Sil-8TM pad

Two In-Sil-8TM pads

MATERIAL PROPERTIES

Color

Grey

Thickness

Breakdown voltage
3500

Dielectric constant

Thermal resistance approx. Screw size Torque

TO-3 6-32

TO-220 4-40

TO-218 4-40

KonDux / Conducta-Pad**

Kondux interface pads are a cost effective alternative to thermally conductive grease compounds. Kondux pads are electrically conductive and ideal for use with small, discrete semiconductors. Aavid pre-applies Kondux to your heatsink to enhance heat conductance from the semiconductor case and speed your manufacturing process.
ORDERING INFORMATION example 12 digit part 575703B _ 0000G
Ordering code
The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used.

Figure A

Figure B "C"
Ordering code 1 or 2* 1 or 2* 1 or 2*

Device TO-3

TO-218 TO-220

Figure A B
"A" Dim
*Factory applied only One KonDuxTM pad
example Thermalloy origin part 6109B - G

Suffix G1 G4 G5 G7

Device TO-3

TO-218 TO-220 Multiwatt

Figure A B
"A" Dim
"B" Dim
"C" Dim

A = Model number B = pad C = RoHS compliant
"B" Dim
"C" Dim

MATERIAL PROPERTIES

Color

Black metallic

Thickness

Thermal resistance

See Graph pg 10

Electrical resistivity
15 x 10-6 Ohms

Compression strength for 10% reduction in thickness
580 psi

Tensile strength
650 psi

Ultimate compression strength
12500 psi

Service temperature
-240°C to +300°C

Liner

None
** The name was originally marketed by Thermalloy and is the same material as KonduxTM is a registered trademark of the Union Carbide Company

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ORDERING INFORMATION example 12 digit part 530101B _ 5150G
Ordering code
The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional pads separate, or factory applied variations please contact an Aavid sales rep for inquiries.
Ordering code Description

No pads

One pad

Two pads
* is a registered trademark of the Bergquist Company

MATERIAL PROPERTIES

Reinforcement carrier

Polymide

Thickness

Continuous use temp °C

Phase change temp °C

Dielectric breakdown voltage Vac 5000

Dielectric constant 1000 Hz

Volume resistivity Ohm-meter
1012

Thermal impedance vs. pressure

Pressure

TO-220 Thermal performance ºC/W

Alignment Pads

Solderable alignment pads are an innovative way to attach the heat sink to your transistor that could cut your assembly time by more than half. Alignment pads provide cost effective solderability, while providing numerous additional benefits. Alignment pads are factory applied and can be bought separately as well. Please refer to accessory Index D on page
ORDERING INFORMATION example

Thermalloy origin part G

Suffix 8223-CL03G 8241-CL11G

Device TO-220 TO-218

Figure B A

A = Model number B = Alignment pad C = RoHS compliant

Typical installation Shown with part number 8241-CL11

Figure A

Figure B

TYP THK

Recommended hole pattern for 8223-CL03G

Recommended hole pattern for 8241-CL11G

CL1 CLIP ASSEMBLY

PLATED THRU HOLE PER DEVICE MANUFACTURERS

RECOMMENDATION

DIA PLATED THRU HOLE

DIA PLATED THRU HOLE

TYP 3

DIA PLATED THRU HOLE

TYP 2

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Interface Material / Double Sided Tape

Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. They are easy to apply, require no curing time, can be electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. Aavid can apply one side to a heat sink.
ORDERING INFORMATION example 12 digit part 375224B000 _ _G
Ordering code 31 32 33 34 35

Tape option T414 T405R T412 T410R T411
Ordering code

INTERFACE MATERIALS

T414 for ceramic or metal packages

Uses a inch mm Kapton MTTM filled polymide film coated on both sides with high-bond strength, pressuresensitive acrylic adhesive that is loaded with aluminum oxide particles. This provides both good thermal performance and excellent electrical isolation.

Color Electrical function Thickness Carrier Thermal impedance Thermal conductivity Breakdown voltage Volume resistivity Lap shear adhesion Die shear adhesion Aluminum 25°C Aluminum 150°C Creep adhesion 25°C 12psi 150°C 12psi

Beige Insulating mm Kapton MTTM °C-in2/w/m-k 5000 VAC 5 x 1015 Ohm-cm 125 psi
150 psi 15 psi
>50 days >10 days

T405R for ceramic or metal packages

Uses a inch mm aluminum foil core coated on both sides with high-bond strength, pressure-sensitive acrylic adhesive that is loaded with aluminum oxide particles. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance.

Color Electrical function Thickness Carrier Thermal impedance Thermal conductivity Breakdown voltage Volume resistivity UL flammability Rating Lap shear adhesion Die shear adhesion Aluminum 25°C Aluminum 150°C Alum.oxide 25°C Alum.oxide 150°C Creep adhesion 25°C 12 psi 150°C 12 psi

White Conductive Aluminum °C-in2/w/m-k N/A 3 x 10-2 Ohm-cm 94V-0 U.L.94 134 psi
125 psi 55 psi 145 psi 60 psi
>50 days >50 days

T412 for ceramic or metal packages

T410R / T411 for plastic packages

Uses an expanded foil carrier coated on both sides with high-bond strength, pressure sensitive acrylic that is loaded with titanium diboride particles. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance.

Color Electrical function Thickness Carrier Thermal impedance Thermal conductivity Breakdown voltage Volume resistivity UL flammability Lap shear adhesion Die shear adhesion Aluminum 25°C Aluminum 150°C Alum.oxide 25°C Alum.oxide 150°C Creep adhesion 25°C 12 psi 150°C 12 psi

Grey Conductive Expanded aluminum °C-in2/w/m-k N/A N/A N/A 70 psi
135 psi 25 psi 125 psi 40 psi
>50 days >10 days

Note Double Sided Tapes are factory applied only.

T410R thermally conductive tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a inch 0.05mm aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces. T411 thermally conductive tape consists of a high bond strength, pressure sensitive adhesive with an aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heat sinks. The high performance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces.

Typical properties Construction Adhesive to heat sink side Color Carrier Adhesive onto component side Color to component side Thickness, mm inch Thermal impedance psi °C-cm2/w °C-in2/w Operating temperature range, °C Lap shear adhesion, psi MPa Die shear adhesion, psi MPa steel/FR4 25°C 125 °C

T410R Acrylic

White Aluminum foil Silicone Clear Silver -50 to + 150 60
170 40

T411 Silicone

Clear silver Aluminum mesh Silicone Clear Silver -50 to + 150 14
80 20

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Wave-OnTM Mounts

Wave-OnTM Mounts

Solderable mounts can be factory installed to practically every board-mountable heat sink and flat sided extrusion. The female threaded through holes permit pre-assembly to the semiconductor via machine screws , allowing the heat sink/semiconductor package to be treated as one unit when fitted in PC board through holes for wave soldering.

FEATURES Saves production time and cost
• Cuts production steps by half
• Factory installation eliminates steps
• Permits soldering in one step
• All the benefits of female threaded mount
• Automated fastening
• Excellent solderability Better thermal performance
• Built in stand-off adds air space between PCB
and heat sink for improved air flow and easier cleaning
• No lockwashers, nuts or separate mounts with various thread lengths
ORDERING INFORMATION example part 574802B0 _ 00G
Ordering code
Ordering code 01 02 03 04 05 07 09

Model E EA EG EH EK EM ER
“A” Dim
“B” Dim
“C” Dim

Typical Wave-OnTM mount installation

HEAT SINK

DIM "C" STAND-OFF LENGTH

DIM "T" PC BOARD
"D" "C"
“D” Dim

Threaded thru holes
#6-32 #4-40 #4-40 #6-32 #6-32 3.5MM #6-32

Model EA, EG E, EK, EM, ER EH

Dia of PCB plated thru hole

PCB thickness “T”

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Semiconductor Mounts

Female Semiconductor Mounts
• Fastens semiconductor to heat sink fast and efficiently
• Up to 10 times faster than fastening with standard nuts and bolts
• Used with most JEDEC case sizes, factory installed
"C" "A"
ORDERING INFORMATION example 12 digit part 542502B000 _ _G
Ordering code
Ordering code Thread
#6-32
#4-40
“A” Dim
“B” Dim
“C” Dim
“D” Dim
"D" "C"

INSTALL MOUNT

Male Semiconductor Mounts
• Captive male studs for semiconductor attachments
• Used with most JEDEC case sizes, factory installed
ORDERING INFORMATION example 12 digit part 507302B000 _ _G
Ordering code
Ordering code 04 05

Thread #6-32 #4-40

MALE SEMICONDUCTOR MOUNT

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TSMhur-LockTM Tabs

Aavid’s Shur-Lock self locking stand-off tab U.S. Patent #5,437,561 positively secures any heat sink to the printed circuit board. This Shur-Lock tab exhibits many unique design features.

The rounded and bifurcated tip of the Shur-Lock solderable tab has been designed to easily snap into any diameter hole. Once through the hole, the tab provides a positive resistance to backing or falling out of the hole. In addition, the spring action between the tab and the plated through hole prevents leaning or lift-off of the heat sink prior to or during the soldering process. The tip extension of the Shur-Lock tab has been designed to protrude less than beyond the back of a standard PC board, which is below the normal lead trimming allowance for assembled PCBs.

Shur-Lock’s stand-off design facilitates the cleaning of assembled PCBs and permits electrical traces to be routed under the heat sink. The wide base supports of the tab further improve the stability of the heat sink assembly.
ORDERING INFORMATION example 12 digit part 574802B0 _ 00G

PRODUCT INFORMATION
Ordering code

Material

Spring steel

Finish

Tin plating over a copper flash

Pull-out force*
70 lbs/tab minimum

Recommended PCB hole diameter PCB thickness

Variations of the above specifications are possible. Contact Aavid Thermalloy for additional details for use with thicker PCB sizes, such as or other hole diameters. *Vertical force applied to the sink-tab joint.

TSMolderable Staked on Tabs
• Positive PCB engagement
• Integrated PCB stand-off
• Quick “snap-in” assembly design
• Reduces installed assembly cost
• Designed for rugged shock
and vibration environments
• Can be installed on a variety of stamped
and extruded board level heat sinks Factory applied only
Tab ordering code 28

Aavid solderable tabs stake onto heat sinks for solder mounting into the PC board. The tabs are available in a variety of lengths, widths and thicknesses.

Tabs are factory applied for both vertical and horizontal mountings including step tabs, which keep the heat sink elevated above the board, and tabs with a triangular base for extra stability.

Many of Aavid’s tabs are customized. Below are examples of standard tabs. Please consult Aavid’s customer service department for information about other tab options.
ORDERING INFORMATION example 12 digit part 574802B0 _ 00G
Ordering code
Tab ordering code 31
Tab ordering code 32

Tabs

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Tabs
Tab ordering code 33
Tab ordering code 35
Tab ordering code 34

Note The drawing above shows the right hand of a matched pair which are supplied mounted to the heat sink.
Tab ordering code 36
Tab ordering code 37
Tab ordering code 39

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Tab ordering code 40
Tab ordering code 43

Tabs

Solderable Mounting Tabs

Heat sinks ordered with solderable mounting tabs have tin-plated spring steel tabs permanently locked onto the heat sink to provide wave solderability. The solderable tabs are mounted on the heat sink after anodizing, thus eliminating any special coating or handling. The result is a wave solderable heat sink with black anodized performance.

FIGURE A
"A" "B"
ORDERING INFORMATION example 12 digit part 574802B0 _ 00G
example
Ordering code

Thermalloy origin part G A = Model number

B = Mounting tab suffix

B C = RoHS compliant

MT3 ONLY

BEVELED CORNERS MT3 ONLY

Typical Installation

FIGURE B

SEE DETAIL B

DETAIL B

ADD TO HEIGHT OF PART
"A" REF

TRIANGULAR TAB

Suffix MT MT2 MT3

MT5 MT6
Ordering code Stand-off height

Features Solderable mounting tab Solderable mounting tab 50 degree beveled corners on stand-off portion reducing board footprint from to width. Only tab with this feature. Bifurcated tabs in lieu of triangular shape Bifurcated tabs in lieu of triangular shape
“A” Dim
“B” Dim

Figure A

Recommended PCB plated thru hole:
± ±
± ±
± ±
± ± ± ±

Notes Mounting tabs have unique locking features built into their design. Aavid Thermalloy adds to standard and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold separately. Please see page 85 for additional tab options.

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Solderable Pins / Solderable Nuts

Solderable Pins

Vertically mounted, extruded heat sinks are converted to wave solderable with the addition of solderable roll pins. Roll pins are available with stand-off shoulders in different heights for easier cleaning after wave soldering.

FIGURE A

Pin 25
"A" Pin P2-P3

FIGURE B

Typical installation P2-P3
ORDERING INFORMATION example 12 digit part 529902B0 _ 00G
example
Ordering code

Thermalloy origin part G A = Model number

B = Solid pin suffix

B C = RoHS compliant
0.097 REF

Heat sink "A"
Suffix Ordering code

Description Solid pin w/stand-off shoulder Solid pin w/stand-off shoulder Solid solderable pin
“A” Dim

Figure A B

PC Board Stand-Off Shoulder

Solderable Nuts

Solderable nuts are permanently swaged into the heat sink for quick pre-assembly with the transistor. Screws are used to mount to the heat sink and are installed from the top. Solderable nuts feature a closed end that prevents solder from wicking into threads and trapping contaminants or flux. Heat sink and transistor are then handled as a single component and dropped into plated-thru holes in the PC board for wave soldering. Solderable nuts require slightly larger printed circuit board hole sizes
ORDERING INFORMATION example 12 digit part 506003B0 _ 00G
example Thermalloy origin part
Ordering code

A = Model number B = Solderable nut suffix C = RoHS compliant

Suffix SNM-1 SNE-1 SNE-2
Ordering code N/A 14 13

Dia of PCB thru hole

Thread M3X0.5 4-40 UNC-2B 6-32 UNC-2B

Note If a part number requires 2 solderable nuts, simply add a "/2" after the solderable nut character suffix on Thermalloy origin parts.

Mechanical drawings showing heat sinks with solderable nuts

SOLDERABLE NUT

FEATURES
• Pre-mounted to heat sink at factory
• Ease of pre-assembly in production
• Mechanical and electrical integrity
• Wave solderability

THREAD

SOLDERABLE NUT

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Clinch Nuts

Clinch nuts are threaded nuts that allow quick assembly of the transistor to the heat sink. A single screw mounts the transistor to the heat sink, reducing your hardware requirements. Clinch nuts are permanently pressed into the heat sink, and come in a variety of English and Metric designates an English thread, and CNM designates a Metric thread.

FIGURE A

SECTION A-A

Clinch Nuts

FIGURE B
"A" "B"
ORDERING INFORMATION example 12 digit part 529801B000 _ G
example Thermalloy origin part
Ordering code

G A = Model number

B = Clinch nut suffix

B C = RoHS compliant

Suffix CNE42 CNE43 CNM1 CNM2
Ordering code 12 N/A 13 N/A

Thread 4-40 UNC-2B 4-40 UNC-2B

M3 X M3 X
“A” Dim
“B” Dim

Figure A B

Mechanical drawing showing heat sink with clinch nut CLINCH NUT

CLINCH NUT INSTALLED

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Studs

Solderable Studs

Threaded solderable studs are permanently swaged in place for quick pre-assembly with the transistor. The device is placed over the stud s followed by the lock washer and nut. This entire component is then dropped into plated-thru holes in the printed circuit board for wave soldering. The end of the stud is tin-plated for excellent solderability and extends only below a PC board to clear lead trimming saws.
"A" "B"
ORDERING INFORMATION example 12 digit part 501303B000 _ G
example Thermalloy origin part
Ordering code

A = Model number B = Stud suffix C = RoHS compliant

Suffix SE-1 SE-2 SE-3 SE-4 SM-1 SM-3
Ordering code 08 06 09 14 17 07

Dia of PCB thru hole
“A” Dim
“B” Dim 6-32 6-32 4-40 6-32

M3 x M3 x
“C” Dim

Figure

Note Factory installed only

Typical installation FIGURE A

FIGURE B

HEAT SINK

PC BOARD

HEAT SINK "C" "C"

PC BOARD

Device Mounting Studs

Device mounting studs for "Thermalloy-origin" items are available as options on certain vertical and board mount heat sinks as a labor-saving aid for mounting semiconductors. This optional feature speeds production assembly time and reduces hardware requirements.
ORDERING INFORMATION example 12 digit part 529801B000 _ _G
example Thermalloy origin part
Ordering code

G A = Model number

B = Stud suffix

B C = RoHS compliant

Suffix SF1 SF2 SF3
Ordering code 11 N/A N/A

Note Factory installed only
“A” Dim
“B” Dim 4-40 UNC-2A

M3 x 6-32 UNC-2A
“C” Dim
“D” Dim
"A" "D"
"B" "C"

Mechanical drawing showing heat sink with device mounting studs

CL Device Mounting Stud

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Aavid Kool-KlipsTM

These one piece stainless steel clips eliminate the need for screws, lock washers and nuts in the assembly process, therefore reducing assembly time and cost. These can be bought separately, or found in the 11th or 12th position when deciphering an Aavid Standard product. Please reference Indexes to see which clips are popular with which product offering.
6801G

Clips
ORDERING INFORMATION To order clips seperately use part number below. To order a clip as an option use ordering code.
example 12 digit part 530101B000 _ G
Ordering code

Part number 5901G 6801G 7701G

Transistor case style TO-220, TO-218 TO-220, TO-218 TO-220, TO-218 TO-220, TO-218 TO-220 TO-220, TO-218 TO-220, TO-218, TO-247 TO-220, TO-218, TO-247 TO-220
Ordering code 50 51 52 53 54 62

Sold separately only Sold separately only Sold separately only

Code 50

Code 52
5901G
7701G

Code 51

Code 53

Code 54

Code 62

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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS

Clips

Thermal Clips

Factory-Installed ONLY thermal clips, available on many standard heat sinks shown below eliminate the use of screws and nuts in assembling the heat sink and transistor. Plastic case transistors slip into place for easy assembly. Thermal clips are available in a variety of configurations. Locking clips have an internal tab to lock the transistor permanently in place.
ORDERING INFORMATION example 12 digit part 530600B000 _ G
example
Ordering code

Thermalloy origin part G A = Model number

B = Clip suffix

C = RoHS compliant

Suffix TC1 TC6 TC7 TC10 TC11 TC12
Ordering code Transistor case style

TO-220

TO-218, TO-220, Multiwatt

N/A TO-218, TO-220, Multiwatt

TO-220, TO-218

TO-220

TO-218, TO-220

Clip/Cover features Locking Insulated Locking Insulated Locking

TC-1 Code 32

TC-6 Code 36

TC-7 Code N/A

TC-10 Code 33

TC-11 Code 34

TC-12 Code 35

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Mounting Kits

Mounting Kits
• Pre-packaged in heat-sealed plastic bags for use on assembly line.
• Stock mounting hardware using one number for better control and identification.
• Three different insulating materials available Low cost ThermalfilmTM High temperature Mica High performance ThermalsilTM lll
• Other insulator materials available for special order include hard anodized aluminum and aluminum oxide.
• Individually packaged for convenient stocking and handling of mounting hardware. Kits contain all hardware necessary to electrically isolate the transistor from the heat sink.

TO-220 Mounting kit part number 4880
ORDERING INFORMATION

Part number 4880G 4880MG 4880SG

Description Kit with ThermalfilmTM Kit with Mica Insulator Kit with ThermalsilTM III

EACH KIT INCLUDES:
43-77-9 56-77-9 53-77-9 7721-7PPS MS15795-804

MS35649-244

MS51957-17 MS35338-135

Item Qty

Insulator ThermalfilmTM see page 101 Mica see page 103 ThermalsilTM III see page 103

Shoulder washer

Flat washer #4 No. 4-40 UNC-2B

Hex nut No. 4-40 UNC-2A X
1/2 Long phillips pan head screw

Lock washer, No. 4

Note Smooth side of flat washer should be placed against insulator when using the kit.

TO-3 Mounting kit part number 4804
ORDERING INFORMATION

Part number 4804G 4804MG 4804SG

Description Kit with ThermalfilmTM Kit with Mica Insulator Kit with ThermalsilTM III

EACH KIT INCLUDES:

Item
43-03-2 56-03-2 53-03-2
7721-5PPS

MS15795-805

MS35649-264

MS 51957-30

MS35338-136
322-156

Description Insulator ThermalfilmTM see page 101 Mica see page 103 ThermalsilTM III see page 103 Shoulder washer Flat washer #6 No. 6-32 UNC-2B Hex nut No. 6-32 UNC-2A X 1/2 Long phillips pan head screw Lock washer, No. 6 Solder lug

Note Smooth side of flat washer should be placed against insulator when using the kit.

TRANSISTOR NOT INCLUDED

TRANSISTOR

NOT INCLUDED

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ACCESSORIES

ACCESSORIES

Insulating Shoulder Washers

FEATURES
• Available in nylon or polyphenylene sulfide
• Chemically inert [no known solvents under 200°C 392°F ]
• Maximum recommended service temperature of 260°C 500°F
• Recommended torque is 0.565Nm to 0.678Nm 5 to 6 inch-pounds
on all shoulder washers except which has recommended torque of 0.452Nm 4 inch-pounds

Polyphenylene Sulfide PPS Shoulder Washers

FIGURE A

FIGURE B

Part number 7721-1PPSG 7721-2PPSG 7721-3PPSG 7721-5PPSG 7721-6PPSG 7721-7PPSG* 7721-10PPSG
“A” Dim
“B” Dim
“C" Dim
"D" Dim
"E" Dim

Note A single gate extension, not to exceed in length, is allowable on the outside of all shoulder washers.
* Design allows insertion in the tab of a TO-220. ** Also for M3 screw.

Nylon Shoulder Washers

Screw size 4 6 4**

Figure A B
ORDERING INFORMATION For standard pre-cut sizes of ThermalfilmTM and ThermafilmTM MT see page

ELECTRICAL TYPICAL VALUE 25° C

PROPERTY

THERMALFILM

Dielectric strength
0.03mm 1-mil
240 x 103 volts/mm
6,100 volts/mil

Dielectric constant

Dissipation factor

Volume resistivity
1017 ohm-cm

Surface resistivity
1016 ohms

Corona start voltage 0.025mm 1-mil 465 volts

Insulation resistance
megohm mfds.

THERMALFILM MT x 103 volts/mm 4500 volts/mm
1017 ohm-cm 1016 ohms 465 volts megohm mfds.

Material thickness Ultimate tensile strength MD Bursting strength test Mullen Tear strength initial Density Folding endurance MIT

Melting point Zero strength temperature Cut through temperature

Service temperature

Thermal conductivity

Flammability

PHYSICAL
0.05mm
0.05mm
x 108 Pa 25,000 psi
103 MPa 1500 psi
x 105 Pa 45 psi

MPa 45 psi
27,559 gm/mm 700 gm/mil gm/cm3 lb/ft3 >10,000 cycles
35,433 gm/mm 900 gm/mil gm/cm3 lb/ft3 >10,000 cycles

THERMAL

NONE

NONE
815ºC 1499ºF
815ºC 1499ºF
435ºC 815ºF
435ºC 815ºF
525ºC 977ºF
ORDERING INFORMATION

Part number “A” Dim
“B” Dim
43-03-2G
43-03-4G
“C” Dim
“D” Dim

ThermalfilmTM information on page 101 Dimensional tolerances are ± 0.38mm hole diameters are ± 0.25mm and angularity is ± 1/2° unless otherwise specified.
"D" DIA TYP 2
"C" DIA TYP 2

Thermalfilm for TO-5 and TO-18
ORDERING INFORMATION

Part number 43-05-1G 43-05-2G 43-18-1G

Device TO-5 TO-5 TO-18

Figure A B A
“A” Dim
“B” Dim

ThermalfilmTM information on page 101 Dimensional tolerances are ± 0.38mm hole diameters are ± 0.25mm and angularity is ± 1/2° unless otherwise specified.
“C” Dim

FIGURE A "A"

FIGURE B "A"

DIA TYP 4

Thermalfilm for TO-220, TO-126, Case 77, Case 199, Case 90, TO-218 and TO-3P
ORDERING INFORMATION

Device
43-77-1G

TO-126, Case 77
43-77-2G

Case 90, Case 199
43-77-8G

Case 90, Case 199
43-77-9G

TO-220
46-77-9G*

TO-220
43-77-20G TO-220, TO-218, TO-3P
“A” Dim
“B” Dim
“C” Dim
* ThermalfilmTM MT part numbers begin with “46”

ThermalfilmTM information on page 101 Dimensional tolerances are ± 0.38mm hole diameters are ± 0.25mm and angularity is ± 1/2° unless otherwise specified.
“D” Dim
"A" "D" DIA
"C" DIA TYP 3

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ACCESSORIES

Mica and ThermalsilTM III

Thermalsil III provides excellent thermal conductivity and electrical resistance. It is used as an electrically-isolating interface material composed of silicone elastomer binder with a thermally conductive filler. It is reinforced with glass cloth to resist tearing and cut-through due to burrs on transistors or heat sinks.

Thermalsil III eliminates the need for grease application and conforms to mounting surfaces under clamping pressure for optimum heat conduction. The finely woven glass cloth provides the thinnest possible matrix for enhanced thermal resistance. Thermalsil III is available in any configuration with adhesive backing.

Mica insulators provide high maximum operating temperatures 550°C and excellent electrical properties.

Insulators Mica and ThermalsilTM III

FIGURE A

FIGURE B
"D" DIA TYP 2
"C" DIA TYP 2
"D" DIA "B"
"A" "B"
ORDERING INFORMATION
56-77-9G

Mica
56-03-2G

Mica
53-77-9G

ThermalsilTM III
53-03-2G

ThermalsilTM III

Device TO-220

TO-3 TO-220

TO-3
"A" Dim
"B" Dim
"C" Dim
"D" Dim

Figure B A B A

TYPICAL PROPERTIES FOR MICA INSULATORS

Property

Electrical

Dielectric strength
172 X 103 volts/mm 4500 volts/mil
mm to mm thick in air 1 to 3 mils thick in air

Dielectric constant

Dissipation factor
106 Hz

Volume resistivity
1015 ohm-cm

Physical

Modules of elasticity in tension
172 X 103 Mpa 25 X 106 psi

Tensile strength
310 Mpa 45,000 psi

Hardness mohs, shore

Compressive strength

X 108 Pa 32,000 psi

Specific gravity

Thermal

Thermal conductivity

W/ m °C Btu/hr-ft °F

Coefficient of thermal expansion X 10-5 °C X 10-5 °F
ORDERING INFORMATION

Part number Thickness “A” Dim
“B” Dim
“C” Dim “D” Dim “E” Dim
4103G*
4104G*

DIA TYP 4
"C" RAD TYP 2
"D" RAD TYP 2

Aluminum Oxide Ceramic for TO-220
ORDERING INFORMATION

Part number Thickness “A” Dim
“B” Dim “C” Dim “D” Dim “E” Dim
4169G*
4170G**
4171G**
4177G**
"A" "E" DIA

Aluminum Oxide Ceramic for TO-218, TO-247, and TO-3P
ORDERING INFORMATION

Part number Thickness “A” Dim
“B” Dim “C” Dim “D” Dim “E” Dim
4180G*
"B" "D"
"C" "E"

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Insulators Stanchion Pads
8923-1, 8923-2, 8924 Stanchion Pads
• Reduces stress on leads during wave solder and post-soldering operations
• Provides stable mount to resist shock and vibration damage to leads
• 8923-1, 8923-2, and 8924 fit the TO-220

SEE DETAIL "D" 8924 ONLY
ORDERING INFORMATION
“A” Dim
“B” Dim
8923-1G
8923-2G
8924G
“C” Dim

Note Tolerances ± unless otherwise specified. Material is nylon 6/6 rated 94 V-O

DETAIL "D" 8924 ONLY

DIA THRU TYP 3

SQ TYP 4

ACCESSORIES

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ACCESSORIES

Insulating Covers

TO-3 Insulating Covers

Insulating covers are designed to provide protection from accidental shock during field service or repair.

Pan head screws not 51957-30 or equivalent the cover to the TO-3. At the typical mounting screw torque of Nm 6-8 inch pounds , the TO-3 cover material cold-flows around the screw head to securely fasten the cover.

Included are No.6 split washers as inserts to provide electrical connection of mounting screws to the TO-3 collector and an insulating snap-in cover for the screw heads. A test probe hole is provided in the top of the cover.

The 8903VB is made from thermoplastic polyester that meets the requirements of UL Bulletin 94 V-O. In addition to its excellent flammability rating, thermoplastic polyester offers resistance to most chemical environments, heat deflection temperature to 215.6°C 420°F and UL continuous use temperature of 130°C 266°F .
ORDERING INFORMATION

Material
8903NWG

Nylon
8903VBG Thermoplastic polyester

Color White Black

Flammability standards Self-extinguishing UL 94 V-2 Self-extinguishing UL 94 V-0 UL 492 Type 1

DIA THRU

DIA THRU TYP 2

Teflon-filled Acetal Insulators for TO-3

Part number 103G 109G

Fits notch
“A” Dim
Ø Ø

Teflon-filled Acetal Bushings for TO-3

Part number 110G 113G
“I.D.”
“O.D.”
“T”
"O.D." "T"
"I.D."

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ACCESSORIES

Mounting Pads

FEATURES
• Prevent heat damage during soldering
• Facilitate board clean-up
• Prevent solder bridges
• Assure uniform device height

PRODUCT INFORMATION

Suffix

Base material

MAXIMUM OPERATING TEMPERATURE

Continuous

Deflection

Color

Nylon base resin
per ASTM STD

D4066-82-PA111
121.0°C 250°F
243.3°C 470°F
ORDERING INFORMATION
7717-130G
7717-247G 7717-26G 7717-44G

Converts lead spacing from
# of Leads

For epoxy transistors

In-Line TO-92 & TO-15

For TO-18

TO-18

TO-5

TO-18

TO-5

TO-18

TO-5

See pages 108 and 109 for mechanical drawings

Outside dia

Thickness

Index of Semiconductor Mounting Pads
ORDERING INFORMATION

Part number Leads

Outside dia For TO-5
7717-86G
7717-178G
7717-79G
7717-3G
7717-15G
7717-5G
7717-4G

For TO-18
7717-16G 7717-18G 7717-108G 7717-89G 7717-7G

For integrated circuits
7717-122G 7717-8G 7717-156G

Misc. mounting pads
7717-175G Crystal Can Relay / x

Thickness

See pages 108 and 109 for mechanical drawings

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ACCESSORIES

Mounting Pads
7717-3G
7717-5G
Ø TYP 8 Ø
Ø C SINK TYP 4
7717-8G
Ø TYP 4
7717-16G

B.C.

TYP 4
Ø TYP 8
Ø B.C.
Ø TYP 8
Ø TYP 4
7717-4G
Ø Ø TYP 4
7717-7G
ORDERING INFORMATION

Aavid Thermalloy code Finish option must be noted by one of the above letters in the 7th position. Aavid's standard finish is black anodize B unless otherwise noted.
example 12 digit part

A = Base part B = Finish code C = RoHS compliant

Thermalloy origin suffix The suffixes should be added after the model number to indicate the desired finish.
example Thermalloy origin part 6396B G

A = Model number B = Finish suffix C = RoHS compliant

Note All thermal graphs reflect black anodize finish.

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ACCESSORIES

Snap-On Ejectors / Pullers

FEATURES
• Saves time no roll pin required
• Excellent for retrofit applications
• Material is nylon per ASTM D4066-82PA162F11
• Cost no more than conventional ejector/puller
• Rated at 222.5N 50 lbs. / ejector force per pair
• One piece no assembly required
• May be heat stamped
ORDERING INFORMATION

Part number 5021NG

Card Ejectors
5021NG Ejector

Standard Ejectors / Pullers

FEATURES
• Lever action releases card from its connector safely and quickly
• Cards, their components and connectors are less frequently damaged when extracting PC boards
• No special extraction tools are needed for board removal
• Material is nylon per ASTM D4066-82 PA120B4413F24, UL 94 V-O rated natural color
• Roll pins are provided NAS 561-P3-4
ORDERING INFORMATION

Part number 5005-09NG 5005-08NG 5005-25NG

Figure A B C

FIGURE A
5005-09NG PULLER *

DIA TYP 2
*No roll pins provided

FIGURE B
5005-08NG SLIM FACE/ FLAT

FIGURE C
5005-25NG COMBINATION EJECTOR/PULLER

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ACCESSORIES

Grease & Epoxy

Sil-FreeTM

Sil-FreeTM 1020 is a metal-oxide-filled, silicone-free synthetic grease specially formulated to enhance heat transfer across the interface between the semiconductor case and the heat sink without the migration or contamination associated with silicone-based products. Dry interface case-to-sink thermal resistance is typically reduced 50% to 75% with proper application of Sil-FreeTM This virtually "no-bleed", high-performance compound will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to 200°C. Even in a vacuum atmosphere 10-5 Torr, 24 Sil-FreeTM 1020 exhibits virtually "no bleed" or evaporation.
ORDERING INFORMATION

Package Syringe

Tube Jar

Size 43 grams oz 57 grams oz 57 grams oz

Tube Jar
143 grams oz 457 grams oz

Ther-O-LinkTM

Ther-O-LinkTM is a silicone-based thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-LinkTM substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions.
ORDERING INFORMATION

Package

Size

Ampule
1 gram oz

Syringe grams oz

Tube
57 grams oz

Tube
143 grams oz

Tube
grams oz
kg 1 lb
kg 5 lb
kg 20 lb

UltrastickTM

Aavid's UltrastickTM is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffinbased thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces. UltrastickTM comes in a convenient applicator bar, allowing for neat, fast application to both heat sink and component surfaces. One cost-effective application leaves a thin, film-like deposit, providing excellent heat transfer and low interface thermal resistance.
ORDERING INFORMATION

Package Bar

Size grams oz

PRODUCT INFORMATION

Color Thermal conductivity Operating temperature range Volume Weight Dielectric strength Consistency Bleed

Specific gravity Shelf life

White W/ m-°C
-40°C to +200°C
1012 Ohm-cm ± grams 225 volts/mil Paste max % after 24hr 200°C ± Indefinite unopened *
* It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing

PRODUCT INFORMATION

Color Thermal conductivity Operating temperature range Volume resistivity Dielectric strength Consistency Bleed Specific gravity Shelf life

White W/ m-°C -40°C to +200°C
x 1015 Ohm-cm 250 volts/mil Paste max Indefinite unopened *
* It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing

PRODUCT INFORMATION

Temperature range Volume resistivity Dielectric strength Consistency Bleed Specific gravity Color Thermal resistance

Shelf life
-40°C to +200°C X Ohm-cm 250 volts/mil Paste max Opaque White 0.03°C/W per square inch 20 psi 0.02°C/W per square inch 100 psi Indefinite*
* Recommended max. storage temperature 40ºC 105ºF

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ACCESSORIES

ThermalcoteTM

ThermalcoteTM is a superior thermal joint compound of thermally loaded silicone based grease for use with all heat sinks. It improves the transfer of thermal energy across the metal to metal interfaces between the transistor or rectifier case and the heat sink. ThermalcoteTM conducts heat approximately 15 times better than air and more than 4 times better than unloaded silicone grease. It is non-toxic, extremely stable, and neither cakes or runs from -40° to 204°C -40°F to 399°F .
ORDERING INFORMATION

Part number 249G 250G 251G 252G 253G

Net weight 28 grams 1 oz tube 57 grams 2 oz tube
kg 1 lb can 2.27kg 5 lb can kg 10 lb can

ThermalcoteTM ll

Thermalcote II was developed as the sensible alternative to silicone-based thermal greases. ThermalcoteTM II employs a highly conductive synthetic base fluid that enables the finished product to exhibit the same thermal characteristics as the silicone-based products.

Thermalcote II contains no silicone. The high lubricity of the base oil permits efficient application to both semiconductor case or heat sink, and it will effectively fill the microscopic air gaps on the metal-to-metal mating surfaces. It is non-toxic, extremely stable, and neither cakes or runs from -40° to 200°C -40°F to 392°F .
ORDERING INFORMATION

Part number 349G 350G

Net weight 28 grams 1 oz tube 57 grams 2 oz jar
351G
kg 1 lb can

Grease & Epoxy

PRODUCT INFORMATION

Color Operating temperature range Thermal conductivity Dielectric strength

Cleaning solvent Specific gravity Evaporation 24 392°F , wt% Shelf life

Opaque white -40°C to 204°C -40°F to 399°F
0.765W/ m °C Btu/hr ft °F x 103 volts/mm 300 volts/mil mm gap Mineral spirits or turpentine
1 Indefinite unopened *
* It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing

PRODUCT INFORMATION

Color

Blue

Operating temperature range
-40°C to 200°C -40°F to 392°F

Thermal conductivity
0.699W/ M °C Btu/hr ft °F

Dielectric strength
x 103volts/mm 200volts/mil mm gap

Cleaning solvent

Mineral spirits or turpentine

Specific gravity
15.6°C

Evaporation, 24 392°F , wt% max

Shelf life

Indefinite unopened *
* It is recommended that the containers be turned over every 6 months to minimize settling for ease of mixing

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Grease & Epoxy

Ther-O-BondTM Adhesive
ORDERING INFORMATION

Description Ther-O-BondTM 1500 Ther-O-BondTM 1600 Ther-O-BondTM 1600 Ther-O-BondTM 2000

Package/Kit Resin and hardener
2-Part plastic kit 2-Part plastic kit Adhesive syringe Activator bottle

Size liter 1 qt 10gm oz 40gm oz
25ml 13ml

ACCESSORIES

Ther-O-BondTM 1500

Ther-O-BondTM 1500 is a versatile epoxy casting system developed for high performance, production potting and encapsulating applications where low shrinkage and rapid air evacuation are required. This formulation has a very low surface tension and a flowable viscosity, which affords excellent air release. Ther-O-BondTM 1500 adhers to rigid plastics and laminates, metals and ceramics, has a low coefficient of thermal expansion and is readily machined and shaped with ordinary shop tools. The fully cured epoxy system is an excellent electrical insulator which provides good resistance to electrolysis, leakage and corrosion room water, weather, gases and chemical compounds.

HANDLING CHARACTERISTICS

Mix ratio by weight, resin to hardener Mixed viscosity 25°C, cps Work-life 25°C Gel time 25°C
100 to 15
1000 - 1500 45 Minutes 3-6 Hours

Cure schedule 25°C Cure schedule 65°C Cure schedule 100°C
8 Hours 1 Hour

Ther-O-BondTM 1600

For smaller applications, Ther-O-BondTM 1600 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic smooth paste thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. Ther-O-bondTM 1600 bonds readily to itself, to metals, silica, steatie, alumina, sapphire and other ceramics, glass, plastics and many other materials because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range.

HANDLING CHARACTERISTICS

Mix ratio by weight, resin to hardener:
100 to 5

Mixed viscosity 25°C, cps Work-life 25°C Gel time 25°C Cure schedule 25°C Cure schedule 65°C
33,000 45 Minutes 3-6 Hours 8 Hours 1 Hour

Cure schedule 100°C

Hour

PHYSICAL PROPERTIES

Color Specific gravity Operating temp, °C Heat distortion temp, °C Hardness, shore D Thermal conductivity W/ m°C Compressive strength, psi Dissipation factor, Self extinguishing C.T.E. ppm/°C Tensile strength Dielectric Shelf life

Black -60 to 155 100 88
14,000 yes 25 9200 psi 800 18 months*
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment.

Ther-O-BondTM 2000

Ther-O-BondTM 2000 acrylic adhesive cures rapidly at room temperature, while providing a repairable, thermally conductive bond.

PHYSICAL PROPERTIES

Color Specific gravity Operating temp, °C Hardness, shore D Izod impact, F1 Lbs/Inch of notch Thermal conductivity W/ m-°C.T.E. ppm/°C Tensile strength Tensile lap shear, psi Dielectric strength volts/mil Dielectric constant 1 KHz 25°C Dissipation factor, 25°C Shelf life

Blue -70 to 115 90
25 9200 psi 2900 410 18 months*

PRODUCT INFORMATION

Color Thermal conductivity W/ m-°C.T.E. ppm/°C Tensile strength Dielectric strength volts/mil Shelf life

White
25 2360 psi 220 18 months*
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment.

AMERICA EUROPE
ORDERING INFORMATION

Net weight
4949G
oz 25 gram kit
4950G
oz 50 gram kit
4951G
oz 100 gram kit
4952G
oz 200 gram kit
4953G
4 lbs 1814 grams

MIXING INSTRUCTIONS

Mix resin thoroughly before removing material. Add parts of RT-7 hardener to 100 parts of resin by weight, or 17 parts of RT-7 hardener to 100 parts of resin by volume. Adhesive will set up in:
24 hrs at 25°C 77°F 2 hrs. at 65°C 149°F
1 hr. at 100°C 212°F 30min. at 130°C 266°F

Note For maximum electrical and physical properties, a post cure is neccessary. Post cure at room temperature for 4 days or for 4 hours at 93°C 200°F .

HANDLING CHARACTERISTICS

Typical electrical and physical properties at room temperature with RT-7 hardener

Color

Green

Specific gravity

Working viscosity
25,000 cps

Thermal conductivity
1.34W/ m °C Btu/hr
•ft• °F

Thermal resistivity
29.4°C in/watt

Tensile strength
x 107 Pa 9,2000 psi

Compressive strength
x 108 Pa 20,9000 psi

Bond shear strength aluminum to aluminum, 25.4mm 1" overlap 25°C, 77°F
x 107 Pa 4,6000 psi

Thermal coefficient of expansion
24 x 10-6/°C x 10-6/°F

Water absorption, % after 10 25°C 77°F

Hardness, Shore D

Volume resistivity
x 1016

Dielectric strength
More datasheets: 529802B00000 | 320205B00000G | 568300B00000 | 2227B | 7721-10PPSG | 7721-15NG | 7721-3PPSG | 7721-6PPSG | 7721-13NG | 7721-11NG


Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 7717-21DAPG Datasheet file may be downloaded here without warranties.

Datasheet ID: 7717-21DAPG 521706