FGH20N6S2D / FGP20N6S2D / FGB20N6S2D
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FGH20N6S2D / FGP20N6S2D / FGB20N6S2D July 2002 FGH20N6S2D / FGP20N6S2D / FGB20N6S2D 600V, SMPS II Series N-Channel IGBT with Anti-Parallel StealthTM Diode The FGH20N6S2D FGP20N6S2D, FGB20N6S2D are Low Gate Charge, Low Plateau Voltage SMPS II IGBTs combining the fast switching speed of the SMPS IGBTs along with lower gate charge, plateau voltage and high avalanche capability UIS . These LGC devices shorten delay times, and reduce the power requirement of the gate drive. These devices are ideally suited for high voltage switched mode power supply applications where low conduction loss, fast switching times and UIS capability are essential. SMPS II LGC devices have been specially designed for: • Power Factor Correction PFC circuits • Full bridge topologies • Half bridge topologies • Push-Pull circuits • Uninterruptible power supplies • Zero voltage and zero current switching circuits • 100kHz Operation at 390V, 7A • 200kHZ Operation at 390V, 5A • 600V Switching SOA Capability • Typical Fall Time. 85ns at TJ = 125oC • Low Gate Charge 30nC at VGE = 15V • Low Plateau Voltage .6.5V Typical • UIS Rated 100mJ • Low Conduction Loss • Low Eon • Soft Recovery Diode IGBT co-pack formerly Developmental Type TA49332 Diode formerly Developmental Type TA49469 Package TO-247 TO-220AB TO-263AB Device Maximum Ratings TC= 25°C unless otherwise noted COLLECTOR FLANGE Parameter Ratings Units BVCES Collector to Emitter Breakdown Voltage IC25 Collector Current Continuous, TC = 25°C IC110 Collector Current Continuous, TC = 110°C Collector Current Pulsed Note 1 VGES Gate to Emitter Voltage Continuous ±20 VGEM Gate to Emitter Voltage Pulsed ±30 SSOA Switching Safe Operating Area at TJ = 150°C, Figure 2 35A at 600V Pulsed Avalanche Energy, ICE = 7.0A, L = 4mH, VDD = 50V Power Dissipation Total TC = 25°C Power Dissipation Derating TC > 25°C W/°C Operating Junction Temperature Range -55 to 150 TSTG Storage Junction Temperature Range -55 to 150 CAUTION Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: Package Marking and Ordering Information Device Marking 20N6S2D Device FGH20N6S2D FGP20N6S2D FGB20N6S2D FGB20N6S2DT Package TO-247 TO-220AB TO-263AB TO-263AB Tape Width N/A N/A N/A 24mm Electrical Characteristics TJ = 25°C unless otherwise noted Parameter Test Conditions Off State Characteristics BVCES Collector to Emitter Breakdown Voltage IC = 250µA, VGE = 0 ICES Collector to Emitter Leakage Current VCE = 600V TJ = 25°C TJ = 125°C - IGES Gate to Emitter Leakage Current VGE = ± 20V On State Characteristics VCE SAT Collector to Emitter Saturation Voltage IC = 7.0A, TJ = 25°C VGE = 15V TJ = 125°C Diode Forward Voltage IEC = 7.0A Dynamic Characteristics QG ON Gate Charge VGE TH VGEP Gate to Emitter Threshold Voltage Gate to Emitter Plateau Voltage Switching Characteristics IC = 7.0A, VGE = 15V VCE = 300V VGE = 20V IC = 250µA, VCE = 600V IC = 7.0A, VCE = 300V SSOA Switching SOA td ON I trI td OFF I tfI EON1 EON2 EOFF td ON I trI td OFF I tfI EON1 EON2 EOFF Thermal Characteristics TJ = 150°C, RG = VGE = 35 15V, L = 0.5mH VCE = 600V IGBT and Diode at TJ = 25°C, - |
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