AT97SC3204T-U1A80

AT97SC3204T-U1A80 Datasheet

The AT97SC3204 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version of the Trusted Computing Group TCG specification for Trusted Platform Modules TPM . The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1 accelerator is 20µs per 64-byte block. The chip communicates with the PC through the LPC interface. The TPM supports SIRQ for interrupts and CLKRUN to permit clock stopping for power savings in mobile computers.

Part	Datasheet
AT97SC3204T-U1A80	AT97SC3204T-U1A80 (pdf)

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AT97SC3204-X1A191	AT97SC3204-X1A191
AT97SC3204-X1A50	AT97SC3204-X1A50
AT97SC3204-DX2A12-10	AT97SC3204-DX2A12-10
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PDF Datasheet Preview
• Full Trusted Computing Group TCG Trusted Platform Module TPM Version Compatibility • Compliant with TCG PC Client Specific TPM Interface Specification Version • Single-chip Turnkey Solution • Hardware Asymmetric Crypto Engine • 2048-bit Sign in 200ms • RISC Microprocessor • Internal EEPROM Storage for RSA Keys • 33MHz LPC Low Pin Count Bus for Easy PC Interface • Secure Hardware and Firmware Design and Chip Layout • True Random Number Generator RNG FIPS 140-2 Compliant • NV Storage space for 1280-bytes of user defined data • 3.3V Supply Voltage • 28-lead Thin TSSOP, Wide TSSOP or 40-lead QFN Packages • Offered in both Commercial 0 to 70°C and Industrial -40 to +85°C Temperature Ranges The AT97SC3204 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version of the Trusted Computing Group TCG specification for Trusted Platform Modules TPM . The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1 accelerator is 20µs per 64-byte block. The chip communicates with the PC through the LPC interface. The TPM supports SIRQ for interrupts and CLKRUN to permit clock stopping for power savings in mobile computers. Trusted Platform Module Atmel AT97SC3204 LPC Interface * See the full data sheet for detailed design information Note This is a summary document. A complete document is available under NDA. For more information, please contact your local Atmel sales office. Table Pin Configurations Pin Name Function VCC SB3V 3.3V Supply Voltage Standby 3.3V Supply Voltage Ground LRESET# PCI Reset Input Active Low LAD0 LPC Command, Address, Data Line Input/Output LAD1 LPC Command, Address, Data Line Input/Output LAD2 LPC Command, Address, Data Line Input/Output LAD3 LPC Command, Address, Data Line Input/Output LCLK 33MHz PCI Clock Input LFRAME# LPC FRAME Input CLKRUN# PCI Clock Run Input/Output LPCPD# LPC Power Down Input SERIQ Serialized Interrupt Request Input/Output GPIO6 General Purpose Input/Output TestI Test Input disabled TestBI Test Input disabled Ordering Information Table Atmel AT24C256C Ordering Information Atmel Ordering Code AT97SC3204 1 AT97SC3204 1 AT97SC3204 1 Package 28A2 28-pin Thin TSSOP 28A3 28-pin TSSOP 40ML1 40-pin QFN 2 Lead-free, RoHS Lead-free, RoHS Lead-free, RoHS Operating Range Commercial 0°C to 70°C Industrial -40°C to 85°C Commercial 0°C to 70°C Industrial -40°C to 85°C Commercial 0°C to 70°C Industrial -40°C to 85°C Notes Please see the Atmel AT97SC3204 datasheet addendum for the complete catalog number ordering code Package Drawing 28A2 Thin TSSOP L L1 E E1 Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm in per side. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed .25mm in per side. Dimension 'b' does not include Dambar protrusion. Allowable Dambar protrusion shall be mm total in excess of the 'b' dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is mm. Dimension 'D' and 'E1' to be determined at Datum Plane H. SYMBOL D E E1 A A2 b e L L1 COMMON DIMENSIONS Unit of Measure = mm MIN NOM MAX NOTE 1,4 2,4 This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AE for additional information. TITLE Package Drawing Contact 28A2, 28-lead, 4.4x9.7 mm Body, pitch, Thin Shrink Small Outline Package TSSOP GPC TFL 28A2 6 Atmel AT24C256C 28A3 TSSOP Atmel AT24C256C e Top View Side View End View COMMON DIMENSIONS Unit of Measure = mm SYMBOL D E E1 A A2 b e L L1 NOM BSC NOTE 2, 5 3, 5 Note: This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed mm in per side. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed mm in per side. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is mm. Dimension D and E1 to be determined at Datum Plane H. 1/8/02 2325 Orchard Parkway R San Jose, CA 95131 TITLE 28A3, 28-lead, x mm Body, pitch, Thin Shrink Small Outline Package TSSOP 28A3

PDF Datasheet Preview

• Full Trusted Computing Group TCG Trusted Platform Module TPM Version Compatibility
• Compliant with TCG PC Client Specific TPM Interface Specification Version
• Single-chip Turnkey Solution
• Hardware Asymmetric Crypto Engine
• 2048-bit Sign in 200ms
• RISC Microprocessor
• Internal EEPROM Storage for RSA Keys
• 33MHz LPC Low Pin Count Bus for Easy PC Interface
• Secure Hardware and Firmware Design and Chip Layout
• True Random Number Generator RNG FIPS 140-2 Compliant
• NV Storage space for 1280-bytes of user defined data
• 3.3V Supply Voltage
• 28-lead Thin TSSOP, Wide TSSOP or 40-lead QFN Packages
• Offered in both Commercial 0 to 70°C and Industrial -40 to +85°C

Temperature Ranges

The AT97SC3204 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version of the Trusted Computing Group TCG specification for Trusted Platform Modules TPM . The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1 accelerator is 20µs per 64-byte block. The chip communicates with the PC through the LPC interface. The TPM supports SIRQ for interrupts and CLKRUN to permit clock stopping for power savings in mobile computers.

Trusted Platform Module

Atmel AT97SC3204 LPC Interface
* See the full data sheet for detailed design information

Note This is a summary document. A complete document is available under NDA. For more information, please contact your local Atmel sales office.

Table Pin Configurations

Pin Name

Function

VCC SB3V
3.3V Supply Voltage Standby 3.3V Supply Voltage

Ground

LRESET#

PCI Reset Input Active Low

LAD0

LPC Command, Address, Data Line Input/Output

LAD1

LPC Command, Address, Data Line Input/Output

LAD2

LPC Command, Address, Data Line Input/Output

LAD3

LPC Command, Address, Data Line Input/Output

LCLK
33MHz PCI Clock Input

LFRAME#

LPC FRAME Input

CLKRUN#

PCI Clock Run Input/Output

LPCPD#

LPC Power Down Input

SERIQ

Serialized Interrupt Request Input/Output

GPIO6

General Purpose Input/Output

TestI

Test Input disabled

TestBI

Test Input disabled
Ordering Information
Table Atmel AT24C256C Ordering Information
Atmel Ordering Code AT97SC3204 1

AT97SC3204 1

AT97SC3204 1

Package 28A2 28-pin Thin TSSOP
28A3 28-pin TSSOP 40ML1 40-pin QFN 2

Lead-free, RoHS Lead-free, RoHS Lead-free, RoHS

Operating Range

Commercial 0°C to 70°C Industrial -40°C to 85°C

Commercial 0°C to 70°C Industrial -40°C to 85°C

Commercial 0°C to 70°C Industrial -40°C to 85°C
Notes Please see the Atmel AT97SC3204 datasheet addendum for the complete catalog number ordering code

Package Drawing
28A2 Thin TSSOP

L L1 E E1

Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm in per side.

Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed .25mm in per side.

Dimension 'b' does not include Dambar protrusion. Allowable Dambar protrusion shall be mm total in excess of the 'b' dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is mm.

Dimension 'D' and 'E1' to be determined at Datum Plane H.

SYMBOL D E E1 A A2 b e L L1

COMMON DIMENSIONS Unit of Measure = mm

MIN NOM MAX

NOTE 1,4 2,4

This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AE for additional information.

TITLE Package Drawing Contact 28A2, 28-lead, 4.4x9.7 mm Body, pitch, Thin Shrink Small Outline Package TSSOP

GPC TFL
28A2
6 Atmel AT24C256C
28A3 TSSOP

Atmel AT24C256C
e Top View

Side View

End View

COMMON DIMENSIONS Unit of Measure = mm

SYMBOL D E E1 A A2 b e L L1

NOM BSC

NOTE 2, 5 3, 5

Note:

This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional
information.

Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed mm in per side.

Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
mm in per side.

Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be mm total in excess of
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is mm.

Dimension D and E1 to be determined at Datum Plane H.
1/8/02
2325 Orchard Parkway R San Jose, CA 95131

TITLE 28A3, 28-lead, x mm Body, pitch, Thin Shrink Small Outline Package TSSOP
28A3

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Datasheet ID: AT97SC3204T-U1A80 519154