EDB2432BCPE-8D-F-D

EDB2432BCPE-8D-F-D Datasheet

EDB2432BCPE

Part	Datasheet
EDB2432BCPE-8D-F-D	EDB2432BCPE-8D-F-D (pdf)

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DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications • Density 2G bits • Organization 8M words x 32 bits x 8 banks • Data rate 800Mbps max. • Package 168-ball FBGA Package size 12.0mm x 12.0mm Ball pitch 0.5mm Lead-free RoHS compliant and Halogen-free • Power supply VDD1 = 1.70V to 1.95V VDD2, VDDQ = 1.14V to 1.30V • Interface HSUL_12 • Operating case temperature range TC = -30°C to +85°C • JEDEC LPDDR2-S4B compliance • DLL is not implemented • Low power consumption • Mobile RAM functions Partial Array Self-Refresh PASR Auto Temperature Compensated Self-Refresh ATCSR by built-in temperature sensor Deep power-down mode Per Bank Refresh • This FBGA is suitable for Package on Package PoP Block Diagram CKE /CS VDD1 VDD2 VDDQ VREFCA VREFDQ CK, /CK CA0 to CA9 2G bits 64M x 32 DQS0 to DQS3 /DQS0 to /DQS3 DQ0 to DQ31 DM0 to DM3 ZQ Document No. E1881E20 Ver. Date Published March 2012 K Japan Printed in Japan URL: Memory, Inc. 2011-2012 Ordering Information EDB2432BCPE Part number EDB2432BCPE-8D-F Organization words x bits 64M x 32 Clock frequency 400MHz Data rate 800Mbps Read latency 6 Package 168-ball FBGA E D B 24 32 B C PE - 8D - F Elpida Memory Type D Packaged Device Product Family B DDR2 Mobile RAM Density/Chip select 24 2Gb/1-CS Organization 32 x32 Power Supply, Interface B VDD1 = 1.8V, VDD2 = VDDQ = 1.2V, S4B device, HSUL Environment Code F Lead Free RoHS compliant and Halogen Free Speed 8D 800Mbps Package PA BGA for PoP Data Sheet E1881E20 Ver. EDB2432BCPE CONTENTS Specifications 1 Block Diagram 1 Features 1 Ordering Information 2 Part Number 2 Pin Configurations 4 Pin Descriptions 5 Pin Capacitance 6 Package Drawing 7 Mode Register Specification 8 Electrical Conditions 9 Absolute Maximum Ratings 9 Recommended DC Operating Conditions 9 Electrical Specifications 10 DC Characteristics 1 10 DC Characteristics 2 12 AC Characteristics 13 Data Sheet E1881E20 Ver. EDB2432BCPE Pin Configurations /xxx indicate active low signal. 168-ball FBGA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 NC VDD1 VSS DQ30 DQ29 VSS DQ26 DQ25 VSS /DQS3 VDD1 VSS NC NC VDD1 NC VSS NC VSS NC VSS VDD2 DQ31 VDDQ DQ28 DQ27 VDDQ DQ24 DQS3 VDDQ DM3 VDD2 NC VSS VDD2 DQ15 VSS VDDQ DQ14 DQ12 DQ13 NC VSS DQ11 VSS VDDQ DQ10 DQ8 DQ9 NC VSS DQS1 VSS VDDQ /DQS1 VDD2 DM1 NC VSS VREFDQ VSS NC VDD1 VDD1 DM0 ZQ VREFCA /DQS0 VSS VSS VDD2 VDDQ DQS0 CA9 CA8 DQ6 DQ7 U CA7 NC DQ5 VSS V VSS CA6 VDDQ DQ4 W CA5 NC DQ2 DQ3 Y /CK DQ1 VSS VSS VDD2

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DATA SHEET
2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA

EDB2432BCPE

Specifications
• Density 2G bits
• Organization 8M words x 32 bits x 8 banks
• Data rate 800Mbps max.
• Package 168-ball FBGA Package size 12.0mm x 12.0mm Ball pitch 0.5mm Lead-free RoHS compliant and Halogen-free
• Power supply VDD1 = 1.70V to 1.95V VDD2, VDDQ = 1.14V to 1.30V
• Interface HSUL_12
• Operating case temperature range TC = -30°C to +85°C
• JEDEC LPDDR2-S4B compliance
• DLL is not implemented
• Low power consumption
• Mobile RAM functions Partial Array Self-Refresh PASR Auto Temperature Compensated Self-Refresh

ATCSR by built-in temperature sensor Deep power-down mode Per Bank Refresh
• This FBGA is suitable for Package on Package PoP

Block Diagram

CKE /CS

VDD1 VDD2 VDDQ VREFCA VREFDQ

CK, /CK CA0 to CA9
2G bits 64M x 32

DQS0 to DQS3 /DQS0 to /DQS3 DQ0 to DQ31

DM0 to DM3 ZQ

Document No. E1881E20 Ver. Date Published March 2012 K Japan Printed in Japan URL:

Memory, Inc. 2011-2012
Ordering Information

EDB2432BCPE

Part number EDB2432BCPE-8D-F

Organization words x bits
64M x 32

Clock frequency 400MHz

Data rate 800Mbps

Read latency 6

Package 168-ball FBGA

E D B 24 32 B C PE - 8D - F

Elpida Memory

Type D Packaged Device

Product Family B DDR2 Mobile RAM

Density/Chip select 24 2Gb/1-CS

Organization 32 x32

Power Supply, Interface B VDD1 = 1.8V, VDD2 = VDDQ = 1.2V, S4B device, HSUL

Environment Code F Lead Free RoHS compliant and Halogen Free

Speed 8D 800Mbps

Package PA BGA for PoP

Data Sheet E1881E20 Ver.

EDB2432BCPE

CONTENTS
Specifications 1 Block Diagram 1 Features 1 Ordering Information 2 Part Number 2 Pin Configurations 4 Pin Descriptions 5 Pin Capacitance 6 Package Drawing 7 Mode Register Specification 8 Electrical Conditions 9

Absolute Maximum Ratings 9 Recommended DC Operating Conditions 9 Electrical Specifications 10 DC Characteristics 1 10 DC Characteristics 2 12 AC Characteristics 13

Data Sheet E1881E20 Ver.

EDB2432BCPE

Pin Configurations
/xxx indicate active low signal.
168-ball FBGA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

NC VDD1 VSS DQ30 DQ29 VSS DQ26 DQ25 VSS /DQS3 VDD1 VSS NC

NC VDD1 NC VSS NC VSS NC VSS VDD2 DQ31 VDDQ DQ28 DQ27 VDDQ DQ24 DQS3 VDDQ DM3 VDD2 NC

VSS VDD2

DQ15 VSS

VDDQ DQ14

DQ12 DQ13

NC VSS

DQ11 VSS

VDDQ DQ10

DQ8 DQ9

NC VSS

DQS1 VSS

VDDQ /DQS1

VDD2 DM1

NC VSS

VREFDQ VSS

NC VDD1

VDD1 DM0

ZQ VREFCA
/DQS0 VSS

VSS VDD2

VDDQ DQS0

CA9 CA8

DQ6 DQ7

U CA7 NC

DQ5 VSS

V VSS CA6

VDDQ DQ4

W CA5 NC

DQ2 DQ3

Y /CK

DQ1 VSS

VSS VDD2

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Datasheet ID: EDB2432BCPE-8D-F-D 648271