1N3016BUR-1 thru 1N3051BUR-1, e3 or MLL3016B thru MLL3051B, e3
Part | Datasheet |
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1N3016BUR-1 (pdf) |
Related Parts | Information |
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1N3050BUR-1 |
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1N3051BUR-1 |
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1N3049BUR-1 |
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1N3046BUR-1 |
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1N3047BUR-1 |
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1N3019BUR-1 |
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1N3018BUR-1 |
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1N3017BUR-1 |
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1N3048BUR-1 |
PDF Datasheet Preview |
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SCOTTSDALE DIVISION 1N3016BUR-1 thru 1N3051BUR-1, e3 or MLL3016B thru MLL3051B, e3 Surface Mount W GLASS ZENER DIODES .COM This surface mountable zener diode series is similar to the 1N3016 thru 1N3051 JEDEC registration in the DO-13 package except that it meets the surface mount DO-213AB outline. It is an ideal selection for applications of high density and low parasitic requirements. Due to its glass hermetic seal qualities and metallurgically enhanced internal construction, it is also well suited for high-reliability applications. This can be acquired by a source control drawing SCD , or by ordering device types with MQ, MX, or MV prefix to part number for equivalent screening to JAN, JANTX or JANTXV. IMPORTANT For the most current data, consult MICROSEMI’s website: APPEARANCE DO-213AB • Leadless surface mount package equivalents to the JEDEC registered 1N3016 thru 1N3051 except with higher power rating of Watts • Ideal for high-density mounting • Voltage range to 200 volts • Hermetically sealed, double-slug glass construction • Metallurgically enhanced contact construction. • Options for screening in accordance with MIL-PRF19500/115 for JAN, JANTX, JANTXV, and JANS with MQ, MX, MV, or MSP prefixes respectively for part numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1, etc. • Axial lead “thru-hole” DO-13 packages per JEDEC registration available as 1N3016B thru 1N3051B see separate data sheet with MIL-PRF-19500/115 qualification • RoHS Compliant devices available by adding “e3” suffix APPLICATIONS / BENEFITS • Regulates voltage over a broad operating current and temperature range greater reliability and lower thermal resistance • Nonsensitive to ESD • Hermetically sealed glass package • Specified capacitance see Figure 2 • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS • Power dissipation at 25ºC watts also see derating in Figure • Operating and Storage temperature -65ºC to +175ºC • Thermal Resistance 40 ºC/W junction to end cap, or 120ºC/W junction to ambient when mounted on FR4 PC board 1 oz Cu with recommended footprint see last page • Steady-State Power watts at end-cap temperature TEC < 115oC, or watts at TA = 25ºC when mounted on FR4 PC board and recommended footprint as described for thermal resistance also see Figure 1 • Forward voltage mA volts maximum • Solder Temperatures 260 ºC for 10 s max MECHANICAL AND PACKAGING • CASE Hermetically sealed glass MELF package • TERMINALS Tin-lead or RoHS compliant annealed matte-Tin plating solderable per MILSTD-750, method 2026 • POLARITY Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation • MARKING Cathode band only • TAPE & REEL optional Standard per EIA-481-1-A with 12 mm tape, 1500 per 7 inch reel or 5000 per 13 inch reel add “TR” suffix to part number • WEIGHT grams • See package dimensions on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, 480 941-6300, Fax 480 947-1503 1N3016BUR-1, e3 thru 1N3051BUR-1, e3 .COM SCOTTSDALE DIVISION 1N3016BUR-1 thru 1N3051BUR-1, e3 or MLL3016B thru MLL3051B, e3 Surface Mount W GLASS ZENER DIODES *ELECTRICAL CHARACTERISTICS 25oC INDUSTRY PART NUMBER ** MICROSEMI PART NUMBER NOMINAL ZENER |
More datasheets: LTST-S220UBKT | 1N3050BUR-1 | 1N3051BUR-1 | 1N3049BUR-1 | 1N3046BUR-1 | 1N3047BUR-1 | 1N3019BUR-1 | 1N3018BUR-1 | 1N3017BUR-1 | 1N3048BUR-1 |
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