FDMF8700 Driver plus FET Multi-chip Module
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FDMF8700 (pdf) |
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FDMF8700 Driver plus FET Multi-chip Module March 2007 FDMF8700 Driver plus FET Multi-chip Module - Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components. - Space savings of up to 50% PCB versus discrete solutions. - Higher frequency of operation. - Simpler system design and board layout. Reduced time in component selection and optimization. - 12V typical Input Voltage - Output current up to 30A - 500KHz switching frequency capable - Internal adaptive gate drive - Integrated bootstrap diode - Peak Efficiency >90% - Under-voltage Lockout - Output disable for lost phase shutdown - Low profile SMD package - RoHS Compliant The FDMF8700 is a fully optimized integrated 12V Driver plus MOSFET power stage solution for high current synchronous buck DC-DC applications. The device integrates a driver IC and two Power MOSFETs into a space saving, 8mm x 8mm, 56-pin Power88 package. Fairchild Semiconductor’s integrated approach optimizes the complete switching power stage with regards to driver to FET dynamic performance, system inductance and overall solution ON resistance. Package parasitics and problematical layouts associated with conventional discrete solutions are greatly reduced. This integrated approach results in significant board space saving, therefore maximizing footprint power density. This solution is based on the Intel DrMOS specification. - Desktop and server VR11.x V-core and non V-core buck converters. - CPU/GPU power train in game consoles and high end desktop systems. - High-current DC-DC Point of Load POL converters - Networking and telecom microprocessor voltage regulators - Small form factor voltage regulator modules Powertrain Application Circuit 12V CVCC DISB PWM Input VCIN DISB VIN BOOT VSWH CGND PGND CBOOT OUTPUT COUT Figure Powertrain Application Circuit Ordering Information Part FDMF8700 Current Rating Max [A] Input Voltage Typical [V] Frequency Max [KHz] 2007 Fairchild Semiconductor Corporation Device Marking FDMF8700 FDMF8700 Driver plus FET Multi- chip Module Functional Block Diagram DISB PWM BOOT VCIN HDRV VIN VCIN VSWH Pin Configuration CGND LDRV PGND Figure Functional Block Diagram CGND NC VCIN BOOT CGND VSWH VIN TEST PAD1 VIN PWM 56 DISB NC CGND VSWH 43 CGND VSWH 15 VIN VSWH PGND 28 PGND VSWH TEST PAD2 PGND Figure Power88 56L Bottom View FDMF8700 Driver plus FET Multi- chip Module Pin Description 1,6,51 2,3,52,53,54 Name CGND NC VCIN BOOT 7,21,40-50 VSWH 8,9,11-20 10 VIN TEST PAD 1 22-38 39 PGND TEST PAD 2 DISB Function IC Ground. Ground return for driver IC. No connect IC Supply. +12V chip bias power. Bypass with a 1µF ceramic capacitor. Bootstrap Supply Input. Provides voltage supply to high-side MOSFET driver. Connect bootstrap capacitor. Switch Node Input. SW Provides return for high-side bootstrapped driver and acts as a sense point for the adaptive shoot-thru protection. Power Input. Output stage supply voltage. For manufacturing test only. HDRV pin. This pin must be floated. Must not be connected to any pin. Power ground. Output stage ground. Source pin of low side MOSFET s . For manufacturing test only. LDRV pin. This pin must be floated. Must not be connected to any pin. Output Disable. When low, this pin disable FET switching HDRV and LDRV are held low . PWM Signal Input. This pin accepts a logic-level PWM signal from the controller. |
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