DSPIC30F6010AT-30I/PF

DSPIC30F6010AT-30I/PF Datasheet

dsPIC30F

Part	Datasheet
DSPIC30F6010AT-30I/PF	DSPIC30F6010AT-30I/PF (pdf)

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DSPIC30F5011T-30I/PTG	DSPIC30F5011T-30I/PTG
DSPIC30F5013T-20I/PTG	DSPIC30F5013T-20I/PTG
DSPIC30F5013T-30I/PTG	DSPIC30F5013T-30I/PTG
DSPIC30F5011T-20I/PTG	DSPIC30F5011T-20I/PTG
DSPIC30F501130IP	DSPIC30F501130IP
DSPIC30F2010-30I/SOG	DSPIC30F2010-30I/SOG
DSPIC30F6013A-20I/PT	DSPIC30F6013A-20I/PT
DSPIC30F4012T-20I/SO	DSPIC30F4012T-20I/SO
DSPIC30F5015-20I/PT	DSPIC30F5015-20I/PT
DSPIC30F2010T-20I/SOG	DSPIC30F2010T-20I/SOG
DSPIC30F4012T-30I/ML	DSPIC30F4012T-30I/ML
DSPIC30F6014T-20E/PF	DSPIC30F6014T-20E/PF
DSPIC30F6011T-20E/PF	DSPIC30F6011T-20E/PF
DSPIC30F4012T-30I/SO	DSPIC30F4012T-30I/SO
DSPIC30F6010T-20E/PF	DSPIC30F6010T-20E/PF
DSPIC30F5016-20I/PT	DSPIC30F5016-20I/PT
DSPIC30F6010A-20I/PT	DSPIC30F6010A-20I/PT
DSPIC30F6011A-20I/PT	DSPIC30F6011A-20I/PT
DSPIC30F6015-20I/PT	DSPIC30F6015-20I/PT
DSPIC30F3014T-20I/ML	DSPIC30F3014T-20I/ML
DSPIC30F4013T-20E/PT	DSPIC30F4013T-20E/PT
DSPIC30F3014T-20E/PT	DSPIC30F3014T-20E/PT
DSPIC30F4013T-20I/ML	DSPIC30F4013T-20I/ML
DSPIC30F4012T-20I/ML	DSPIC30F4012T-20I/ML
DSPIC30F3014T-30I/ML	DSPIC30F3014T-30I/ML
DSPIC30F3014T-20I/PT	DSPIC30F3014T-20I/PT
DSPIC30F4013T-20I/PT	DSPIC30F4013T-20I/PT
DSPIC30F3013T-20E/SO	DSPIC30F3013T-20E/SO
DSPIC30F5011T-20E/PTG	DSPIC30F5011T-20E/PTG
DSPIC30F2011T-20I/ML	DSPIC30F2011T-20I/ML
DSPIC30F2011T-20I/SO	DSPIC30F2011T-20I/SO
DSPIC30F3012T-20I/SO	DSPIC30F3012T-20I/SO
DSPIC30F3010T-20I/ML	DSPIC30F3010T-20I/ML
DSPIC30F4013T-20E/ML	DSPIC30F4013T-20E/ML
DSPIC30F4012T-20E/ML	DSPIC30F4012T-20E/ML
DSPIC30F4012T-20E/SO	DSPIC30F4012T-20E/SO
DSPIC30F3011T-30I/ML	DSPIC30F3011T-30I/ML
DSPIC30F3011T-20E/ML	DSPIC30F3011T-20E/ML
DSPIC30F3011T-20I/ML	DSPIC30F3011T-20I/ML
DSPIC30F3014T-20E/ML	DSPIC30F3014T-20E/ML
DSPIC30F3011T-20I/PT	DSPIC30F3011T-20I/PT
DSPIC30F3010T-20E/ML	DSPIC30F3010T-20E/ML
DSPIC30F2012T-20E/ML	DSPIC30F2012T-20E/ML
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DSPIC30F3012T-20I/ML	DSPIC30F3012T-20I/ML
DSPIC30F3012T-30I/SO	DSPIC30F3012T-30I/SO
DSPIC30F2012T-20I/SO	DSPIC30F2012T-20I/SO
DSPIC30F2011T-20E/ML	DSPIC30F2011T-20E/ML
DSPIC30F3012T-20E/SO	DSPIC30F3012T-20E/SO
DSPIC30F3010T-20E/SO	DSPIC30F3010T-20E/SO
DSPIC30F2011T-30I/ML	DSPIC30F2011T-30I/ML
DSPIC30F3012T-20E/ML	DSPIC30F3012T-20E/ML
DSPIC30F2012T-20E/SO	DSPIC30F2012T-20E/SO
DSPIC30F3013T-20I/SO	DSPIC30F3013T-20I/SO
DSPIC30F3012T-30I/ML	DSPIC30F3012T-30I/ML
DSPIC30F3010T-20I/SO	DSPIC30F3010T-20I/SO
DSPIC30F2012T-20I/ML	DSPIC30F2012T-20I/ML
DSPIC30F6011T-30I/PF	DSPIC30F6011T-30I/PF
DSPIC30F2010T-20I/SO	DSPIC30F2010T-20I/SO
DSPIC30F5013T-20I/PT	DSPIC30F5013T-20I/PT
DSPIC30F6011T-20I/PF	DSPIC30F6011T-20I/PF
DSPIC30F6010T-30I/PF	DSPIC30F6010T-30I/PF
DSPIC30F6010T-20I/PF	DSPIC30F6010T-20I/PF
DSPIC30F6014T-30I/PF	DSPIC30F6014T-30I/PF
DSPIC30F6014AT-20E/PT	DSPIC30F6014AT-20E/PT
DSPIC30F6014AT-20I/PT	DSPIC30F6014AT-20I/PT
DSPIC30F6015T-20I/PT	DSPIC30F6015T-20I/PT
DSPIC30F5016T-20I/PT	DSPIC30F5016T-20I/PT
DSPIC30F6015T-20E/PT	DSPIC30F6015T-20E/PT
DSPIC30F6013AT-30I/PT	DSPIC30F6013AT-30I/PT
DSPIC30F6013AT-20I/PT	DSPIC30F6013AT-20I/PT
DSPIC30F6013AT-20E/PT	DSPIC30F6013AT-20E/PT
DSPIC30F6010AT-20E/PT	DSPIC30F6010AT-20E/PT
DSPIC30F6011AT-20I/PT	DSPIC30F6011AT-20I/PT
DSPIC30F5016T-20E/PT	DSPIC30F5016T-20E/PT
DSPIC30F5015T-20I/PT	DSPIC30F5015T-20I/PT
DSPIC30F5015T-20E/PT	DSPIC30F5015T-20E/PT
DSPIC30F6011AT-20E/PT	DSPIC30F6011AT-20E/PT
DSPIC30F6010AT-20I/PT	DSPIC30F6010AT-20I/PT
DSPIC30F6014AT-20E/PF	DSPIC30F6014AT-20E/PF
DSPIC30F6013AT-20E/PF	DSPIC30F6013AT-20E/PF
DSPIC30F6012AT-30I/PF	DSPIC30F6012AT-30I/PF
DSPIC30F6011AT-30I/PF	DSPIC30F6011AT-30I/PF

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dsPIC30F dsPIC30F Flash Programming Specification OVERVIEW AND SCOPE This document defines the programming specification for the dsPIC30F family of Digital Signal Controllers DSCs . The programming specification is required only for the developers of third-party tools that are used to program dsPIC30F devices. Customers using dsPIC30F devices should use development tools that already provide support for device programming. This document includes programming specifications for the following devices: • dsPIC30F2010/2011/2012 • dsPIC30F3010/3011/3012/3013/ 3014 • dsPIC30F4011/4012/4013 • dsPIC30F5011/5013/5015/5016 • dsPIC30F6010/6011/6012/6013/6014/6015 • dsPIC30F6010A/6011A/6012A/6013A/6014A PROGRAMMING OVERVIEW OF THE dsPIC30F The dsPIC30F family of DSCs contains a region of onchip memory used to simplify device programming. This region of memory can store a programming executive, which allows the dsPIC30F to be programmed faster than the traditional means. Once the programming executive is stored to memory by an external programmer such as Microchip’s ICD 2, MPLAB PM3, PRO II, or MPLAB REAL ICE , it can then interact with the external programmer to efficiently program devices. The programmer and programming executive have a master-slave relationship, where the programmer is the master programming device and the programming executive is the slave, as illustrated in Figure FIGURE 2-1: OVERVIEW OF dsPIC30F PROGRAMMING Programmer Programming Executive On-chip Memory dsPIC30F Device Two different methods are used to program the chip in the user’s system. One method uses the Enhanced InCircuit Serial Programming Enhanced ICSP protocol and works with the programming executive. The other method uses In-Circuit Serial Programming ICSP protocol and does not use the programming executive. The Enhanced ICSP protocol uses the faster, highvoltage method that takes advantage of the programming executive. The programming executive provides all the necessary functionality to erase, program and verify the chip through a small command set. The command set allows the programmer to program the dsPIC30F without having to deal with the low-level programming protocols of the chip. The ICSP programming method does not use the programming executive. It provides native, low-level programming capability to erase, program and verify the chip. This method is significantly slower because it uses control codes to serially execute instructions on the dsPIC30F device. This specification describes the ICSP and Enhanced ICSP programming methods. Section “Programming Executive Application” describes the programming executive application and Section “Device Programming” describes its application programmer’s interface for the host programmer. Section “ICSP Mode” describes the ICSP programming method. Hardware Requirements In ICSP or Enhanced ICSP mode, the dsPIC30F requires two programmable power supplies one for VDD and one for MCLR. For Bulk Erase programming, which is required for erasing code protection bits, VDD must be greater than volts. Refer to Section “AC/DC Characteristics and Timing Requirements” for additional hardware parameters. 2010 Microchip Technology Inc. DS70102K-page 1 dsPIC30F Flash Programming Specification Pins Used During Programming The pins identified in Table 2-1 are used for device programming. Refer to the appropriate device data sheet for complete pin descriptions. TABLE 2-1 dsPIC30F PIN DESCRIPTIONS DURING PROGRAMMING Pin Name Pin Type Pin Description MCLR/VPP Programming Enable Power Supply Ground Serial Clock Serial Data Legend I = Input, O = Output, P = Power Program Memory Map The program memory space extends from 0x0 to Code storage is located at the base of the memory map and supports up to 144 Kbytes 48K instruction words . Code is stored in three, 48 Kbyte memory panels that reside on-chip. Table 2-2 shows the location and program memory size of each device. Locations through 0x8005BE are reserved for executive code memory. This region stores either the programming executive or debugging executive. The programming executive is used for device programming, while the debug executive is used for incircuit debugging. This region of memory cannot be used to store user code. Locations 0xF80000 through 0xF8000E are reserved for the Configuration registers. The bits in these registers may be set to select various device options, and are described in Section “Configuration Bits Programming”. Locations 0xFF0000 and 0xFF0002 are reserved for the Device ID registers. These bits can be used by the programmer to identify what device type is being programmed and are described in Section “Device ID”. The device ID reads out normally, even after code protection is applied.

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dsPIC30F
dsPIC30F Flash Programming Specification

OVERVIEW AND SCOPE

This document defines the programming specification for the dsPIC30F family of Digital Signal Controllers DSCs . The programming specification is required only for the developers of third-party tools that are used to program dsPIC30F devices. Customers using dsPIC30F devices should use development tools that already provide support for device programming.

This document includes programming specifications for the following devices:
• dsPIC30F2010/2011/2012
• dsPIC30F3010/3011/3012/3013/ 3014
• dsPIC30F4011/4012/4013
• dsPIC30F5011/5013/5015/5016
• dsPIC30F6010/6011/6012/6013/6014/6015
• dsPIC30F6010A/6011A/6012A/6013A/6014A

PROGRAMMING OVERVIEW OF THE dsPIC30F

The dsPIC30F family of DSCs contains a region of onchip memory used to simplify device programming. This region of memory can store a programming executive, which allows the dsPIC30F to be programmed faster than the traditional means. Once the programming executive is stored to memory by an external programmer such as Microchip’s ICD 2, MPLAB PM3, PRO II, or MPLAB REAL ICE , it can then interact with the external programmer to efficiently program devices.

The programmer and programming executive have a master-slave relationship, where the programmer is the master programming device and the programming executive is the slave, as illustrated in Figure

FIGURE 2-1:

OVERVIEW OF dsPIC30F PROGRAMMING

Programmer

Programming Executive

On-chip Memory
dsPIC30F Device

Two different methods are used to program the chip in the user’s system. One method uses the Enhanced InCircuit Serial Programming Enhanced ICSP protocol and works with the programming executive. The other method uses In-Circuit Serial Programming ICSP protocol and does not use the programming executive.

The Enhanced ICSP protocol uses the faster, highvoltage method that takes advantage of the programming executive. The programming executive provides all the necessary functionality to erase, program and verify the chip through a small command set. The command set allows the programmer to program the dsPIC30F without having to deal with the low-level programming protocols of the chip.

The ICSP programming method does not use the programming executive. It provides native, low-level programming capability to erase, program and verify the chip. This method is significantly slower because it uses control codes to serially execute instructions on the dsPIC30F device.

This specification describes the ICSP and Enhanced ICSP programming methods. Section “Programming Executive Application” describes the programming executive application and Section “Device Programming” describes its application programmer’s interface for the host programmer. Section “ICSP Mode” describes the ICSP programming method.

Hardware Requirements

In ICSP or Enhanced ICSP mode, the dsPIC30F requires two programmable power supplies one for VDD and one for MCLR. For Bulk Erase programming, which is required for erasing code protection bits, VDD must be greater than volts. Refer to Section “AC/DC Characteristics and Timing Requirements” for additional hardware parameters.
2010 Microchip Technology Inc.

DS70102K-page 1
dsPIC30F Flash Programming Specification

Pins Used During Programming

The pins identified in Table 2-1 are used for device programming. Refer to the appropriate device data sheet for complete pin descriptions.

TABLE 2-1 dsPIC30F PIN DESCRIPTIONS DURING PROGRAMMING

Pin Name Pin Type

Pin Description

MCLR/VPP

Programming Enable

Power Supply

Ground

Serial Clock

Serial Data

Legend I = Input, O = Output, P = Power

Program Memory Map

The program memory space extends from 0x0 to Code storage is located at the base of the memory map and supports up to 144 Kbytes 48K instruction words . Code is stored in three, 48 Kbyte memory panels that reside on-chip. Table 2-2 shows the location and program memory size of each device.

Locations through 0x8005BE are reserved for executive code memory. This region stores either the programming executive or debugging executive. The programming executive is used for device programming, while the debug executive is used for incircuit debugging. This region of memory cannot be used to store user code.

Locations 0xF80000 through 0xF8000E are reserved for the Configuration registers. The bits in these registers may be set to select various device options, and are described in Section “Configuration Bits Programming”.

Locations 0xFF0000 and 0xFF0002 are reserved for the Device ID registers. These bits can be used by the programmer to identify what device type is being programmed and are described in Section “Device ID”. The device ID reads out normally, even after code protection is applied.

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Datasheet ID: DSPIC30F6010AT-30I/PF 648099