JANSR2N2369AUB

JANSR2N2369AUB Datasheet


This RHA level NPN switching transistor 2N2369A device in a UB and UBC package is ideal to drive many high-reliability applications. This device is constructed and screened to a JANSR performance level with radiation test method 1019 wafer lot acceptance conducted on all die lots. Fully compliant to GSFC EEE-INST-002 reliability, screening and radiation hardness assurance requirements for space flight projects

Part Datasheet
JANSR2N2369AUB JANSR2N2369AUB JANSR2N2369AUB (pdf)
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MSR2N2369AUB / UBC

Rad Hard NPN Silicon High Speed Switching Transistor

Screened per MIL-PRF-19500 & ESCC 22900

Screened Levels MSR

Radiation Level TID

ELDRS

QPL RANGE and RAD LEVEL

MSR2N2369AUB 100 Krad 100 Krad

This RHA level NPN switching transistor 2N2369A device in a UB and UBC package is ideal to drive many high-reliability applications. This device is constructed and screened to a JANSR performance level with radiation test method 1019 wafer lot acceptance conducted on all die lots. Fully compliant to GSFC EEE-INST-002 reliability, screening and radiation hardness assurance requirements for space flight projects

Important For the latest information, visit our website
• JEDEC registered 2N2369
• TID level screened per MIL-PRF-19500
• Also available with ELDRS testing to Rad s / sec
• MKCR / MHCR chip die available
• RHA Radiation hardness assured lot by lot validation testing via ELDR Rad SI /sec dose rate

APPLICATIONS / BENEFITS
• Rad-Hard power supplies
• Rad-Hard motor controls
• General purpose switching
• Instrumentation Amps
• EPS Satellite switching power applications

MAXIMUM RATINGS TA = +25 ºC unless otherwise noted

UB & UBC Package

Also available in:

AU package
surface mount MSR2N2369AU

TO-206AA package
leaded top-hat MSR2N2369A

UA package
surface mount MSR2N2369AUA

Parameters/Test Conditions Junction and Storage Temperature

Thermal Resistance Junction-to-Solder Pad

Thermal Resistance Junction-to-Ambient

Total Power Dissipation:

TA = +25 ºC 1 TC = +125 ºC 2 3 TSP = +125 ºC 2

Collector-Base Voltage, Emitter Open

Emitter-Base Voltage, Collector Open

Collector-Emitter Voltage, Base Open

Collector Current, dc

Solder Temperature 10 s

Symbol TJ and TSTG

VCBO VEBO VCEO VCES TSP

Value -65 to +200
210 486 40 15 40 260

Notes Derate linearly mW/°C above TA = +25°C. Derate linerly mW/°C above TC =+125°C. See Figure Power dissipation limited to 360 mW per chip regardless of thermal resistance.

Unit ºC ºC/W ºC/W

MSC Lawrence 6 Lake Street, Lawrence, MA 01841 Tel 1-800-446-1158 or 978 620-2600 Fax 978 689-0803

MSC Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel +353 0 65 6840044 Fax +353 0 65 6822298

Website:
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Datasheet ID: JANSR2N2369AUB 648588