M25P128 Serial Flash Embedded Memory Features
Part | Datasheet |
---|---|
![]() |
M25P128-VME6GB (pdf) |
Related Parts | Information |
---|---|
![]() |
M25P128-VMF6TPB TR |
![]() |
M25P128-VME6TGB TR |
![]() |
M25P128-VMF6PB |
![]() |
M25P128-VMFPBALT |
PDF Datasheet Preview |
---|
M25P128 Serial Flash Embedded Memory Features M25P128 Serial Flash Embedded Memory with 54 MHz SPI Bus Interface • SPI bus-compatible serial interface • 128Mb Flash memory • 54 MHz clock frequency maximum • 2.7V to 3.6V single supply voltage • VPP = 9V for fast program/erase mode optional • Page program up to 256 bytes in 0.5ms TYP 0.4ms TYP with VPP = 9V • Erase capability Sector erase 2Mb Bulk erase 128Mb • Electronic signature JEDEC-standard 2-byte signature 2018h • More than 100,000 PROGRAM/ERASE cycles per sector • More than 20 years data retention • Automotive-grade parts available • Packages RoHS-compliant VFDFPN8 MLP8 8mm x 6mm Package code ME SO16W 300 mils Package code MF Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. M25P128 Serial Flash Embedded Memory Features Contents Functional Description 5 Signal Descriptions 7 SPI Modes 8 Operating Features 10 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. M25P128 Serial Flash Embedded Memory Features List of Figures Figure 1 Logic Diagram 5 Figure 2 Pin Connections VDFPN 5 Figure 3 Pin Connections SO 6 Figure 4 SPI Modes Supported 8 Figure 5 Bus Master and Memory Devices on the SPI Bus 9 Figure 6 Hold Condition Activation 12 Figure 7 Block Diagram 13 Figure 8 WRITE ENABLE Command Sequence 17 Figure 9 WRITE DISABLE Command Sequence 18 Figure 10 READ IDENTIFICATION Command Sequence 19 Figure 11 READ STATUS REGISTER Command Sequence 20 Figure 12 Status Register Format 20 Figure 13 WRITE STATUS REGISTER Command Sequence 22 Figure 14 READ DATA BYTES Command Sequence 24 Figure 15 READ DATA BYTES at HIGHER SPEED Command Sequence 25 Figure 16 PAGE PROGRAM Command Sequence 26 Figure 17 SECTOR ERASE Command Sequence 27 Figure 18 BULK ERASE Command Sequence 28 Figure 19 Power-Up Timing 30 Figure 20 AC Measurement I/O Waveform 34 Figure 21 Serial Input Timing 36 Figure 22 Write Protect Setup and Hold during WRSR when SRWD = 1 Timing 37 Figure 23 Hold Timing 37 Figure 24 Output Timing 38 Figure 25 VPPH Timing 38 Figure 26 VFDFPN8 MLP8 8mm x 6mm Package Code ME 39 Figure 27 SO16W 300 mils Body Width Package Code MF 40 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. M25P128 Serial Flash Embedded Memory Features List of Tables Table 1 Signal Descriptions 7 Table 2 Protected Area Sizes 11 Table 3 Sectors 63:0 14 Table 4 Command Set Codes 16 Table 5 READ IDENTIFICATION Data Out Sequence 19 Table 6 Status Register Protection Modes 23 Table 7 Power-Up Timing and VWI Threshold 30 Table 8 Absolute Maximum Ratings 32 Table 9 Operating Conditions 32 Table 10 DC Current Specifications 33 Table 11 DC Voltage Specifications 33 Table 12 AC Measurement Conditions 34 Table 13 Capacitance 34 Table 14 AC Specifications 35 Table 15 AC Specifications, Command Times 36 Table 16 Part Number Information Scheme 41 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. M25P128 Serial Flash Embedded Memory Functional Description Functional Description The M25P128 is a 128Mb 16Mb x 8 serial Flash memory device with advanced write protection mechanisms accessed by a high speed SPI-compatible bus. The device supports high-performance commands for clock frequency up to 54 MHz. The memory can be programmed 1 to 256 bytes at a time using the PAGE PROGRAM command. It is organized as 64 sectors, each containing 1024 pages. Each page is 256 bytes wide. Memory can be viewed either as 65,536 pages or as 16,777,216 bytes. An enhanced fast program/erase mode is available to speed up operations in factory environment. The device enters this mode whenever the VPPH voltage is applied to the W#/VPP pin. The entire memory can be erased using the BULK ERASE command, or it can be erased one sector at a time using the SECTOR ERASE command. To meet environmental requirements, Micron offers these devices in lead-free and RoHS compliant packages. Figure 1 Logic Diagram DQ0 C S# W#/VPP HOLD# Figure 2 Pin Connections VDFPN W#/VPP HOLD# Note: There is an exposed central pad on the underside of the MLP8 package that is pulled internally to VSS, and must not be connected to any other voltage or signal line on the PCB. The Package Mechanical section provides information on package dimensions and how to identify pin Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. M25P128 Serial Flash Embedded Memory Functional Description Figure 3 Pin Connections SO HOLD# W#/VPP Notes DNU = Don't Use The Package Information section provides information on package dimensions and how to identify pin Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. Signal Descriptions M25P128 Serial Flash Embedded Memory Signal Descriptions Table 1 Signal Descriptions Signal DQ1 DQ0 C S# HOLD# W#/VPP VCC VSS DNU Type Output Input Input Input M25P128 Serial Flash Embedded Memory Device Ordering Information Device Ordering Information Standard Parts For further information on line items not listed here or on any aspect of this device, contact your nearest representative. Table 16 Part Number Information Scheme Part Number Category Device type Density Operating voltage Package Device grade Packing option Plating technology Lithography Category Details M25P = Serial Flash memory for code storage 128 = 128Mb 16Mb x 8 V = VCC = 2.7V to 3.6V ME = VFDFPN8 8mm x 6mm MLP8 MF = SO16W 300 mils width 6 = Industrial temperature range to 85°C. Device tested with standard test flow. = Standard packing T = Tape and reel packing P or G = RoHS-compliant B = 65nm SLC Note The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. • Initial Micron rebrand. 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel 208-368-4000 Sales inquiries 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization some- times occur. Micron Technology, Inc. reserves the right to change products or specifications without notice. 2016 Micron Technology, Inc. All rights reserved. |
More datasheets: MM74HC4049MTCX | MM74HC4049M | MM74HC4049MX | MM74HC4049MTC | MM74HC4050MX | MM74HC4050N | MM74HC4049N | M25P128-VMF6TPB TR | M25P128-VME6TGB TR | M25P128-VMF6PB |
Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived M25P128-VME6GB Datasheet file may be downloaded here without warranties.