MAD1109E3/TU

MAD1109E3/TU Datasheet


MAD1109 e3

Part Datasheet
MAD1109E3/TU MAD1109E3/TU MAD1109E3/TU (pdf)
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MAD1109 e3

Available

Switching Diode Array Steering Diode TVS ArrayTM

These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated by a planar process and mounted in a 14-Pin DIP package for use as steering diodes protecting up to seven I/O ports from ESD, EFT, or surge by directing them either to the positive side of the power supply line or to ground see figure An external TVS diode may be added between the positive supply line and ground to prevent overvoltage on the supply rail. They may also be used in fast switching core-driver applications. This includes computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding applications. These arrays offer many advantages of integrated circuits such as high-density packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user friendly in PC board mounting. They are available with either tin-lead plating termination or as RoHS compliant with annealed matte-tin finish.
14 Pin Package

Important For the latest information, visit our website
• 7 diode array protects 7 lines
• Molded 14-Pin dual inline package
• UL 94V-0 flammability classification
• Low capacitance pF per diode
• Switching speeds less than 5 ns
• Discrete diode elements offer optimum isolation
• IEC 61000-4 compatible:
61000-4-2 ESD Air 15 kV, contact 8 kV 61000-4-4 EFT 40 A 5/50 ns 61000-4-5 surge 12 A, 8/20 µs
• RoHS compliant device is available

APPLICATIONS / BENEFITS
• Low capacitance steering diode protection for high frequency data lines
• Ideal for:

RS-232 & RS-422 Interface Networks. Ethernet 10 Base T Computer I / O Ports LAN Switching Core Drivers
2013 Microsemi Corporation

Top Viewing Pin Layout

MSC Lawrence 6 Lake Street, Lawrence, MA 01841 Tel 1-800-446-1158 or 978 620-2600 Fax 978 689-0803 MSC Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel +353 0 65 6840044 Fax +353 0 65 6822298 Website:

MAD1109 e3

MAXIMUM RATINGS

Parameters/Test Conditions

Junction and Storage Temperature

Repetitive Peak Forward Current one diode

Forward Surge Current
8/20 µs

Rated Average Power dissipation total

Solder Temperature 10 s

Symbol TJ and TSTG

V RWM IFRM IFSM

P M AV TSP

Value -55 to +150
75 400
2 12 1500 260

Unit ºC/W

V mA A
mW ºC

MECHANICAL and PACKAGING
• CASE Void-free transfer molded thermosetting epoxy body meeting UL94V-0 flammability classification
• TERMINALS Tin-lead or RoHS compliant annealed matte-tin plating solderable per MIL-STD-750 method 2026
• MARKING MSC logo, MAD1109 or MAD1109e3 and date code. Pin #1 is to the left of the dot or indent on top of package.
• DELIVERY OPTION Carrier tube. Consult factory for quantities
• WEIGHT Approximately grams
• See Package Dimensions on last page.

Thru-Hole Mount Package Series Number

PART NOMENCLATURE
1109 e3

RoHS Compliance e3 = RoHS compliant Blank = non-RoHS compliant

CT IR V BR VF

V RWM

SYMBOLS & DEFINITIONS Definition
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Datasheet ID: MAD1109E3/TU 649048