SMBJ5929BE3/TR13
SMBJ5929BE3/TR13 Datasheet
SMBG5913 thru SMBG5956B, e3 SMBJ5913 thru SMBJ5956B, e3
| Part | Datasheet |
|---|---|
SMBJ5929BE3/TR13 |
SMBJ5929BE3/TR13 (pdf) |
| Related Parts | Information |
|---|---|
SMBJ5955B |
SMBJ5955B |
| PDF Datasheet Preview |
|---|
| SCOTTSDALE DIVISION SMBG5913 thru SMBG5956B, e3 SMBJ5913 thru SMBJ5956B, e3 SILICON Watt ZENER DIODES .COM APPEARANCE The SMBJ5913-5956B or SMBG5913-5956B series of surface mount watt Zeners provides voltage regulation in a selection from to 200 volts with different tolerances as identified by suffix letter on the part number. This series is equivalent to the JEDEC registered 1N5913 thru 1N5956B with identical electrical characteristics except it is rated at W instead of W with the lower thermal resistance features of the surface mount packaging. It is available in J-bend design SMBJ with the DO214AA package for greater PC board mounting density or in Gull-wing design SMBG in the DO-215AA for visible solder connections. It is also available as RoHS Compliant with an e3 suffix. Microsemi also offers numerous other Zener products to meet higher and lower power applications. IMPORTANT For the most current data, consult MICROSEMI’s website: NOTE All SMB series are equivalent to prior SMS package identifications. APPLICATIONS / BENEFITS • Surface mount equivalent to 1N5913 to 1N5956B • Ideal for high-density and low-profile mounting • Zener voltage available 3.3V to 200V • Standard voltage tolerances are plus/minus 5% with B suffix and 10 % with A suffix identification • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively • Options for screening in accordance with MIL-PRF-19500 for JAN, JANTX, and JANTXV are available by adding MQ, MX, or MV prefixes respectively to part numbers. • RoHS Compliant devices available by adding an “e3” suffix • Regulates voltage over a broad operating current and temperature range • Wide selection from to 200 V • Popular DO-214AA or DO-215AA packages and footprints for either high density J-bend or Gull-wing designs for visible solder joints • Nonsensitive to ESD per MIL-STD-750 Method 1020 • Withstands high surge stresses see Figure 2 • Moisture classification Level 1 per IPC/JEDEC J-STD-020B with no dry pack required MAXIMUM RATINGS • Power dissipation at 25ºC watts also see derating in Figure • Operating and Storage temperature -65ºC to +150ºC • Thermal Resistance 35 ºC/W junction to lead, or 100ºC/W junction to ambient when mounted on FR4 PC board 1oz Cu with recommended footprint see last page • Steady-State Power 2 watts at TL < 80oC, or watts at TA = 25ºC when mounted on FR4 PC board with recommended footprint also see Figure 1 • Forward voltage mA volts maximum • Solder Temperatures 260 ºC for 10 s maximum MECHANICAL AND PACKAGING • CASE Void-free transfer molded thermosetting epoxy body meeting UL94V-0 • TERMINALS Gull-wing or C-bend modified J-bend tin-lead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026 • POLARITY Cathode indicated by band. Diode to be operated with banded end positive with respect to opposite end for Zener regulation • MARKING Includes part number without prefix e.g. 5913B, 5913Be3, 5948C, 5956D, etc. • TAPE & REEL option Standard per EIA-481-1A with 12 mm tape, 750 per 7 inch reel or 2500 per 13 inch reel add “TR” suffix to part number • WEIGHT grams • See package dimensions on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, 480 941-6300, Fax 480 947-1503 SCOTTSDALE DIVISION SMBG5913 thru SMBG5956B, e3 SMBJ5913 thru SMBJ5956B, e3 |
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