FQP1P50

FQP1P50 Datasheet

FQP1P50

Part	Datasheet
FQP1P50	FQP1P50 (pdf)

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FQP1P50 FQP1P50 500V P-Channel MOSFET June 2000 QFETTM These P-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for electronic lamp ballast based on complementary half bridge. • -1.5A, -500V, RDS on = = -10 V • Low gate charge typical 11 nC • Low Crss typical pF • Fast switching • 100% avalanche tested • Improved dv/dt capability TO-220 FQP Series Absolute Maximum Ratings TC = 25°C unless otherwise noted Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG Parameter Drain-Source Voltage Drain Current - Continuous TC = 25°C - Continuous TC = 100°C Drain Current - Pulsed Note 1 Gate-Source Voltage Single Pulsed Avalanche Energy Note 2 Avalanche Current Note 1 Repetitive Avalanche Energy Note 1 Peak Diode Recovery dv/dt Note 3 Power Dissipation TC = 25°C - Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds Thermal Characteristics Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-to-Ambient ● ● FQP1P50 -500 ± 30 110 63 -55 to +150 Units V A V mJ A mJ V/ns W W/°C °C Units °C/W °C/W °C/W 2000 Fairchild Semiconductor International

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FQP1P50

FQP1P50
500V P-Channel MOSFET

June 2000

QFETTM

These P-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for electronic lamp ballast based on complementary half bridge.
• -1.5A, -500V, RDS on = = -10 V
• Low gate charge typical 11 nC
• Low Crss typical pF
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

TO-220

FQP Series

Absolute Maximum Ratings TC = 25°C unless otherwise noted

Symbol VDSS ID

IDM VGSS EAS IAR EAR dv/dt PD

TJ, TSTG

Parameter

Drain-Source Voltage

Drain Current
- Continuous TC = 25°C - Continuous TC = 100°C

Drain Current - Pulsed

Note 1

Gate-Source Voltage

Single Pulsed Avalanche Energy

Note 2

Avalanche Current

Note 1

Repetitive Avalanche Energy

Note 1

Peak Diode Recovery dv/dt

Note 3

Power Dissipation TC = 25°C - Derate above 25°C

Operating and Storage Temperature Range

Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds

Thermal Characteristics

Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-to-Ambient
● ●

FQP1P50 -500 ± 30 110 63
-55 to +150

Units V A V mJ A mJ

V/ns W

W/°C °C

Units °C/W °C/W °C/W
2000 Fairchild Semiconductor International

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Datasheet ID: FQP1P50 515301