The IC T2526 is a complete IR receiver for data communication developed and optimized for use in carrier-frequency-modulated transmission applications. Its function can be described using the block diagram of Figure The input stage meets two main functions. First it provides a suitable bias voltage for the PIN diode. Secondly the pulsed photo-current signals are transformed into a voltage by a special circuit which is optimized for low noise applications. After amplification by a Controlled Gain Amplifier CGA the signals have to pass a tuned integrated narrow bandpass filter with a center frequency f0 which is equivalent to the choosen carrier frequency of the input signal The demodulator is used first to convert the input burst signal to a digital envelope output pulse and to evaluate the signal information quality, i.e., unwanted pulses will be suppressed at the output pin. All this is done by means of an integrated dynamic feedback circuit which varies the gain as a function of the present enviromental conditions ambient light, modulated lamps etc. . Other special features are used to adapt to the current application to secure best transmission quality. The T2526 operates in a supply-voltage range from V to V. By default, the T2526 is optimized for best performance within V to V.
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• No External Components Except PIN Diode • Supply-voltage Range V to V • Automatic Sensitivity Adaptation AGC • Automatic Strong Signal Adaptation ATC • Automatic Supply Voltage Adaptation • Enhanced Immunity against Ambient Light Disturbances • Available for Carrier Frequencies between 30 kHz to 76 kHz adjusted by Zener-Diode Fusing • TTL and CMOS Compatible • Audio Video Applications • Home Appliances • Remote Control Equipment Low-voltage IR Receiver ASSP The IC T2526 is a complete IR receiver for data communication developed and optimized for use in carrier-frequency-modulated transmission applications. Its function can be described using the block diagram of Figure The input stage meets two main functions. First it provides a suitable bias voltage for the PIN diode. Secondly the pulsed photo-current signals are transformed into a voltage by a special circuit which is optimized for low noise applications. After amplification by a Controlled Gain Amplifier CGA the signals have to pass a tuned integrated narrow bandpass filter with a center frequency f0 which is equivalent to the choosen carrier frequency of the input signal The demodulator is used first to convert the input burst signal to a digital envelope output pulse and to evaluate the signal information quality, i.e., unwanted pulses will be suppressed at the output pin. All this is done by means of an integrated dynamic feedback circuit which varies the gain as a function of the present enviromental conditions ambient light, modulated lamps etc. . Other special features are used to adapt to the current application to secure best transmission quality. The T2526 operates in a supply-voltage range from V to V. By default, the T2526 is optimized for best performance within V to V. Figure Block Diagram T2526 IN Input CGA and filter Demodulator OUT Microcontroller Oscillator Carrier frequency f0 T2526 Modulated IR signal min 6 or 10 pulses AGC/ATC and digital control Pin Configuration Figure Pinning SO8 and TSSOP8 OUT 3 Pin Description Function Supply voltage Not connected Data output Not connected Input PIN-diode Ground Not connected Not connected 8 NC 7 NC 6 GND 5 IN Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Value Unit Supply voltage Supply current Input voltage to VS Input DC current at VS = 5 V Output voltage to VS Output current Operating temperature Tamb -25 to +85 Storage temperature Tstg -40 to +125 Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage Electrical Characteristics, 3-V Operation Continued Tamb = 25°C, VS = 3 V unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 4 Controlled Amplifier and Filter Maximum value of variable gain CGA GVARMAX Minimum value of variable gain CGA GVARMIN Total internal amplification 3 GMAX Center frequency fusing accuracy of bandpass VS = 3 V, Tamb = 25°C f03V_FUSE Overall accuracy center frequency of bandpass f03V Overall accuracy center frequency of bandpass Tamb = 0 to 70°C f03V BPF bandwidth -3 dB f0 = 38 kHz; See Figure 9 on page 8 * Type means A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage Electrical Characteristics, 5-V Operation Tamb = 25°C, VS = 5 V unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 5 Supply Supply-voltage range Supply current 6 Output IIN =0 Internal pull-up resistor 1 Tamb = 25°C See Figure 12 on page 9 30/40 Output voltage low R2 = kW See Figure 12 on page 9 Output voltage high Output current clamping R2 = 0 See Figure 12 on page 9 IOCL 7 Input Input DC current VIN = 0 See Figure 12 on page 9 IIN_DCMAX -400 Input DC-current See Figure 6 on page 7 VIN = 0 Vs = 5 V Tamb = 25°C IIN_DCMAX -700 * Type means A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage 4 T2526 T2526 Electrical Characteristics, 5-V Operation Continued Tamb = 25°C, VS = 5 V unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Min. detection threshold Test signal: current See Figure 11 on page 9 See Figure 4 on page 6 VS = 5 V Tamb = 25°C Min. detection threshold current with AC current IIN_DC = 1µA square pp disturbance IIN_AC100 = burst N = 16 3 µA at 100 Hz f = f0 tPER = 10 ms Figure 10 on page 8 BER = 50 2 IEemin -890 -2500 Test signal: See Figure 11 on page 9 VS = 5 V, Tamb = 25°C Max. detection threshold current with VIN > 0V IIN_DC = 1µA square pp burst N = 16 f = f0 tPER = 10 ms Figure 10 on page 8 BER = 5% 2 IEemax -500 8 Controlled Amplifier and Filter Maximum value of variable gain CGA GVARMAX Minimum value of variable gain CGA GVARMIN Total internal amplification 3 GMAX Resulting center frequency fusing accuracy f0 fused at VS = 3 V VS = 5 V, Tamb = 25°C Notes Depending on version, see “Ordering Information” BER = bit error rate e.g., BER = 5% means that with P = 20 at the input pin pulses can appear at the pin OUT After transformation of input current into voltage All pins Þ 2000V HBM 200V MM, MIL-STD-883C, Method Reliability Electrical qualification 1000h in molded SO8 plastic package Typical Electrical Curves at Tamb = 25°C Figure IEemin versus IIN_DC , VS = 3 V VS = 3 V f = f0 I Eemin nA I IN_DC µA Figure IEemin versus IIN_DC , VS = 5 V VS = 5 V f = f0 I Eemin nA 6 T2526 I IN_DC µA Figure VIN versus IIN_DC, VS = 3 V V IN V VS = 3 V f = f0 I IN_DC µA T2526 Figure VIN versus IIN_DC, VS = 5 V V IN V VS = 5 V f = f0 I IN_DC µA Figure Data Transmission Rate, VS = 3 V Bits/s 5000 4500 4000 VS = 3 V 3500 3000 2500 2000 1500 1000 f 0 kHz Short burst Standard type Lamp type Figure Data Transmission Rate, VS = 5 V Bits/s 5000 4500 4000 Ordering Information Delivery unsawn wafers DDW in box, SO8 150 mil and TSSOP8 3 mm body . Extended Type Number T2526N0xx 1 -yyy 5 T2526N1xx 1 -DDW PL 2 1 RPU 3 30 D 4 2179 Type Standard type 10 pulses, enhanced sensibility, high data rate T2526N2xx 1 -yyy 5 1404 Lamp type 10 pulses, enhanced suppression of disturbances, secure T2526N3xx 1 -DDW 1404 data transmission T2526N6xx 1 -yyy 5 3415 Short burst type 6 pulses, enhanced data rate T2526N7xx 1 -DDW 3415 xx means the used carrier frequency value f0 30, 33, 36, 38, 40, 44 or 56 kHz 76 kHz type on request Two pad layout versions see Figure 14 and Figure 15 available for different assembly demand Integrated pull-up resistor at pin OUT see electrical characteristics Typical data transmission rate up to bit/s with f0 = 56 kHz, VS = 5 V see Figure 10 on page 8 yyy means kind of packaging: .......DDW -> unsawn wafers in box .......6AQ -> only on request, TSSOP8 taped and reeled Pad Layout Figure Pad Layout 1 DDW only T2526 FUSING Figure Pad Layout 2 DDW, SO8 or TSSOP8 6 GND 5 IN T2526 3 OUT FUSING Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel 41 26-426-5555 Fax 41 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel 852 2721-9778 Fax 852 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel 81 3-3523-3551 Fax 81 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel 33 2-40-18-18-18 Fax 33 2-40-18-19-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel 33 4-42-53-60-00 Fax 33 4-42-53-60-01 |
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