FQPF6P25

FQPF6P25 Datasheet

FQPF6P25

Part	Datasheet
FQPF6P25	FQPF6P25 (pdf)

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FQPF6P25 FQPF6P25 250V P-Channel MOSFET April 2000 QFETTM These P-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switching DC/DC converters. • -4.2A, -250V, RDS on = = -10 V • Low gate charge typical 21 nC • Low Crss typical 20 pF • Fast switching • 100% avalanche tested • Improved dv/dt capability TO-220F FQPF Series Absolute Maximum TC = 25°C unless otherwise noted Parameter VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG Drain-Source Voltage Drain Current Drain Current - Continuous TC = 25°C - Continuous TC = 100°C - Pulsed Note 1 Gate-Source Voltage Single Pulsed Avalanche Energy Note 2 Avalanche Current Note 1 Repetitive Avalanche Energy Note 1 Peak Diode Recovery dv/dt Note 3 Power Dissipation TC = 25°C - Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, from case for 5 seconds Thermal Characteristics Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient FQPF6P25 -250 540 45 -55 to +150 Units V A V mJ A mJ V/ns W W/°C °C Units 2000 Fairchild Semiconductor International FQPF6P25 Electrical = 25°C unless otherwise noted

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FQPF6P25

FQPF6P25
250V P-Channel MOSFET

April 2000

QFETTM

These P-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switching DC/DC converters.
• -4.2A, -250V, RDS on = = -10 V
• Low gate charge typical 21 nC
• Low Crss typical 20 pF
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

TO-220F

FQPF Series

Absolute Maximum TC = 25°C unless otherwise noted

Parameter

VDSS ID

IDM VGSS EAS IAR EAR dv/dt PD

TJ, TSTG

Drain-Source Voltage

Drain Current Drain Current
- Continuous TC = 25°C - Continuous TC = 100°C - Pulsed

Note 1

Gate-Source Voltage

Single Pulsed Avalanche Energy

Note 2

Avalanche Current

Note 1

Repetitive Avalanche Energy

Note 1

Peak Diode Recovery dv/dt

Note 3

Power Dissipation TC = 25°C - Derate above 25°C

Operating and Storage Temperature Range

Maximum lead temperature for soldering purposes, from case for 5 seconds

Thermal Characteristics

Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient

FQPF6P25 -250 540 45
-55 to +150

Units V A V mJ A mJ

V/ns W

W/°C °C

Units
2000 Fairchild Semiconductor International

FQPF6P25

Electrical = 25°C unless otherwise noted

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Datasheet ID: FQPF6P25 515444