T2526N038-6AQ

T2526N038-6AQ Datasheet


The IC T2526 is a complete IR receiver for data communication developed and optimized for use in carrier-frequency-modulated transmission applications. Its function can be described using the block diagram of Figure The input stage meets two main functions. First it provides a suitable bias voltage for the PIN diode. Secondly the pulsed photo-current signals are transformed into a voltage by a special circuit which is optimized for low noise applications. After amplification by a Controlled Gain Amplifier CGA the signals have to pass a tuned integrated narrow bandpass filter with a center frequency f0 which is equivalent to the choosen carrier frequency of the input signal The demodulator is used first to convert the input burst signal to a digital envelope output pulse and to evaluate the signal information quality, i.e., unwanted pulses will be suppressed at the output pin. All this is done by means of an integrated dynamic feedback circuit which varies the gain as a function of the present enviromental conditions ambient light, modulated lamps etc. . Other special features are used to adapt to the current application to secure best transmission quality. The T2526 operates in a supply-voltage range from V to V. By default, the T2526 is optimized for best performance within V to V.

Part Datasheet
T2526N038-6AQ T2526N038-6AQ T2526N038-6AQ (pdf)
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• No External Components Except PIN Diode
• Supply-voltage Range V to V
• Automatic Sensitivity Adaptation AGC
• Automatic Strong Signal Adaptation ATC
• Automatic Supply Voltage Adaptation
• Enhanced Immunity against Ambient Light Disturbances
• Available for Carrier Frequencies between 30 kHz to 76 kHz adjusted by Zener-Diode

Fusing
• TTL and CMOS Compatible
• Audio Video Applications
• Home Appliances
• Remote Control Equipment

Low-voltage IR Receiver ASSP

The IC T2526 is a complete IR receiver for data communication developed and optimized for use in carrier-frequency-modulated transmission applications. Its function can be described using the block diagram of Figure The input stage meets two main functions. First it provides a suitable bias voltage for the PIN diode. Secondly the pulsed photo-current signals are transformed into a voltage by a special circuit which is optimized for low noise applications. After amplification by a Controlled Gain Amplifier CGA the signals have to pass a tuned integrated narrow bandpass filter with a center frequency f0 which is equivalent to the choosen carrier frequency of the input signal The demodulator is used first to convert the input burst signal to a digital envelope output pulse and to evaluate the signal information quality, i.e., unwanted pulses will be suppressed at the output pin. All this is done by means of an integrated dynamic feedback circuit which varies the gain as a function of the present enviromental conditions ambient light, modulated lamps etc. . Other special features are used to adapt to the current application to secure best transmission quality. The T2526 operates in a supply-voltage range from V to V. By default, the T2526 is optimized for best performance within V to V.

Figure Block Diagram

T2526

IN Input

CGA and filter

Demodulator

OUT Microcontroller

Oscillator

Carrier frequency f0

T2526

Modulated IR signal min 6 or 10 pulses

AGC/ATC and digital control

Pin Configuration

Figure Pinning SO8 and TSSOP8

OUT 3

Pin Description

Function Supply voltage Not connected Data output Not connected Input PIN-diode Ground Not connected Not connected
8 NC 7 NC 6 GND 5 IN

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameter

Value

Unit

Supply voltage

Supply current

Input voltage
to VS

Input DC current at VS = 5 V

Output voltage
to VS

Output current

Operating temperature

Tamb
-25 to +85

Storage temperature

Tstg
-40 to +125
Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage

Electrical Characteristics, 3-V Operation Continued

Tamb = 25°C, VS = 3 V unless otherwise specified.

No. Parameters

Test Conditions

Pin Symbol Min. Typ. Max. Unit Type*
4 Controlled Amplifier and Filter

Maximum value of variable gain CGA

GVARMAX

Minimum value of variable gain CGA

GVARMIN

Total internal amplification 3

GMAX

Center frequency fusing accuracy of bandpass

VS = 3 V, Tamb = 25°C
f03V_FUSE

Overall accuracy center frequency of bandpass
f03V

Overall accuracy center frequency of bandpass

Tamb = 0 to 70°C
f03V

BPF bandwidth
-3 dB f0 = 38 kHz;

See Figure 9 on page 8
* Type means A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage

Electrical Characteristics, 5-V Operation

Tamb = 25°C, VS = 5 V unless otherwise specified.

No. Parameters

Test Conditions

Pin Symbol Min. Typ. Max. Unit Type*
5 Supply

Supply-voltage range Supply current 6 Output

IIN =0

Internal pull-up resistor 1 Tamb = 25°C

See Figure 12 on page 9
30/40

Output voltage low

R2 = kW

See Figure 12 on page 9

Output voltage high

Output current clamping

R2 = 0 See Figure 12 on page 9

IOCL
7 Input

Input DC current

VIN = 0 See Figure 12 on page 9

IIN_DCMAX
-400

Input DC-current See Figure 6 on page 7

VIN = 0 Vs = 5 V Tamb = 25°C

IIN_DCMAX
-700
* Type means A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage
4 T2526

T2526

Electrical Characteristics, 5-V Operation Continued

Tamb = 25°C, VS = 5 V unless otherwise specified.

No. Parameters

Test Conditions

Pin Symbol Min. Typ. Max. Unit Type*

Min. detection threshold Test signal:
current

See Figure 11 on page 9

See Figure 4 on page 6 VS = 5 V

Tamb = 25°C

Min. detection threshold current with AC current

IIN_DC = 1µA square pp
disturbance IIN_AC100 = burst N = 16
3 µA at 100 Hz
f = f0 tPER = 10 ms

Figure 10 on page 8

BER = 50 2

IEemin
-890 -2500

Test signal:

See Figure 11 on page 9

VS = 5 V, Tamb = 25°C

Max. detection threshold current with VIN > 0V

IIN_DC = 1µA square pp
burst N = 16
f = f0 tPER = 10 ms Figure 10 on page 8 BER = 5% 2

IEemax
-500
8 Controlled Amplifier and Filter

Maximum value of variable gain CGA

GVARMAX

Minimum value of variable gain CGA

GVARMIN

Total internal amplification 3

GMAX

Resulting center frequency fusing
accuracy
f0 fused at VS = 3 V VS = 5 V, Tamb = 25°C
Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage

All pins Þ 2000V HBM 200V MM, MIL-STD-883C, Method

Reliability

Electrical qualification 1000h in molded SO8 plastic package

Typical Electrical Curves at Tamb = 25°C

Figure IEemin versus IIN_DC , VS = 3 V

VS = 3 V f = f0

I Eemin nA

I IN_DC µA

Figure IEemin versus IIN_DC , VS = 5 V

VS = 5 V f = f0

I Eemin nA
6 T2526

I IN_DC µA

Figure VIN versus IIN_DC, VS = 3 V

V IN V

VS = 3 V f = f0

I IN_DC µA

T2526

Figure VIN versus IIN_DC, VS = 5 V

V IN V

VS = 5 V
f = f0

I IN_DC µA

Figure Data Transmission Rate, VS = 3 V

Bits/s
5000
4500 4000

VS = 3 V
3500
3000
2500
2000
1500
1000
f 0 kHz

Short burst Standard type Lamp type

Figure Data Transmission Rate, VS = 5 V

Bits/s
5000
4500 4000
Ordering Information

Delivery unsawn wafers DDW in box, SO8 150 mil and TSSOP8 3 mm body .

Extended Type Number

T2526N0xx 1 -yyy 5

T2526N1xx 1 -DDW

PL 2 1

RPU 3 30

D 4 2179

Type Standard type 10 pulses, enhanced sensibility, high data rate

T2526N2xx 1 -yyy 5
1404 Lamp type 10 pulses, enhanced suppression of disturbances, secure

T2526N3xx 1 -DDW
1404 data transmission

T2526N6xx 1 -yyy 5
3415

Short burst type 6 pulses, enhanced data rate

T2526N7xx 1 -DDW
3415
xx means the used carrier frequency value f0 30, 33, 36, 38, 40, 44 or 56 kHz 76 kHz type on request Two pad layout versions see Figure 14 and Figure 15 available for different assembly demand Integrated pull-up resistor at pin OUT see electrical characteristics Typical data transmission rate up to bit/s with f0 = 56 kHz, VS = 5 V see Figure 10 on page 8 yyy means kind of packaging:
.......DDW -> unsawn wafers in box
.......6AQ -> only on request, TSSOP8 taped and reeled

Pad Layout

Figure Pad Layout 1 DDW only

T2526

FUSING

Figure Pad Layout 2 DDW, SO8 or TSSOP8
6 GND 5 IN

T2526
3 OUT

FUSING

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Atmel Operations

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Datasheet ID: T2526N038-6AQ 519392