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MASMBG2K4.0E3 (pdf) |
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PDF Datasheet Preview |
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MSMBG2K3.0 MSMBG2K5.0, MSMBJ2K3.0 MSMBJ2K5.0 Available 2 kW Surface Mount Transient Voltage Suppressor The MSMBG J 2K3.0 MSMBG J 2K5.0 series of surface mount kilowatt transient voltage suppressors provide a selection of standoff voltages VWM from to volts. These highreliability controlled devices feature unidirectional construction. The SMBG Gull-wing design in the DO-215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO-214AA package is ideal for greater PC board mounting density. It is also available as RoHS compliant. Important For the latest information, visit our website • High reliability upscreened devices with wafer fabrication and assembly lot traceability. • All devices 100% surge tested. • Suppresses transients up to 2 kW 8/20 µs. • Other screening in reference to MIL-PRF-19500 is also available. Refer to MicroNote 129 for more details on the screening options. See part nomenclature for all options. • Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B. • lot norm screening performed on standby current ID. • RoHS compliant versions available. APPLICATIONS / BENEFITS Screening in reference to MIL-PRF-19500 available DO-215AA SMBG Package DO-214AA SMBJ Package NOTE All SMB series are equivalent to prior SMS package identifications. MAXIMUM RATINGS 25 ºC unless otherwise stated Parameters/Test Conditions Junction and Storage Temperature Peak Pulse Power Dissipation 1 Off-State Power Dissipation Tclamping 0 volts to V BR min Forward Voltage 30 A 3 Solder Temperature 10 s 8/20 us 10/1000us TL < 25 ºC TA = 25 ºC Symbol TJ and T STG P PP VF T SP Value -65 to +150 2000 300 5 2 <100 Notes With impulse repetition rate duty factor of maximum also Figure 1 and When mounted on FR4 PC board 1oz Cu with recommended footprint see last page . Peak impulse of ms half-sine wave. Unit oC ps V oC MSC Lawrence 6 Lake Street, Lawrence, MA 01841 Tel 1-800-446-1158 or 978 620-2600 Fax 978 689-0803 MSC Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel +353 0 65 6840044 Fax +353 0 65 6822298 Website: 2013 Microsemi Corporation Page 1 of 6 MSMBG2K3.0 MSMBG2K5.0, MSMBJ2K3.0 MSMBJ2K5.0 MECHANICAL and PACKAGING • CASE Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements. • TERMINALS Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method • MARKING Part number. • POLARITY Cathode end banded. • TAPE & REEL option Standard per EIA-296 add “TR” suffix to part number . Consult factory for quantities. • WEIGHT grams approximate . • See package dimensions on last page. PART NOMENCLATURE M SM B G 2K e3 Reliability Level* M MA MX MXL * see MicroNote 129 |
More datasheets: MASMBJ2K4.5E3 | MASMBJ2K4.5 | MASMBJ2K4.0E3 | MASMBJ2K4.0 | MASMBJ2K3.3E3 | MASMBJ2K3.3 | MASMBJ2K3.0E3 | MASMBJ2K5.0E3 | MASMBG2K5.0 | MASMBG2K5.0E3 |
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