ATA556711N-DDT

ATA556711N-DDT Datasheet


• Contactless Read/Write Data Transmission<br>• Radio Frequency fRF from 100 kHz to 150 kHz<br>• e5550, e5551, T5557 Binary Compatible<br>• Extended Mode<br>• Small Size, Configurable for ISO/IEC 11784/785 Compatibility<br>• 75 pF On-chip Resonant Capacitor Mask Option<br>• 7 x 32-bit EEPROM Data Memory Including 32-bit Password<br>• Separate 64-bit Memory for Traceability Data<br>• 32-bit Configuration Register in EEPROM to Setup:

Part Datasheet
ATA556711N-DDT ATA556711N-DDT ATA556711N-DDT (pdf)
Related Parts Information
ATA556714N-DDT ATA556714N-DDT ATA556714N-DDT
ATA556711-TASY ATA556711-TASY ATA556711-TASY
ATA556714N-DDB ATA556714N-DDB ATA556714N-DDB
ATA556715-PAE ATA556715-PAE ATA556715-PAE
ATA556711N-DDT 1 ATA556711N-DDT 1 ATA556711N-DDT 1
PDF Datasheet Preview
• Contactless Read/Write Data Transmission
• Radio Frequency fRF from 100 kHz to 150 kHz
• e5550, e5551, T5557 Binary Compatible
• Extended Mode
• Small Size, Configurable for ISO/IEC 11784/785 Compatibility
• 75 pF On-chip Resonant Capacitor Mask Option
• 7 x 32-bit EEPROM Data Memory Including 32-bit Password
• Separate 64-bit Memory for Traceability Data
• 32-bit Configuration Register in EEPROM to Setup:

Data Rate
• RF/2 to RF/128, Binary Selectable, or
• Fixed e5550 Data Rates

Modulation/Coding
• FSK, PSK, Manchester, Bi-phase, NRZ

Other Options
• Password Mode
• Max Block Feature
• Answer-On-Request AOR Mode
• Inverse Data Output
• Direct Access Mode
• Sequence Terminator s
• Write Protection Through Lock-bit per Block
• Fast Write Method 5 Kbps versus 2 Kbps
• OTP Functionality
• POR Delay up to 67 ms

Multifunctional 330-bit Read/Write RF Identification IC

ATA5567

The ATA5567 is a contactless R/W IDentification IC for applications in the 125-kHz frequency range. A single coil, connected to the chip, serves as the IC’s power supply and bi-directional communication interface. The antenna and chip together form a transponder or tag.

The on-chip 330-bit EEPROM 10 blocks, 33 bits each can be read and written blockwise from a reader. Block 0 is reserved for setting the operation modes of the ATA5567 tag. Block 7 may contain a password to prevent unauthorized writing.

Data is transmitted from the IDIC using load modulation. This is achieved by damping the RF field with a resistive load between the two terminals Coil 1 and Coil The IC receives and decodes 100% amplitude-modulated OOK pulse-interval-encoded bit streams from the base station or reader.

System Block Diagram

Figure RFID System Using ATA5567 Tag

Reader or

Base station

Power

Data

Transponder Memory

Coil interface Controller
1 Mask option

ATA5567

ATA5567 Building Blocks

Figure Block Diagram

Modulation

Coil 1

Coil 2

Analog front end

Write decoder

Mode register Controller

Memory 330-bit EEPROM

Input register

Bit-rate generator

Test logic

HV generator
1 Mask option

Analog Front End AFE

The AFE includes all circuits which are directly connected to the coil. It generates the IC’s power supply and handles the bi-directional data communication with the reader. It consists of the following blocks:
• Rectifier to generate a DC supply voltage from the AC coil voltage
• Clock extractor
• Switchable load between Coil 1 and Coil 2 for data transmission from the tag to the reader
• Field gap detector for data transmission from the base station to the tag
• ESD protection circuitry
2 ATA5567

ATA5567

Data-rate Generator

The data rate is binary programmable to operate at any data rate between RF/2 and RF/128 or equal to any of the fixed e5550/e5551 and T5554 bit rates RF/8, RF/16, RF/32, RF/40, RF/50, RF/64, RF/100, and RF/128 .

Write Decoder
Ordering Information 1

ATA5567
a b - x Package
- DDW
- Die on wafer, 6” unsawn wafer, thickness 300 µm on request
- DDT 1 - Die in tray waffle pack , thickness 300 µm
- DDB
- Die on foil, 6” sawn wafer with ring, thickness 150 µm
- 2 pads without on-chip capacitor
- 4 pads with on-chip 75 pF capacitor
- 2 pads without capacitor, damping during initialization

Note For available order codes, contact your local Atmel Sales/Marketing office.

Drawing

Figure 10-3 on page 30 Figure 10-1 on page 28 Figure 10-2 on page 29 Figure 10-1 on page 28

ATA556711
- x Package
- TASY
- SO8 package lead-free

Drawing Figure 10-7 on page 34

ATA556715
- x Package
- PAE
- NOA3 micromodule lead-free

Drawing

Figure 10-5 on page 32 and Figure 10-6 on page 33
Ordering Examples

ATA556714N-DDB Tested die on sawn 6” wafer on foil with ring, thickness 150 µm, 75 pF on-chip capacitor, no damping during POR initialization especially for ISO 11784/785 and access control applications

Available Order Codes

ATA556711N-DDT 1 ATA556711N-DDB ATA556714N-DDB ATA556715-PAE ATA556711-TASY

New order codes will be created by customer request if order quantities are over 250k pieces.
94 934 125 72

Package Information

Figure 2-pad Layout

Dimensions in µm
124 994

ATA5567
87 125
28 ATA5567

Figure 4-pad Layout

Dimensions in µm
94 60 82

ATA5567
934 100 92
107 100

ATA5567

Figure 6” Sawn Wafer with Ring, Thickness 150 µm
30 ATA5567

Figure Wafer Map

ATA5567

Die x Step x N 14 x 7, Frame Step x > Shift-ASML = 15539 dice, 87 shots 11 columns x 9 rows > Shift-CANON/ALARM/SEM = W2 = W1 =

Failed Die Identification

Every die on the wafer not passing Atmel’s test sequence is marked with ink. The ink dot specification:
• Dot size 200 µm
• Position center of die
• Color black

Figure NOA3 Micromodule
technical drawings according to DIN specifications

Dimensions in mm

Note Reject hole by testing device Punching cutline
recommendation for singulation Total package thickness
exclusive punching burr Module dimension
after electrical disconnection

X X5:1

Note 2

Note 1

Note 3

R1.5±0.03

R0.2 max.
• Section “Traceability Data Structure” on page 5 changed
• Section 6 “ATA5567 in Extended Mode X-mode on page 15 changed
• Section 9 “Ordering Information” on page 27 changed
4874E-RFID-10/07
• Put datasheet in a new template
• Section 9 “Ordering Information” on page 27 changed
• Old Figure 10-3 “Solder Bump on NiAu” replaced with new Figure 10-3
“6” Sawn Wafer with Ring, Thickness 150 µm”

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More datasheets: DG-TS-ESS-RF-5 | FSDH0265RN | FSDH0265RL | FSDH0265RLX | ACW017 | ATA556714N-DDT | ATA556711-TASY | ATA556714N-DDB | ATA556715-PAE | ATA556711N-DDT 1


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Datasheet ID: ATA556711N-DDT 519175