1708070015

1708070015 Datasheet

170807 Vertical Plug 170814 Vertical Receptacle

Part	Datasheet
1708070015	1708070015 (pdf)

Related Parts	Information
1708140015	1708140015

PDF Datasheet Preview
Delivering the market’s cleanest signal integrity at 28+ Gbps, Molex’s modular NeoScale Mezzanine System features a high-speed triad wafer design with Solder-Charge Technology for customized PCB routing in high-density system applications Ideal for space-constrained designs with limited PCB real estate, the modular NeoScale mezzanine system provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, customers can mix and match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs 85 and 100 ohm , high-speed single-ended transmissions, lowspeed single-ended signals and power contacts. For more information visit: NeoScale High-Speed Mezzanine System 170807 Vertical Plug 170814 Vertical Receptacle NeoScale High-Speed Mezzanine System Left Plug, Right Receptacle 6-by-20 120 triads • modular triad wafer design with four triad configurations and high-speed differential pairs in both 85 and 100 Ohm impedance , high-speed single-ended traces, lowspeed single-ended lines and power contacts provides a customized system for design flexibility • design based on honeycomb construction isolates each differential pair for optimal performance and customization • triad wafers comprise three pins per differential pair two signal pins and one shielded ground pin providing stand-alone 28+ Gbps fully shielded differential pairs with dedicated grounds • feature 246 circuits with a density of 82 differential pairs per square inch offers ultra-high-density signal solution with optimal signal integrity performance • triad layout enables the PCB routing in one or two layers for four- and six-row housings respectively providing ease in PCB routing and lowers overall system costs by decreasing the number of PCB layers required for signal routing • structures incorporated within the receptacle housing prevents terminal damage by protecting the mating contact interface • PCB connection using patented Solder-Charge Technology proven surface mount technology SMT attach method for highly reliable and robust solder joints • in to 42.00mm stack heights, circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-rows and 85 or 100 Ohm impedance provides design flexibility to address engineering constraints in system envelopes • mating interface with 2.00mm wipe gives sufficient conductive wipe for clean signal transmission and enhanced performance • housing material provides a robust system with mechanical stability SPECIFICATIONS Reference Information Packaging Tray Mates With: Vertical Plug Series 170807 mates with NeoScale Vertical Receptacle Series 170814 Designed In Millimeters RoHS Yes Halogen Free Yes Electrical Voltage max. 30V AC RMS max. Current max. 1.0A Contact Resistance 30 Milliohms max. Dielectric Withstanding Voltage: 200V AC RMS Insulation Resistance: 1000 Megohms min. Mechanical Contact Retention to Housing 1N Mating Force 0.75N max. Unmating Force 0.25N min. Durability min. 100 cycles Physical Housing High-temperature LCP Contact Copper Cu Plating Contact Area 30µ" Gold Au Solder Tail Area Gold Au Underplating 45µ" Nickel Ni Operating Temperature -55 to +85°C ADDITIONAL PRODUCT FEATURES • assembly features one differential pair with a 2.80mm pitch • assembly housing includes polarization and keying features • pin has two SMT attachment points, with four solder charge joints per triad wafer • orientation of the NeoScale plug and receptacle provides a mirrored configuration with a dividing line of back-to-back shields. The resulting mirror line bisects the triad pair to facilitate PCB routing and RX/TX pin-out management for optimal signal integrity and mechanical stability. NeoScale High-Speed Mezzanine System 170807 Vertical Plug 170814 Vertical Receptacle Unique, patentpending triad wafer design individual triad close-up Triad wafer configuration Dense mechanical envelope of mated system ORDERING INFORMATION Plug Order No. 170807-0011 170807-0015 Plating 30µ" Gold Receptacle Order No. 170814-0009 170814-0015 Plating 30µ" Gold Connector Height 8.00mm 12.00mm Connector Height 8.00mm 12.00mm Triad Wafer Configuration row-by-column 4-by-18 6-by-8 Triad Wafer Configuration row-by-column 4-by-18 6-by-8 Printed in USA/KC/2012.06 2012, Molex

PDF Datasheet Preview

Delivering the market’s cleanest signal integrity at 28+ Gbps, Molex’s modular NeoScale Mezzanine System features a high-speed triad wafer design with Solder-Charge Technology for customized PCB routing in high-density system applications

Ideal for space-constrained designs with limited PCB real estate, the modular NeoScale mezzanine system provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, customers can mix and match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs 85 and 100 ohm , high-speed single-ended transmissions, lowspeed single-ended signals and power contacts.

For more information visit:

NeoScale High-Speed Mezzanine System
170807 Vertical Plug 170814 Vertical Receptacle

NeoScale High-Speed Mezzanine System Left Plug, Right Receptacle
6-by-20 120 triads
• modular triad wafer design with four triad configurations and high-speed differential pairs in both 85 and 100 Ohm impedance , high-speed single-ended traces, lowspeed single-ended lines and power contacts provides a customized system for design flexibility
• design based on honeycomb construction isolates each differential pair for optimal performance and customization
• triad wafers comprise three pins per differential pair two signal pins and one shielded ground pin providing stand-alone 28+ Gbps fully shielded differential pairs with dedicated grounds
• feature 246 circuits with a density of 82 differential pairs per square inch offers ultra-high-density signal solution with optimal signal integrity performance
• triad layout enables the PCB routing in one or two layers for four- and six-row housings respectively providing ease in PCB routing and lowers overall system costs by decreasing the number of PCB layers required for signal routing
• structures incorporated within the receptacle housing prevents terminal damage by protecting the mating contact interface
• PCB connection using patented Solder-Charge Technology proven surface mount technology SMT attach method for highly reliable and robust solder joints
• in to 42.00mm stack heights, circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-rows and 85 or 100 Ohm impedance provides design flexibility to address engineering constraints in system envelopes
• mating interface with 2.00mm wipe gives sufficient conductive wipe for clean signal transmission and enhanced performance
• housing material provides a robust system with mechanical stability

SPECIFICATIONS

Reference Information Packaging Tray Mates With:

Vertical Plug Series 170807 mates with NeoScale Vertical Receptacle Series 170814 Designed In Millimeters RoHS Yes Halogen Free Yes

Electrical Voltage max. 30V AC RMS max. Current max. 1.0A Contact Resistance 30 Milliohms max. Dielectric Withstanding Voltage:
200V AC RMS Insulation Resistance:
1000 Megohms min.

Mechanical Contact Retention to Housing 1N Mating Force 0.75N max. Unmating Force 0.25N min. Durability min. 100 cycles

Physical

Housing High-temperature LCP

Contact Copper Cu

Plating Contact Area 30µ" Gold Au Solder Tail Area Gold Au Underplating 45µ" Nickel Ni

Operating Temperature -55 to +85°C

ADDITIONAL PRODUCT FEATURES
• assembly features one differential pair with a 2.80mm pitch
• assembly housing includes polarization and keying features
• pin has two SMT attachment points, with four solder charge joints per triad wafer
• orientation of the NeoScale plug and receptacle provides a mirrored configuration with a dividing line of back-to-back shields. The resulting mirror line bisects the triad pair to facilitate PCB routing and RX/TX pin-out management for optimal signal integrity and mechanical stability.

NeoScale High-Speed Mezzanine System
170807 Vertical Plug 170814 Vertical Receptacle

Unique, patentpending triad wafer design individual
triad close-up

Triad wafer configuration

Dense mechanical envelope of mated
system
ORDERING INFORMATION Plug

Order No.
170807-0011 170807-0015

Plating 30µ" Gold

Receptacle

Order No.
170814-0009 170814-0015

Plating 30µ" Gold

Connector Height 8.00mm 12.00mm

Connector Height 8.00mm 12.00mm

Triad Wafer Configuration row-by-column 4-by-18 6-by-8

Triad Wafer Configuration row-by-column 4-by-18 6-by-8

Printed in USA/KC/2012.06
2012, Molex

More datasheets: 59166-1-U-00-A | 59166-1-T-00-D | 59166-1-T-00-C | 59166-1-S-00-C | 59166-1-S-00-D | 59166-1-U-00-D | 59166-1-T-00-A | MCIMX6UL-EVK | MDM-25SBS-A174 | 1708140015

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Datasheet ID: 1708070015 649634