MT46H64M16LF 16 Meg x 16 x 4 Banks MT46H32M32LF 8 Meg x 32 x 4 Banks
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MT46H64M16LFCK-6 IT:A TR (pdf) |
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MT46H64M16LFCK-6:A TR |
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1Gb x16, x32 Mobile LPDDR SDRAM Features Mobile Low-Power DDR SDRAM MT46H64M16LF 16 Meg x 16 x 4 Banks MT46H32M32LF 8 Meg x 32 x 4 Banks • VDD/VDDQ = • Bidirectional data strobe per byte of data DQS • Internal, pipelined double data rate DDR architecture two data accesses per clock cycle • Differential clock inputs CK and CK# • Commands entered on each positive CK edge • DQS edge-aligned with data for READs center- aligned with data for WRITEs • 4 internal banks for concurrent operation • Data masks DM for masking write mask per byte • Programmable burst lengths BL 2, 4, 8, or 161 • Concurrent auto precharge option is supported • Auto refresh and self refresh modes • 1.8V LVCMOS-compatible inputs • On-chip temp sensor to control self refresh rate • Partial-array self refresh PASR • Deep power-down DPD • Status read register SRR • Selectable output drive strength DS • Clock stop capability • 64ms refresh Table 1 Key Timing Parameters CL = 3 Speed Grade -5 -54 -6 -75 Clock Rate MHz 200 185 166 133 Access Time 5.0ns 5.0ns 5.5ns 6.0ns Options • VDD/VDDQ 1.8V/1.8V • Configuration 64 Meg x 16 Meg x 16 x 4 banks 32 Meg x 32 8 Meg x 32 x 4 banks • Row-size option JEDEC-standard option Reduced page-size option1 • Plastic green package 60-ball VFBGA 10mm x 11.5mm 2 90-ball VFBGA 10mm x 13mm 3 • Timing cycle time 5ns CL = 3 5.4ns CL = 3 6ns CL = 3 7.5ns CL = 3 • Power Standard IDD2/IDD6 Low-power IDD2/IDD6 • Operating temperature range Commercial to Industrial to Marking 64M16 32M32 LF LG CK CM -5 -54 -6 -75 None L None IT :A Contact factory for availability. Only available for x16 configuration. Only available for x32 configuration. Micron Technology, Inc. reserves the right to change products or specifications without notice. 2007 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. 1Gb x16, x32 Mobile LPDDR SDRAM Features Table 2 Configuration Addressing 1Gb Architecture Configuration Refresh count Row addressing Column addressing 64 Meg x 16 Meg x 16 x 4 banks 8K 16K A[13:0] 1K A[9:0] 32 Meg x 32 8 Meg x 32 x 4 banks 8K A[12:0] 1K A[9:0] Reduced Page-Size Option 32 Meg x 32 8 Meg x 32 x 4 banks 8K 16K A[13:0] 512 A[8:0] Figure 1 1Gb Mobile LPDDR Part Numbering MT 46 H 64M16 LF CK -6 L IT :A The ordering of accesses within a burst is determined by the burst length, the burst type, and the starting column address. Table 19 Burst Definition Table Burst Length Starting Column Address Order of Accesses Within a Burst Type = Sequential Type = Interleaved 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3 1-0-3-2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2007 Micron Technology, Inc. All rights reserved. 1Gb x16, x32 Mobile LPDDR SDRAM Standard Mode Register Table 19 Burst Definition Table Continued Burst Length Starting Column Address Order of Accesses Within a Burst Type = Sequential Type = Interleaved 0-1-2-3-4-5-6-7-8-9-A-B-C-D-E-F 0-1-2-3-4-5-6-7-8-9-A-B-C-D-E-F 1-2-3-4-5-6-7-8-9-A-B-C-D-E-F-0 1-0-3-2-5-4-7-6-9-8-B-A-D-C-F-E 2-3-4-5-6-7-8-9-A-B-C-D-E-F-0-1 2-3-0-1-6-7-4-5-A-B-8-9-E-F-C-D 3-4-5-6-7-8-9-A-B-C-D-E-F-0-1-2 3-2-1-0-7-6-5-4-B-A-9-8-F-E-D-C 4-5-6-7-8-9-A-B-C-D-E-F-0-1-2-3 4-5-6-7-0-1-2-3-C-D-E-F-8-9-A-B 5-6-7-8-9-A-B-C-D-E-F-0-1-2-3-4 5-4-7-6-1-0-3-2-D-C-F-E-9-8-B-A 6-7-8-9-A-B-C-D-E-F-0-1-2-3-4-5 6-7-4-5-2-3-0-1-E-F-C-D-A-B-8-9 7-8-9-A-B-C-D-E-F-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0-F-E-D-C-B-A-9-8 8-9-A-B-C-D-E-F-0-1-2-3-4-5-6-7 8-9-A-B-C-D-E-F-0-1-2-3-4-5-6-7 9-A-B-C-D-E-F-0-1-2-3-4-5-6-7-8 9-8-B-A-D-C-F-E-1-0-3-2-5-4-7-6 A-B-C-D-E-F-0-1-2-3-4-5-6-7-8-9 A-B-8-9-E-F-C-D-2-3-0-1-6-7-4-5 |
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