FDM2509NZ

FDM2509NZ Datasheet


FDM2509NZ

Part Datasheet
FDM2509NZ FDM2509NZ FDM2509NZ (pdf)
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FDM2509NZ

February 2006

FDM2509NZ

Monolithic Common Drain N-Channel 2.5V Specified MOSFET

This dual N-Channel MOSFET has been designed using Fairchild Semiconductor’s advanced Power Trench process to optimize the RDS ON VGS = 2.5v on special MicroFET lead frame with all the drains on one side of the package.
• Li-Ion Battery Pack

PIN 1 S1 G1
• A, 20 V

RDS ON = 18 VGS = V RDS ON = 24 VGS = V
• ESD protection diode note 3
• Low Profile 0.8mm maximum in the new package MicroFET 2x5 mm

Bottom Drain Contact

G2 4 Q2

S2 G2

MLP 2x5

Q1 1 S1

Bottom Drain Contact

Absolute Maximum Ratings TA=25oC unless otherwise noted

Parameter

VDSS VGSS ID

Drain-Source Voltage Gate-Source Voltage Drain Current Continuous

Pulsed Power Dissipation Steady State

Note 1a

Note 1a Note 1b

TJ, TSTG

Operating and Storage Junction Temperature Range

Thermal Characteristics

Thermal Resistance, Junction-to-Ambient Note 1a

Thermal Resistance, Junction-to-Case Drain
Package Marking and Ordering Information

Device Marking

Device

Reel Size
2509Z

FDM2509NZ
7’’

Ratings
20 ±12 30 to +150

Tape width 12mm

Units

V A W °C
°C/W

Quantity 3000 units

Fairchild Semiconductor Corporation

FDM2509NZ

Electrical Characteristics

Parameter

TA = 25°C unless otherwise noted

Test Conditions

Min Typ Max Units

Off Characteristics

BVDSS

Breakdown Voltage

IDSS IGSS

Breakdown Voltage Temperature Coefficient

Zero Gate Voltage Drain Current Leakage,

VGS = 0 V,

ID = 250 µA

ID = 250 µA, Referenced to 25°C

VDS = 16 V, VGS = 0 V VGS = ±12 V, VDS = 0 V
mV/°C
±10

On Characteristics Note 2

VGS th

Gate Threshold Voltage

Gate Threshold Voltage Temperature Coefficient

RDS on

Static

Forward Transconductance

VDS = VGS,
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Datasheet ID: FDM2509NZ 514190