MPC8347EVRAGD

MPC8347EVRAGD Datasheet

Document Number MPC8347EEC Rev. 11, 02/2009

Part	Datasheet
MPC8347EVRAGD	MPC8347EVRAGD (pdf)

Related Parts	Information
MPC8347CZUAJDB	MPC8347CZUAJDB
MPC8347EZUAJDB	MPC8347EZUAJDB
MPC8347EVVAJDB	MPC8347EVVAJDB
MPC8347ZUAJFB	MPC8347ZUAJFB
MPC8347ECZUAJDB	MPC8347ECZUAJDB
MPC8347CVVAJDB	MPC8347CVVAJDB
MPC8347ZUALFB	MPC8347ZUALFB
MPC8347CVVAJFB	MPC8347CVVAJFB
MPC8347EZUAJFB	MPC8347EZUAJFB
MPC8347ECVVAJDB	MPC8347ECVVAJDB
MPC8347VVALFB	MPC8347VVALFB
MPC8347EVVALFB	MPC8347EVVALFB
MPC8347CVVAGDB	MPC8347CVVAGDB
MPC8347CZQAGDB	MPC8347CZQAGDB
MPC8347VVAJFB	MPC8347VVAJFB
MPC8347EVVAJFB	MPC8347EVVAJFB
MPC8347CVRADDB	MPC8347CVRADDB
MPC8347VVAGDB	MPC8347VVAGDB
MPC8347EVVAJF	MPC8347EVVAJF
MPC8347ZQADD	MPC8347ZQADD
MPC8347ECZQAGD	MPC8347ECZQAGD
MPC8347ZQAGD	MPC8347ZQAGD
MPC8347CVRAGD	MPC8347CVRAGD
MPC8347ZUAGD	MPC8347ZUAGD
MPC8347VVAJD	MPC8347VVAJD
MPC8347VVAGD	MPC8347VVAGD
MPC8347CZQAGD	MPC8347CZQAGD
MPC8347ZUAJD	MPC8347ZUAJD
MPC8347ECVRAGD	MPC8347ECVRAGD
MPC8347ZUAJF	MPC8347ZUAJF
MPC8347ZQAGDB	MPC8347ZQAGDB
MPC8347VVAJF	MPC8347VVAJF
MPC8347ECVVAGDB	MPC8347ECVVAGDB
MPC8347EZUAGD	MPC8347EZUAGD
MPC8347EZQAGD	MPC8347EZQAGD
MPC8347EZUAJD	MPC8347EZUAJD
MPC8347EZUAJF	MPC8347EZUAJF
MPC8347EZQADDB	MPC8347EZQADDB
MPC8347EZUAGDB	MPC8347EZUAGDB
MPC8347EVVAGD	MPC8347EVVAGD
MPC8347EZUALFB	MPC8347EZUALFB
MPC8347EVRADD	MPC8347EVRADD
MPC8347EVRADDB	MPC8347EVRADDB
MPC8347CZQADDB	MPC8347CZQADDB
MPC8347VRADD	MPC8347VRADD
MPC8347EZQADD	MPC8347EZQADD
MPC8347VRAGD	MPC8347VRAGD
MPC8347EVVAJD	MPC8347EVVAJD
MPC8347CZUAJFB	MPC8347CZUAJFB
MPC8347ECVVAJFB	MPC8347ECVVAJFB
KMPC8347ZQAGDB	KMPC8347ZQAGDB
MPC8347ECZUAJFB	MPC8347ECZUAJFB
KMPC8347VRAGDB	KMPC8347VRAGDB
KMPC8347ECVRAGDB	KMPC8347ECVRAGDB
KMPC8347ECZQAGDB	KMPC8347ECZQAGDB
KMPC8347CVRAGDB	KMPC8347CVRAGDB
KMPC8347CVVAJDB	KMPC8347CVVAJDB
KMPC8347CZQAGDB	KMPC8347CZQAGDB
KMPC8347CZUAJDB	KMPC8347CZUAJDB
MPC8347ECZUAGDB	MPC8347ECZUAGDB
MPC8347VRADDB	MPC8347VRADDB
MPC8347ECVRAGDB	MPC8347ECVRAGDB
MPC8347CVRAGDB	MPC8347CVRAGDB
MPC8347VVAJDB	MPC8347VVAJDB
MPC8347ZUAJDB	MPC8347ZUAJDB
MPC8347EZQAGDB	MPC8347EZQAGDB
MPC8347ECZQAGDB	MPC8347ECZQAGDB
MPC8347EVRAGDB	MPC8347EVRAGDB
MPC8347CZUAGDB	MPC8347CZUAGDB
MPC8347ECZQADDB	MPC8347ECZQADDB
MPC8347ECVRADDB	MPC8347ECVRADDB
MPC8347EVVAGDB	MPC8347EVVAGDB
MPC8347ZUAGDB	MPC8347ZUAGDB
MPC8347ZQADDB	MPC8347ZQADDB

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Freescale Semiconductor Technical Data MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8347E PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The MPC8347E contains a PowerPC processor core built on Power Architecture technology with system logic for networking, storage, and general-purpose embedded applications. For functional characteristics of the processor, refer to the MPC8349E PowerQUICC II Pro Integrated Host Processor Family Reference Manual. To locate published errata or updates for this document, refer to the MPC8347E product summary page on our website listed on the back cover of this document or, contact your local Freescale sales office. NOTE Freescale Semiconductor, Inc., All rights reserved. Overview This section provides a high-level overview of the MPC8347E features. Figure 1 shows the major functional units within the MPC8347E. Security DUART Dual I2C Timers GPIO e300 Core Interrupt 32KB Controller D-Cache 32KB I-Cache Local Bus DDR SDRAM Controller High-Speed USB 10/100/1000 10/100/1000 Ethernet Ethernet Dual Role Host Figure MPC8347E Block Diagram Major features of the MPC8347E are as follows • Embedded PowerPC e300 processor core operates at up to 667 MHz High-performance, superscalar processor core Floating-point, integer, load/store, system register, and branch processing units 32-Kbyte instruction cache, 32-Kbyte data cache Lockable portion of L1 cache Dynamic power management Software-compatible with the other Freescale processor families that implement Power Architecture technology • Double data rate, DDR SDRAM memory controller Programmable timing for DDR-1 SDRAM 32- or 64-bit data interface, up to 333-MHz data rate for TBGA, 266 MHz for PBGA Four banks of memory, each up to 1 Gbyte DRAM chip configurations from 64 Mbit to 1 Gbit with x8/x16 data ports Full error checking and correction ECC support Page mode support up to 16 simultaneous open pages Contiguous or discontiguous memory mapping Read-modify-write support Sleep mode for self-refresh SDRAM Auto refresh Freescale Semiconductor Overview On-the-fly power management using CKE Registered DIMM support 2.5-V SSTL2 compatible I/O • Dual three-speed 10/100/1000 Ethernet controllers TSECs Dual controllers designed to comply with IEEE standards Ethernet physical interfaces: Freescale Semiconductor Overview Freescale Semiconductor Overview Freescale Semiconductor Overview Data chaining and direct mode Interrupt on completed segment and chain • DUART Two 4-wire interfaces RxD, TxD, RTS, CTS Programming model compatible with the original 16450 UART and the PC16550D • Serial peripheral interface SPI for master or slave • General-purpose parallel I/O GPIO 52 parallel I/O pins multiplexed on various chip interfaces • System timers Periodic interrupt timer Real-time clock Software watchdog timer Eight general-purpose timers • Designed to comply with IEEE Std. JTAG boundary scan • Integrated PCI bus and SDRAM clock generation Freescale Semiconductor Electrical Characteristics 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8347E. The MPC8347E is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. Absolute Maximum Ratings Table 1 provides the absolute maximum ratings. Table Absolute Maximum Ratings1 In Table 54, “Operating Frequencies for TBGA,” in the ‘Coherent system bus frequency csb_clk ’ row, changed the value in the 533 MHz column to In Table 60, “Suggested PLL Configurations,” under the subhead, ‘33 MHz CLKIN/PCI_CLK Options,’ added row A03 between Ref. No. 724 and Under the subhead ‘66 MHz CLKIN/PCI_CLK Options,’ added row 503 between Ref. No. 305 and For Ref. No. 306, changed the CORE PLL value to In Section 23, “Ordering Information,” replaced first paragraph and added a note. In Section “Part Numbers Fully Addressed by This Document,” replaced first paragraph. Freescale Semiconductor 5 4 3 2 Date 2/2007 8/2006 3/2006 10/2005 9/2005 8/2005 5/2005 Substantive Change s Section 2, “Electrical Characteristics,” moved to second section and all other section, table, and figure numbering change accordingly. Table 7, “CLKIN AC Timing Specifications:” Changed max rise and fall time from to Table 22, “GMII Receive AC Timing Specifications:” Changed min tTTKHDX from to Table 30, “MII Management AC Timing Specifications:” Changed max value of tMDKHDX from 70 to Table 34, “Local Bus General Timing on:” Changed min tLBIVKH2 from to Table 36, “JTAG interface DC Electrical Characteristics:” Changed VIH input high voltage min to Table 54, “Operating Frequencies for TBGA:” • Updated TBD values. • Changed maximum coherent system bus frequency for TBGA 667-MHz device to 333 MHz. Table 55, “Operating Frequencies for PBGA:” • Updated TBD values. • Changed PBGA maximum coherent system bus frequency to 266 MHz, and maximum DDR memory bus frequency to 133 MHz. Table 60, “Suggested PLL Configurations” Removed some values from suggested PLL configurations for reference numbers 902, 922, 903, and Table 67, “Part Numbering Nomenclature” Updated TBD values in note Added Table 68, “SVR Settings.” Added Section “Part Marking.” In Table 57, updated AAVID 30x30x9.4 mm Pin Fin natural convection junction-to-ambient thermal resistance, from 11 to Added Table 2, “MPC8347E Typical I/O Power Dissipation.” Table 1 Typical values for power dissipation are changed to TBD. Table 48 Footnote numbering was wrong. THERM0 should have footnote 9 instead of Freescale Semiconductor Date 4/2005 4/2005 Substantive Change s Table 1 Addition of note 1 Table 48 Addition of Therm0 K32 Table 49 Addition of Therm0 B15 Initial release. Freescale Semiconductor Ordering Information 23 Ordering Information This section presents ordering information for the device discussed in this document, and it shows an example of how the parts are marked. Part Numbers Fully Addressed by This Document Table Part Numbering Nomenclature MPC nnnn Product Part Encryption Code Identifier Acceleration Temperature1 Range Package2 Frequency3 Frequency Level 8347 Blank = Not included E = included Blank = 0 to 105°C = to 105°C ZU =TBGA VV = PB free TBGA ZQ = PBGA VR = PB Free PBGA e300 core speed AD = 266 AG = 400 AJ = 533 AL = 667 D = 266 Blank = F = 3334 Notes For temperature range = C, processor frequency is limited to 400 PBGA with a platform frequency of 266 and up to 667 TBGA with a platform frequency of 333 See Section 18, “Package and Pin Listings,” for more information on available package types. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other maximum core frequencies. ALF marked parts support DDR1 up to 333 MHz at 333 MHz CSB as the 'F' marking implies and DDR2 up to 400 MHz at 200 MHz CSB . AJF marked parts support DDR1 and DDR2 up to 333 MHz at a CSB of 333 MHz , but DDR2 at 400 MHz CSB at 200 MHz is NOT guaranteed. Table 68 shows the SVR settings by device and package type. Table SVR Settings Device MPC8347E MPC8347 Package TBGA Freescale Semiconductor Table SVR Settings continued MPC8347E MPC8347 PBGA 8054_0010 8055_0010 Part Marking Parts are marked as in the example shown in Figure Ordering Information MPCnnnnetppaaar core/platform MHZ ATWLYYWW YWWLAZ TBGA/PBGA ATWLYYWW is the traceability code. is the country code. is the mask number. YWWLAZ is the assembly traceability code. Figure Freescale Part Marking for TBGA or PBGA Devices Freescale Semiconductor Ordering Information THIS PAGE INTENTIONALLY LEFT BLANK Freescale Semiconductor THIS PAGE INTENTIONALLY LEFT BLANK Ordering Information Freescale Semiconductor How to Reach Us: Home Page: Web Support: USA/Europe or Locations Not Listed Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 Europe, Middle East, and Africa Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 English +46 8 52200080 English +49 89 92103 559 German +33 1 69 35 48 French Japan Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 Asia/Pacific Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 For Literature Requests Only Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 +1-800 441-2447 or +1-303-675-2140 Fax +1-303-675-2150 LDCForFreescaleSemiconductor Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. IIEEE 802.3u, 802.3x, 802.3z, 802.3ac, 802.11i, and are trademarks or registered trademarks of the Institute of Electrical and Electronics Engineers, Inc. IEEE . This product is not endorsed or approved by the IEEE. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc., All rights reserved.

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Freescale Semiconductor

Technical Data

MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications

The MPC8347E PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The MPC8347E contains a PowerPC processor core built on Power Architecture technology with system logic for networking, storage, and general-purpose embedded applications. For functional characteristics of the processor, refer to the MPC8349E PowerQUICC II Pro Integrated Host Processor Family Reference Manual.

To locate published errata or updates for this document, refer to the MPC8347E product summary page on our website listed on the back cover of this document or, contact your local Freescale sales office.

NOTE
Freescale Semiconductor, Inc., All rights reserved.

Overview

This section provides a high-level overview of the MPC8347E features. Figure 1 shows the major functional units within the MPC8347E.

Security

DUART Dual I2C Timers

GPIO
e300 Core

Interrupt
32KB

Controller D-Cache
32KB I-Cache

Local Bus

DDR SDRAM Controller

High-Speed USB
10/100/1000 10/100/1000

Ethernet

Ethernet

Dual Role

Host

Figure MPC8347E Block Diagram

Major features of the MPC8347E are as follows
• Embedded PowerPC e300 processor core operates at up to 667 MHz High-performance, superscalar processor core Floating-point, integer, load/store, system register, and branch processing units 32-Kbyte instruction cache, 32-Kbyte data cache Lockable portion of L1 cache Dynamic power management Software-compatible with the other Freescale processor families that implement Power Architecture technology
• Double data rate, DDR SDRAM memory controller Programmable timing for DDR-1 SDRAM 32- or 64-bit data interface, up to 333-MHz data rate for TBGA, 266 MHz for PBGA Four banks of memory, each up to 1 Gbyte DRAM chip configurations from 64 Mbit to 1 Gbit with x8/x16 data ports Full error checking and correction ECC support Page mode support up to 16 simultaneous open pages Contiguous or discontiguous memory mapping Read-modify-write support Sleep mode for self-refresh SDRAM Auto refresh

Freescale Semiconductor

Overview

On-the-fly power management using CKE Registered DIMM support 2.5-V SSTL2 compatible I/O
• Dual three-speed 10/100/1000 Ethernet controllers TSECs Dual controllers designed to comply with IEEE
standards Ethernet physical interfaces:

Freescale Semiconductor

Overview

Freescale Semiconductor

Overview

Freescale Semiconductor

Overview

Data chaining and direct mode Interrupt on completed segment and chain
• DUART Two 4-wire interfaces RxD, TxD, RTS, CTS Programming model compatible with the original 16450 UART and the PC16550D
• Serial peripheral interface SPI for master or slave
• General-purpose parallel I/O GPIO 52 parallel I/O pins multiplexed on various chip interfaces
• System timers Periodic interrupt timer Real-time clock Software watchdog timer Eight general-purpose timers
• Designed to comply with IEEE Std. JTAG boundary scan
• Integrated PCI bus and SDRAM clock generation

Freescale Semiconductor

Electrical Characteristics
2 Electrical Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8347E. The MPC8347E is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications.

Overall DC Electrical Characteristics

This section covers the ratings, conditions, and other characteristics.

Absolute Maximum Ratings

Table 1 provides the absolute maximum ratings.

Table Absolute Maximum Ratings1
In Table 54, “Operating Frequencies for TBGA,” in the ‘Coherent system bus frequency csb_clk ’ row, changed the value in the 533 MHz column to In Table 60, “Suggested PLL Configurations,” under the subhead, ‘33 MHz CLKIN/PCI_CLK Options,’ added row A03 between Ref. No. 724 and Under the subhead ‘66 MHz CLKIN/PCI_CLK Options,’ added row 503 between Ref. No. 305 and For Ref. No. 306, changed the CORE PLL value to In Section 23, “Ordering Information,” replaced first paragraph and added a note. In Section “Part Numbers Fully Addressed by This Document,” replaced first paragraph.

Freescale Semiconductor
5 4 3 2

Date 2/2007
8/2006 3/2006
10/2005 9/2005 8/2005 5/2005

Substantive Change s
Section 2, “Electrical Characteristics,” moved to second section and all other section, table, and figure numbering change accordingly. Table 7, “CLKIN AC Timing Specifications:” Changed max rise and fall time from to Table 22, “GMII Receive AC Timing Specifications:” Changed min tTTKHDX from to Table 30, “MII Management AC Timing Specifications:” Changed max value of tMDKHDX from 70 to Table 34, “Local Bus General Timing on:” Changed min tLBIVKH2 from to Table 36, “JTAG interface DC Electrical Characteristics:” Changed VIH input high voltage min to Table 54, “Operating Frequencies for TBGA:”
• Updated TBD values.
• Changed maximum coherent system bus frequency for TBGA 667-MHz device to 333 MHz. Table 55, “Operating Frequencies for PBGA:”
• Updated TBD values.
• Changed PBGA maximum coherent system bus frequency to 266 MHz, and maximum DDR
memory bus frequency to 133 MHz. Table 60, “Suggested PLL Configurations” Removed some values from suggested PLL configurations for reference numbers 902, 922, 903, and Table 67, “Part Numbering Nomenclature” Updated TBD values in note Added Table 68, “SVR Settings.” Added Section “Part Marking.”

In Table 57, updated AAVID 30x30x9.4 mm Pin Fin natural convection junction-to-ambient thermal resistance, from 11 to

Added Table 2, “MPC8347E Typical I/O Power Dissipation.”

Table 1 Typical values for power dissipation are changed to TBD. Table 48 Footnote numbering was wrong. THERM0 should have footnote 9 instead of

Freescale Semiconductor

Date 4/2005
4/2005

Substantive Change s

Table 1 Addition of note 1 Table 48 Addition of Therm0 K32 Table 49 Addition of Therm0 B15 Initial release.

Freescale Semiconductor
Ordering Information
23 Ordering Information
This section presents ordering information for the device discussed in this document, and it shows an example of how the parts are marked.

Part Numbers Fully Addressed by This Document

Table Part Numbering Nomenclature

MPC nnnn

Product Part

Encryption

Code Identifier Acceleration

Temperature1 Range

Package2

Frequency3 Frequency

Level
8347

Blank = Not included

E = included

Blank = 0 to 105°C = to 105°C

ZU =TBGA VV = PB free TBGA

ZQ = PBGA VR = PB Free PBGA
e300 core speed

AD = 266 AG = 400 AJ = 533 AL = 667

D = 266 Blank =

F = 3334

Notes For temperature range = C, processor frequency is limited to 400 PBGA with a platform frequency of 266 and up to
667 TBGA with a platform frequency of 333 See Section 18, “Package and Pin Listings,” for more information on available package types. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other maximum core frequencies. ALF marked parts support DDR1 up to 333 MHz at 333 MHz CSB as the 'F' marking implies and DDR2 up to 400 MHz at 200 MHz CSB . AJF marked parts support DDR1 and DDR2 up to 333 MHz at a CSB of 333 MHz , but DDR2 at 400 MHz CSB at 200 MHz is NOT guaranteed.

Table 68 shows the SVR settings by device and package type.

Table SVR Settings

Device MPC8347E MPC8347

Package TBGA

Freescale Semiconductor

Table SVR Settings continued

MPC8347E MPC8347

PBGA
8054_0010 8055_0010

Part Marking

Parts are marked as in the example shown in Figure
Ordering Information

MPCnnnnetppaaar
core/platform MHZ

ATWLYYWW

YWWLAZ

TBGA/PBGA

ATWLYYWW is the traceability code.
is the country code.
is the mask number.

YWWLAZ is the assembly traceability code.

Figure Freescale Part Marking for TBGA or PBGA Devices

Freescale Semiconductor
Ordering Information

THIS PAGE INTENTIONALLY LEFT BLANK

Freescale Semiconductor

THIS PAGE INTENTIONALLY LEFT BLANK
Ordering Information

Freescale Semiconductor

How to Reach Us:

Home Page:

Web Support:

USA/Europe or Locations Not Listed Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130

Europe, Middle East, and Africa Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 English +46 8 52200080 English +49 89 92103 559 German +33 1 69 35 48 French

Japan Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125

Asia/Pacific Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080

For Literature Requests Only Freescale Semiconductor

Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 +1-800 441-2447 or +1-303-675-2140 Fax +1-303-675-2150 LDCForFreescaleSemiconductor

Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.

Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. IIEEE 802.3u, 802.3x, 802.3z, 802.3ac, 802.11i, and are trademarks or registered trademarks of the Institute of Electrical and Electronics Engineers, Inc. IEEE . This product is not endorsed or approved by the IEEE. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc., All rights reserved.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MPC8347EVRAGD Datasheet file may be downloaded here without warranties.

Datasheet ID: MPC8347EVRAGD 635548