2322 661 97204

2322 661 97204 Datasheet

2322 661 Surface mount PTC thermistors for overload protection

Part	Datasheet
2322 661 97204	2322 661 97204 (pdf)

Related Parts	Information
2322 661 97203	2322 661 97203
2322 661 97205	2322 661 97205

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BCcomponents DATA SHEET 2322 661 Surface mount PTC thermistors for overload protection Product specification Supersedes data of 17th May 1999 File under BCcomponents, BC02 2001 Feb 14 BCcomponents Surface mount PTC thermistors for overload protection Product specification 2322 661 • Ideal for pick-and-place circuit assembly • Low mounting height • Suitable for reflow soldering • Small ceramic diameter for faster response • Low heat transfer to substrate • Flat terminations for stable positioning and good solderability. • Telecom Central office switching C.O. Subscriber terminal equipment T.E. Set top box Modems Cable TV communications • General industry and automotive Low power supplies overload protection Data bus protection. CCB833 Fig.1 Product outline. The component consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board PCB or substrate. The ceramic is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux. QUICK REFERENCE DATA Nominal R25 Resistance tolerance Maximum overload current voltage dependent Non-trip current Maximum voltage Response time at 25 °C and 20 W overload power Matching Maximum continuous power at 25 °C VALUE STANDARD TYPES 1 2 TELECOM TYPES 1 2 2 to 500 10 to 70 ±10% ±15% ±20% 2 to 10 A 50 to 500 mA at 25 °C 50 to 100 mA at 70 °C 16 to 400 V RMS − 220 to 600 V RMS <1 s down to 2W Notes Customized products between the resistance ranges are available on request. Coated and/or reinforced types are available on request. 2001 Feb 14 BCcomponents Surface mount PTC thermistors for overload protection Product specification 2322 661 SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with “CECC Soldering processes which can be used are reflow infrared and convection heating and vapour phase. The maximum temperature of 260 °C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown in Figs 2 and °C 250

PDF Datasheet Preview

BCcomponents

DATA SHEET
2322 661 Surface mount PTC thermistors for overload protection

Product specification Supersedes data of 17th May 1999 File under BCcomponents, BC02
2001 Feb 14

BCcomponents

Surface mount PTC thermistors for overload protection

Product specification
2322 661
• Ideal for pick-and-place circuit assembly
• Low mounting height
• Suitable for reflow soldering
• Small ceramic diameter for faster response
• Low heat transfer to substrate
• Flat terminations for stable positioning and good
solderability.
• Telecom Central office switching C.O. Subscriber terminal equipment T.E. Set top box Modems Cable TV communications
• General industry and automotive Low power supplies overload protection Data bus protection.

CCB833

Fig.1 Product outline.

The component consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board PCB or substrate.

The ceramic is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux.

QUICK REFERENCE DATA

Nominal R25 Resistance tolerance Maximum overload current voltage dependent Non-trip current Maximum voltage Response time at 25 °C and 20 W overload power Matching Maximum continuous power at 25 °C

VALUE

STANDARD TYPES 1 2

TELECOM TYPES 1 2
2 to 500
10 to 70
±10% ±15% ±20%
2 to 10 A
50 to 500 mA at 25 °C
50 to 100 mA at 70 °C
16 to 400 V RMS −
220 to 600 V RMS <1 s
down to 2W

Notes Customized products between the resistance ranges are available on request. Coated and/or reinforced types are available on request.
2001 Feb 14

BCcomponents

Surface mount PTC thermistors for overload protection

Product specification
2322 661

SOLDERING CONDITIONS

This SMD thermistor is only suitable for reflow soldering, in accordance with “CECC Soldering processes which can be used are reflow infrared and convection heating and vapour phase. The maximum temperature of 260 °C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body.

Typical examples of a soldering processes that will provide reliable joints without damage, are shown in Figs 2 and
°C 250

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 2322 661 97204 Datasheet file may be downloaded here without warranties.

Datasheet ID: 2322 661 97204 521576