MC68HC11E1CFN2R2
MC68HC11E1CFN2R2 Datasheet
MC68HC11E Family
| Part | Datasheet |
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MC68HC11E1CFN2R2 |
MC68HC11E1CFN2R2 (pdf) |
| Related Parts | Information |
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MC68HC11E1CFN2 |
MC68HC11E1CFN2 |
MC68HC11E0CFN2 |
MC68HC11E0CFN2 |
MC68HC11E1CFN3 |
MC68HC11E1CFN3 |
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| Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... M68HC11E Family Data Sheet M68HC11 Microcontrollers MOTOROLA.COM/SEMICONDUCTORS For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. For More Information On This Product, Go to: Freescale Semiconductor, Inc. MC68HC11E Family Data Sheet Freescale Semiconductor, Inc... Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. DigitalDNA is a trademark of Motorola, Inc. For More Information On This Product, Go to: Motorola, Inc., 2003 Data Sheet 3 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Date May, 2001 June, 2001 December, 2001 July, 2002 June, 2003 System Configuration Register Addition to NOCOP bit description Added EPROM Characteristics EPROM Characteristics For clarity, addition to note 2 following the table Serial Communications Control Register 1 SCCR1 bit 4 M description corrected MC68L11E9/E20 DC Electrical Characteristics Title changed to include the MC68L11E20 MC68L11E9/E20 Supply Currents and Power Dissipation Title changed to include the MC68L11E20 MC68L11E9/E20 Control Timing Title changed to include the MC68L11E20 MC68L11E9/E20 Peripheral Port Timing Title changed to include the MC68L11E20 MC68L11E9/E20 Analog-to-Digital Converter Characteristics Title changed to include the MC68L11E20 MC68L11E9/E20 Expansion Bus Timing Characteristics Title changed to include the MC68L11E20 MC68L11E9/E20 Serial Peirpheral Interface Characteristics Title changed to include the MC68L11E20 Title changed to include the MC68L11E20 Extended Voltage Device Ordering Information Vdc to Vdc Updated table to include MC68L1120 Format updated to current publications standards Non-Maskable Interrupt XIRQ/VPPE Added Caution note pertaining to EPROM programming of the MC68HC711E9 device only. EPROM Characteristics Added note pertaining to EPROM programming of the MC68HC711E9 device only. Page Number s 49 191 123 169 170 173 179 183 185 188 191 197 Throughout 26 191 Data Sheet 4 For More Information On This Product, Go to: Freescale Semiconductor, Inc. Data Sheet M68HC11E Family List of Sections Freescale Semiconductor, Inc... Section General Description Section Operating Modes and On-Chip Memory 33 Section Analog-to-Digital A/D Converter 63 Section Central Processor Unit CPU 73 Section Resets and Interrupts 89 Section Parallel Input/Output I/O Ports 109 Section Serial Communications Interface SCI . 117 Section Serial Peripheral Interface SPI 133 Section Timing System 141 Section Electrical Characteristics 165 Section Ordering Information and Mechanical Specifications 193 Appendix A. Development Support. Appendix B. EVBU Schematic 207 AN1060 M68HC11 Bootstrap Mode 209 EB184 Enabling the Security Feature on the MC68HC711E9 Devices with PCbug11 on the M68HC711E9PGMR 255 EB188 Enabling the Security Feature on M68HC811E2 Devices with PCbug11 on the M68HC711E9PGMR 259 EB296 Programming MC68HC711E9 Devices with PCbug11 and the M68HC11EVBU 263 List of Sections For More Information On This Product, Go to: Data Sheet 5 List of Sections Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... Data Sheet 6 List of Sections For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Technical Data M68HC11E Family Table of Contents Section General Description Introduction 15 Features 15 Structure 16 Pin Descriptions 18 VDD and VSS 23 RESET 24 Crystal Driver and External Clock Input XTAL and EXTAL 24 E-Clock Output E 25 Interrupt Request IRQ 25 Non-Maskable Interrupt XIRQ/VPPE . 26 MODA and MODB MODA/LIR and MODB/VSTBY 26 VRL and VRH 27 STRA/AS 27 STRB/R/W 27 Port Signals 28 Port A 28 Port B 30 Port C 30 Port D 31 Port E 31 Section Operating Modes and On-Chip Memory Section Ordering Information and Mechanical Specifications Introduction 193 Standard Device Ordering Information 193 Custom ROM Device Ordering Information 196 Extended Voltage Device Ordering Information Vdc to Vdc 197 52-Pin Plastic-Leaded Chip Carrier Case 778 198 52-Pin Windowed Ceramic-Leaded Chip Carrier Case 778B 199 64-Pin Quad Flat Pack Case 840C 200 52-Pin Thin Quad Flat Pack Case 848D 201 Table of Contents For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Table of Contents 56-Pin Dual in-Line Package Case 859 202 48-Pin Plastic DIP Case 767 202 Appendix A. Development Support A.1 Introduction 203 A.2 Motorola M68HC11 E-Series Development Tools 203 A.3 EVS Evaluation System 204 A.4 Motorola Modular Development System MMDS11 204 A.5 SPGMR11 Serial Programmer for M68HC11 MCUs 206 Appendix B. EVBU Schematic MC68HC11EVBU Schematic 209 AN1060 AN1060 M68HC11 Bootstrap Mode 209 EB184 EB184 Enabling the Security Feature on the MC68HC711E9 Devices with PCbug11 on the M68HC711E9PGMR 255 EB188 EB188 Enabling the Security Feature on M68HC811E2 Devices with PCbug11 on the M68HC711E9PGMR 259 EB296 EB296 Programming MC68HC711E9 Devices with PCbug11 and the M68HC11EVBU 263 Table of Contents For More Information On This Product, Go to: Data Sheet 13 Table of Contents Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... Data Sheet 14 Table of Contents For More Information On This Product, Go to: Freescale Semiconductor, Inc. Data Sheet M68HC11E Family Section General Description Freescale Semiconductor, Inc... Introduction This document contains a detailed description of the M68HC11 E series of 8-bit microcontroller units MCUs . These MCUs all combine the M68HC11 central processor unit CPU with high-performance, on-chip peripherals. The E series is comprised of many devices with various configurations of • Random-access memory RAM • Read-only memory ROM • Erasable programmable read-only memory EPROM • Electrically erasable programmable read-only memory EEPROM • Several low-voltage devices are also available. With the exception of a few minor differences, the operation of all E-series MCUs is identical. A fully static design and high-density complementary metal-oxide semiconductor HCMOS fabrication process allow the E-series devices to operate at frequencies from 3 MHz to dc with very low power consumption. Features of the E-series devices include • M68HC11 CPU • Power-saving stop and wait modes • Low-voltage devices available Vdc • 0, 256, 512, or 768 bytes of on-chip RAM, data retained during standby • 0, 12, or 20 Kbytes of on-chip ROM or EPROM • 0, 512, or 2048 bytes of on-chip EEPROM with block protect for security • 2048 bytes of EEPROM with selectable base address in the MC68HC811E2 • Asynchronous non-return-to-zero NRZ serial communications interface SCI • Additional baud rates available on MC68HC 7 11E20 • Synchronous serial peripheral interface SPI • 8-channel, 8-bit analog-to-digital A/D converter For More Information On This Product, Go to: Data Sheet 15 An enhanced security feature which protects EPROM contents, RAM, and EEPROM from unauthorized accesses is available in MC68S711E9. Refer to Section Ordering Information and Mechanical Specifications for the exact part number. Operating Modes and On-Chip Memory For More Information On This Product, Go to: Data Sheet 61 Freescale Semiconductor, Inc. Operating Modes and On-Chip Memory For further information, these engineering bulletins have been included at the back of this data book: • EB183 Enabling the Security Feature on the MC68HC711E9 Devices with PCbug11 on the M68HC711E9PGMR • EB188 Enabling the Security Feature on M68HC811E2 Devices with PCbug11 on the M68HC711E9PGMR Freescale Semiconductor, Inc... Data Sheet 62 Operating Modes and On-Chip Memory For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Data Sheet M68HC11E Family Section Analog-to-Digital A/D Converter Introduction The analog-to-digital A/D system, a successive approximation converter, uses an all-capacitive charge redistribution technique to convert analog signals to digital values. Overview The A/D system is an 8-channel, 8-bit, multiplexed-input converter. The converter does not require external sample and hold circuits because of the type of charge redistribution technique used. A/D converter timing can be synchronized to the system E clock or to an internal resistor capacitor RC oscillator. The A/D converter system consists of four functional blocks multiplexer, analog converter, digital control, and result storage. Refer to Figure Multiplexer The multiplexer selects one of 16 inputs for conversion. Input selection is controlled by the value of bits CD:CA in the ADCTL register. The eight port E pins are fixed-direction analog inputs to the multiplexer, and additional internal analog signal lines are routed to it. Port E pins also can be used as digital inputs. Digital reads of port E pins are not recommended during the sample portion of an A/D conversion cycle, when the gate signal to the N-channel input gate is on. Because no P-channel devices are directly connected to either input pins or reference voltage pins, voltages above VDD do not cause a latchup problem, although current should be limited according to maximum ratings. Refer to Figure 3-2, which is a functional diagram of an input pin. Analog-to-Digital A/D Converter For More Information On This Product, Go to: Data Sheet 63 Freescale Semiconductor, Inc... CCF SCAN MULT CD CC CB CA Freescale Semiconductor, Inc. Analog-to-Digital A/D Converter PE0 AN0 PE1 AN1 PE2 AN2 PE3 AN3 ANALOG MUX PE4 AN4 PE5 AN5 PE6 AN6 PE7 AN7 8-BIT CAPACITIVE DAC WITH SAMPLE AND HOLD SUCCESSIVE APPROXIMATION REGISTER AND CONTROL RESULT ADCTL A/D CONTROL RESULT REGISTER INTERFACE VRH VRl Section Ordering Information and Mechanical Specifications Freescale Semiconductor, Inc... Introduction This section provides ordering information for the E-series devices grouped by • Standard devices • Custom ROM devices • Extended voltage devices In addition, mechanical specifications for the following packaging options • 52-pin plastic-leaded chip carrier PLCC • 52-pin windowed ceramic-leaded chip carrier CLCC • 64-pin quad flat pack QFP • 52-pin thin quad flat pack TQFP • 56-pin shrink dual in-line package with .070-inch lead spacing SDIP • 48-pin plastic DIP .100-inch lead spacing , MC68HC811E2 only Standard Device Ordering Information CONFIG 52-pin plastic leaded chip carrier PLCC BUFFALO ROM Temperature to +85°C No ROM No ROM, no EEPROM to +85°C to +105°C to +125°C to +85°C to +105°C to +125°C Frequency 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 3 MHz 2 MHz 2 MHz MC Order Number MC68HC11E9BCFN2 MC68HC11E9BCFN3 MC68HC11E1CFN2 MC68HC11E1CFN3 MC68HC11E1VFN2 MC68HC11E1MFN2 MC68HC11E0CFN2 MC68HC11E0CFN3 MC68HC11E0VFN2 MC68HC11E0MFN2 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Data Sheet 193 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications CONFIG Temperature 52-pin plastic leaded chip carrier PLCC Continued OTPROM OTPROM, enhanced security feature to +85°C to +105°C to +125°C to +85°C 0°C to +70°C 20 Kbytes OTPROM No ROM, 2 Kbytes EEPROM 64-pin quad flat pack QFP to +85°C to +105°C to +125°C 0°C to +70°C to +85°C to +105°C to +125°C BUFFALO ROM to +85°C No ROM No ROM, no EEPROM 20 Kbytes OTPROM 52-pin thin quad flat pack TQFP BUFFALO ROM to +85°C to +105°C to +85°C to +105°C 0°C to +70°°C to +85°C to +105°C to +125°C to +85°C Frequency 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 3 MHz MC Order Number MC68HC711E9CFN2 MC68HC711E9CFN3 MC68HC711E9VFN2 MC68HC711E9MFN2 MC68S711E9CFN2 MC68HC711E20FN3 MC68HC711E20CFN2 MC68HC711E20CFN3 MC68HC711E20VFN2 MC68HC711E20MFN2 MC68HC811E2FN2 MC68HC811E2CFN2 MC68HC811E2VFN2 MC68HC811E2MFN2 MC68HC11E9BCFU2 MC68HC11E9BCFU3 MC68HC11E1CFU2 MC68HC11E1CFU3 MC68HC11E1VFU2 MC68HC11E0CFU2 MC68HC11E0VFU2 MC68HC711E20FU3 MC68HC711E20CFU2 MC68HC711E20CFU3 MC68HC711E20VFU2 MC68HC711E20MFU2 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications Standard Device Ordering Information CONFIG Temperature 52-pin windowed ceramic leaded chip carrier CLCC EPROM to +85°C to +105°C to +125°C 0°C o +70°°C 20 Kbytes EPROM to +85°C to +105°C to +125°C 48-pin dual in-line package DIP MC68HC811E2 only 0°C to +70°°C No ROM, 2 Kbytes EEPROM to +85°C to +105°C to +125°C 56-pin dual in-line package with 0.70-inch lead spacing SDIP BUFFALO ROM to +85°C No ROM No ROM, no EEPROM to +85°C to +105°C to +125°C to +85°C to +105°C to +125°C Frequency 2 MHz 3 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 2 MHz 3 MHz 2 MHz 2 MHz MC Order Number MC68HC711E9CFS2 MC68HC711E9CFS3 MC68HC711E9VFS2 MC68HC711E20FS3 MC68HC711E20CFS2 MC68HC711E20CFS3 MC68HC711E20VFS2 MC68HC711E20MFS2 MC68HC811E2P2 MC68HC811E2CP2 MC68HC811E2VP2 MC68HC811E2MP2 MC68HC11E9BCB2 MC68HC11E9BCB3 MC68HC11E1CB2 MC68HC11E1CB3 MC68HC11E1VB2 MC68HC11E1MB2 MC68HC11E0CB2 MC68HC11E0CB3 MC68HC11E0VB2 MC68HC11E0MB2 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Data Sheet 195 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications Custom ROM Device Ordering Information Temperature 52-pin plastic leaded chip carrier PLCC 0°C to +70°°C Custom ROM to +85°C to +105°C to +125°C 0°C to +70°°C 20 Kbytes custom ROM 64-pin quad flat pack QFP to +85°C to +105°C to +125°C 0°C to +70°°C Custom ROM 64-pin quad flat pack continued to +85°C to +105°C to +125°C 0°C to +70°°C 20 Kbytes Custom ROM to +85°C to +105°C to +125°C 52-pin thin quad flat pack 10 mm x 10 mm 0°C to +70°°C Custom ROM to +85°C to +105°C to +125°C 56-pin dual in-line package with 0.70-inch lead spacing SDIP 0°C to +70°°C Custom ROM to +85°C to +105°C to +125°C Frequency 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz 3 MHz 2 MHz 3 MHz 2 MHz 2 MHz MC Order Number MC68HC11E9FN3 MC68HC11E9CFN2 MC68HC11E9CFN3 MC68HC11E9VFN2 MC68HC11E9MFN2 MC68HC11E20FN3 MC68HC11E20CFN2 MC68HC11E20CFN3 MC68HC11E20VFN2 MC68HC11E20MFN2 MC68HC11E9FU3 MC68HC11E9CFU2 MC68HC11E9CFU3 MC68HC11E9VFU2 MC68HC11E9MFU2 MC68HC11E20FU3 MC68HC11E20CFU2 MC68HC11E20CFU3 MC68HC11E20VFU2 MC68HC11E20MFU2 MC68HC11E9PB3 MC68HC11E9CPB2 MC68HC11E9CPB3 MC68HC11E9VPB2 MC68HC11E9MPB2 MC68HC11E9B3 MC68HC11E9CB2 MC68HC11E9CB3 MC68HC11E9VB2 MC68HC11E9MB2 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications Extended Voltage Device Ordering Information Vdc to Vdc Extended Voltage Device Ordering Information Vdc to Vdc Description 52-pin plastic leaded chip carrier PLCC Temperature Custom ROM No ROM No ROM, no EEPROM 64-pin quad flat pack QFP to +70°C Custom ROM No ROM to +70°C No ROM, no EEPROM 52-pin thin quad flat pack 10 mm x 10 mm Custom ROM No ROM to +70°C No ROM, no EEPROM 56-pin dual in-line package with 0.70-inch lead spacing SDIP Custom ROM No ROM to +70°C No ROM, no EEPROM Frequency 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz MC Order Number MC68L11E9FN2 MC68L11E20FN2 MC68L11E1FN2 MC68L11E0FN2 MC68L11E9FU2 MC68L11E20FU2 MC68L11E1FU2 MC68L11E0FU2 MC68L11E9PB2 MC68L11E1PB2 MC68L11E0PB2 MC68L11E9B2 MC68L11E1B2 MC68L11E0B2 Freescale Semiconductor, Inc... Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Data Sheet 197 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications 52-Pin Plastic-Leaded Chip Carrier Case 778 Y BRK D M T S N S M T S N S X VIEW G1 S T S N S M T S N S M T S N S J VIEW S SEATING PLANE S T S N S M T S N S VIEW S M T S N S NOTES DATUMS AND DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM SEATING PLANE. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS PER SIDE. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION INCH. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION S SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN THE DAMBAR INTRUSION S SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN INCHES MILLIMETERS DIM MIN MAX MIN MAX G BSC 2_ 10_ 2_ 10_ Data Sheet 198 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications 52-Pin Windowed Ceramic-Leaded Chip Carrier Case 778B 52-Pin Windowed Ceramic-Leaded Chip Carrier Case 778B M T A S B S N -B- M T A S B S NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION INCH. DIMENSION R AND N DO NOT INCLUDE GLASS PROTRUSION. GLASS PROTRUSION TO BE MAXIMUM. ALL DIMENSIONS AND TOLERANCES INCLUDE LEAD TRIM OFFSET AND LEAD INCHES DIM MIN MAX A B C D F G BSC H J K N R S MILLIMETERS MIN MAX -T- SEATING PLANE D 52 PL M T A S B S Freescale Semiconductor, Inc... Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Data Sheet 199 Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications 64-Pin Quad Flat Pack Case 840C Freescale Semiconductor, Inc... M H S D S D M C S D S DETAIL A M H S D S S M C S D S CE HG DETAIL C DATUM PLANE SEATING PLANE DETAIL C SEATING PLANE P DETAIL A BASE METAL M C S D S SECTION NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION MILLIMETER. DATUM PLANE IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. DATUMS AND TO BE DETERMINED AT DATUM PLANE DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIMENSION K IS TO BE MEASURED FROM THE THEORETICAL INTERSECTION OF LEAD FOOT AND LEG CENTERLINES. MILLIMETERS INCHES DIM MIN MAX MIN MAX M 5 _ 10_ 5 _ 10_ Q 2_ 8_ 2_ 8_ Data Sheet 200 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications 52-Pin Thin Quad Flat Pack Case 848D 52-Pin Thin Quad Flat Pack Case 848D 4X TIPS 40 39 3X VIEW Y 13 14 A1 S1 27 26 B1 V1 SEATING PLANE T VIEW AA C1 VIEW AA 2 X R R1 GAGE PLANE CL AB X=L, M, N AB VIEW Y PLATING BASE METAL D M T S N S SECTION ROTATED 90_ CLOCKWISE NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION MILLIMETER. DATUM PLANE IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. DATUMS AND TO BE DETERMINED AT DATUM PLANE DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION MILLIMETERS INCHES DIM MIN MAX MIN MAX A BSC A1 BSC B BSC B1 BSC S BSC 0_ 7_ 0_ 7_ 12_ REF 12_ REF 5_ 13_ 5_ 13_ Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Data Sheet 201 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Ordering Information and Mechanical Specifications 56-Pin Dual in-Line Package Case 859 SEATING PLANE E D 56 PL M T A S J 56 PL M T B S NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH INCHES MILLIMETERS DIM MIN MAX MIN MAX E BSC G BSC H BSC L BSC M 0 _ 15_ 0 _ 15 _ 48-Pin Plastic DIP Case 767 NOTE The MC68HC811E2 is the only member of the E series that is offered in a 48-pin plastic dual in-line package. SEATING PLANE D 32 PL M T A S DETAIL X N J 48 PL TIP TAPER DETAIL X NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH M 48 PL INCHES MILLIMETERS DIM MIN MAX MIN MAX G BSC H BSC L BSC M 0x 15x 0x 15x M T B S Data Sheet 202 Ordering Information and Mechanical Specifications For More Information On This Product, Go to: Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Data Sheet M68HC11E Family Appendix A. Development Support A.1 Introduction This section provides information on the development support offered for the E-series devices. A.2 Motorola M68HC11 E-Series Development Tools Device Package Emulation Module 1 2 Flex Cable 1 2 MMDS11 Target Head 1 2 SPGMR Programming Adapter 3 52 FN M68EM11E20 M68CBL11C M68TC11E20FN52 M68PA11E20FN52 MC68HC11E9 MC68HC711E9 52 PB 56 B M68EM11E20 M68CBL11C M68CBL11B M68TC11E20PB52 M68TC11E20B56 M68PA11E20PB52 M68PA11E20B56 64 FU M68EM11E20 M68CBL11C M68TC11E20FU64 M68PA11E20FU64 MC68HC11E20 MC68HC711E20 52 FN 64 FU M68EM11E20 M68CBL11C M68TC11E20FN52 M68TC11E20FU64 M68PA11E20FN52 M68PA11E20FU64 MC68HC811E2 48 P 52 FN M68EM11E20 M68CBL11B M68CBL11C M68TB11E20P48 M68TC11E20FN52 |
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