1N6630US

1N6630US Datasheet

1N6626US thru 1N6631US

Part	Datasheet
1N6630US	1N6630US (pdf)

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.COM SCOTTSDALE DIVISION 1N6626US thru 1N6631US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS APPEARANCE IMPORTANT For the most current data, consult MICROSEMI’s website: Package “E” or D-5B APPLICATIONS / BENEFITS • Surface mount series equivalent to the JEDEC registered 1N6626 to 1N6631 series • Voidless hermetically sealed glass package • Extremely robust construction • Triple-layer passivation • Internal “Category I” Metallurgical bonds • JAN, JANTX, and JANTXV available per MIL-PRF19500/590 • Further options for screening in accordance with MILPRF-19500 for JANS by using a “SP” prefix, e.g. SP6626US, SP6629US, etc. • Axial-leaded equivalents also available see separate data sheet for 1N6626 thru 1N6631 • Ultrafast recovery rectifier series 200 to 1000 V • Military and other high-reliability applications • Switching power supplies or other applications requiring extremely fast switching & low forward loss • High forward surge current capability • Low thermal resistance • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS • Junction Temperature -65oC to +150oC • Storage Temperature -65oC to +175oC • Peak Forward Surge Current 25oC 75A except 1N6631 which is 60A Note Test pulse = 8.3ms, half-sine wave. • Average Rectified Forward Current IO at TEC = +110oC: 1N6626US thru 1N6628US 1N6629US thru 1N6631US Derate linearly at 2.5%/oC for TEC > +110oC • Average Rectified Forward Current IO at TA=25oC: 1N6626US thru 1N6628US 1N6629US thru 1N6631US Derate linearly at oC for TA>+25oC. This IO rating is for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ max is not exceeded. See latest issue of MIL-PRF-19500/590 • Thermal Resistance junction to endcap 6.5oC/W • Capacitance at VR= 10 V 40 pF • Solder temperature 260oC for 10 s maximum MECHANICAL AND PACKAGING • CASE Hermetically sealed voidless hard glass with Tungsten slugs • TERMINATIONS End caps are Copper with Tin/Lead Sn/Pb finish. Note Previous inventory had solid Silver end caps with Tin/Lead finish. • MARKING Cathode band only • POLARITY Cathode indicated by band • Tape & Reel option Standard per EIA-481-B • Weight 539 mg • See package dimensions and recommended pad layout on last page

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.COM

SCOTTSDALE DIVISION
1N6626US thru 1N6631US

VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS

APPEARANCE

IMPORTANT For the most current data, consult MICROSEMI’s website:

Package “E” or D-5B

APPLICATIONS / BENEFITS
• Surface mount series equivalent to the JEDEC registered 1N6626 to 1N6631 series
• Voidless hermetically sealed glass package
• Extremely robust construction
• Triple-layer passivation
• Internal “Category I” Metallurgical bonds
• JAN, JANTX, and JANTXV available per MIL-PRF19500/590
• Further options for screening in accordance with MILPRF-19500 for JANS by using a “SP” prefix, e.g. SP6626US, SP6629US, etc.
• Axial-leaded equivalents also available see separate data sheet for 1N6626 thru 1N6631
• Ultrafast recovery rectifier series 200 to 1000 V
• Military and other high-reliability applications
• Switching power supplies or other applications
requiring extremely fast switching & low forward loss
• High forward surge current capability
• Low thermal resistance
• Inherently radiation hard as described in Microsemi

MicroNote 050

MAXIMUM RATINGS
• Junction Temperature -65oC to +150oC
• Storage Temperature -65oC to +175oC
• Peak Forward Surge Current 25oC 75A except
1N6631 which is 60A

Note Test pulse = 8.3ms, half-sine wave.
• Average Rectified Forward Current IO at TEC = +110oC:
1N6626US thru 1N6628US
1N6629US thru 1N6631US

Derate linearly at 2.5%/oC for TEC > +110oC
• Average Rectified Forward Current IO at TA=25oC:
1N6626US thru 1N6628US
1N6629US thru 1N6631US

Derate linearly at oC for TA>+25oC. This IO rating is for PC boards where thermal resistance from mounting
point to ambient is sufficiently controlled where TJ max is not exceeded. See latest issue of MIL-PRF-19500/590
• Thermal Resistance junction to endcap 6.5oC/W
• Capacitance at VR= 10 V 40 pF
• Solder temperature 260oC for 10 s maximum

MECHANICAL AND PACKAGING
• CASE Hermetically sealed voidless hard glass with Tungsten slugs
• TERMINATIONS End caps are Copper with Tin/Lead Sn/Pb finish. Note Previous inventory had solid Silver end caps with Tin/Lead finish.
• MARKING Cathode band only
• POLARITY Cathode indicated by band
• Tape & Reel option Standard per EIA-481-B
• Weight 539 mg
• See package dimensions and recommended
pad layout on last page

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Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 1N6630US Datasheet file may be downloaded here without warranties.

Datasheet ID: 1N6630US 648570