MT5HTF3272KY-40EB2

MT5HTF3272KY-40EB2 Datasheet

MT5HTF3272 P K 256MB

Part	Datasheet
MT5HTF3272KY-40EB2	MT5HTF3272KY-40EB2 (pdf)

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PDF Datasheet Preview
256MB x72, SR 244-Pin DDR2 Mini-RDIMM Features DDR2 SDRAM Mini-RDIMM MT5HTF3272 P K 256MB For component data sheets, refer to Micron’s Web site: • 244-pin, mini-registered dual in-line memory module mini-RDIMM • Fast data transfer rates PC-3200, PC2-4200, or PC2-5300 • Supports ECC error detection and correction • 256MB 32 Meg x 72 • VDD = VDDQ = +1.8V • VDDSPD = +1.7V to +3.6V • JEDEC-standard 1.8V I/O SSTL_18-compatible • Differential data strobe DQS, DQS# option • 4n-bit prefetch architecture • Single rank • Multiple internal device banks for concurrent operation • Supports duplicate output strobe RDQS/RDQS# • Programmable CAS# latency CL • Posted CAS# additive latency AL • WRITE latency = READ latency - 1 tCK • Programmable burst lengths 4 or 8 • Adjustable data-output drive strength • 64ms, 8,192-cycle refresh • On-die termination ODT • Serial presence-detect SPD with EEPROM • Gold edge contacts Figure 1 244-Pin Mini-RDIMM MO-244 R/C B Module height 30.0mm 1.18in Options Marking • Parity • Operating temperature1 Commercial 0°C TA +70°C Industrial TA +85°C • Package None I 244-pin mini-RDIMM Pb-free • Frequency/CAS latency2 3.0ns CL = 5 DDR2-667 -667 3.75ns CL = 4 DDR2-533 -53E 5.0ns CL = 3 DDR2-400 -40E • PCB height 30mm 1.18in Notes Contact Micron for industrial temperature module offerings. CL = CAS READ latency registered mode will add one clock cycle to CL. Table 1: Speed Grade -667 -53E -40E Key Timing Parameters Industry Nomenclature PC2-5300 PC2-4200 PC2-3200 Data Rate MT/s CL = 5 CL = 4 CL = 3 tRCD ns tRP ns

PDF Datasheet Preview

256MB x72, SR 244-Pin DDR2 Mini-RDIMM Features

DDR2 SDRAM Mini-RDIMM

MT5HTF3272 P K 256MB

For component data sheets, refer to Micron’s Web site:
• 244-pin, mini-registered dual in-line memory module mini-RDIMM
• Fast data transfer rates PC-3200, PC2-4200, or PC2-5300
• Supports ECC error detection and correction
• 256MB 32 Meg x 72
• VDD = VDDQ = +1.8V
• VDDSPD = +1.7V to +3.6V
• JEDEC-standard 1.8V I/O SSTL_18-compatible
• Differential data strobe DQS, DQS# option
• 4n-bit prefetch architecture
• Single rank
• Multiple internal device banks for concurrent
operation
• Supports duplicate output strobe RDQS/RDQS#
• Programmable CAS# latency CL
• Posted CAS# additive latency AL
• WRITE latency = READ latency - 1 tCK
• Programmable burst lengths 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination ODT
• Serial presence-detect SPD with EEPROM
• Gold edge contacts

Figure 1 244-Pin Mini-RDIMM MO-244 R/C B

Module height 30.0mm 1.18in

Options

Marking
• Parity
• Operating temperature1

Commercial 0°C TA +70°C Industrial TA +85°C
• Package

None I
244-pin mini-RDIMM Pb-free
• Frequency/CAS latency2
3.0ns CL = 5 DDR2-667
-667
3.75ns CL = 4 DDR2-533
-53E
5.0ns CL = 3 DDR2-400
-40E
• PCB height
30mm 1.18in

Notes Contact Micron for industrial temperature
module offerings.

CL = CAS READ latency registered mode will add one clock cycle to CL.

Table 1:

Speed Grade
-667 -53E -40E

Key Timing Parameters

Industry Nomenclature PC2-5300 PC2-4200 PC2-3200

Data Rate MT/s

CL = 5

CL = 4

CL = 3
tRCD ns
tRP ns

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Datasheet ID: MT5HTF3272KY-40EB2 648477