Atmel AT88SC0808CA
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This is a summary document. The complete document is available on the Atmel website at Atmel AT88SC0808CA Atmel CryptoMemory SUMMARY DATASHEET • One of a family of devices with user memories from 1Kbit to 8Kbits • 8Kbit 1Kbyte EEPROM user memory • Eight 1Kbit 128-byte zones • Self-timed write cycle • Single byte or 16-byte page write mode • Programmable access rights for each zone • 2Kbit configuration zone • 37-byte OTP One-Time Programmable area for user-defined codes • 160-byte area for user-defined keys and passwords • High security features • 64-bit mutual authentication protocol under license of ELVA • Cryptographic Message Authentication Codes MAC • Stream encryption • Four key sets for authentication and encryption • Eight sets of two 24-bit passwords • Anti-tearing function • Voltage and frequency monitors • Smart card features • ISO 7816 Class B 3V operation • ISO 7816-3 asynchronous T=0 Protocol Patent * • Multiple zones, key sets and passwords for multi-application use • Synchronous two-wire serial interface for faster device initialization * • Programmable 8-byte answer-to-reset register ATR • ISO 7816-2 compliant modules • Embedded application features • Low voltage supply 2.7V 3.6V • Secure nonvolatile storage for sensitive system or user information • Two-wire serial interface TWI, 5V compatible • 1.0MHz compatibility for fast operation • Standard 8-lead plastic packages, green compliant exceeds RoHS • Same pin configuration as AT24CXXX Serial EEPROM in SOIC and PDIP packages • High reliability • Endurance 100,000 cycles • Data retention 10 years • ESD protection 2,000V min * Note Modules available with either T=0 / 2-wire modes or 2-wire mode only 5204FS−CRYPTO−12/11 Table Pin Assignments Pad VCC GND SCL/CLK SDA/IO RST Description Supply Voltage Ground Serial Clock Input Serial Data Input/Output Reset Input ISO Module C1 C5 C3 C7 C2 TWI Module C1 C5 C3 C7 NC “SOIC, PDIP” 8 4 6 5 NC TSSOP 8 1 6 3 NC Mini-MAP 4 5 2 7 NC Figure Pin Configuration ISO Smart Card Module V CC =C1 RST=C2 SCL/CLK=C3 NC=C4 C5=GND C6=NC C7=SDA/IO C8=NC GND 1 NC 2 SDA 3 NC 4 8-lead TSSOP 6 CLK TWI Smart Card Module V CC =C1 NC=C2 SCL/CLK=C3 NC=C4 C5=GND C6=NC C7=SDA/IO C8=NC 8-lead SOIC, PDIP NC 1 NC 2 NC 3 GND 4 6 SCL Ordering Information Atmel Ordering Code AT88SC0808CA-MJ AT88SC0808CA-MP AT88SC0808CA-MJTG AT88SC0808CA-MPTG AT88SC0808CA-PU AT88SC0808CA-SH AT88SC0808CA-TH AT88SC0808CA-Y6H-T AT88SC0808CA-WI Package M2 J Module- ISO M2 P Module- ISO M2 J Module -TWI M2 P Module -TWI 8P3 8S1 8A2 8Y6 7 mil wafer Voltage Range Temperature Range Commercial 0°C to 70°C Green compliant exceeds RoHS / Industrial −40°C to 85°C Industrial −40°C to 85°C Package Type 1 2 M2 J Module ISO or TWI M2 ISO 7816 smart card module M2 P Module ISO or TWI M2 ISO 7816 smart card module with logo 8-lead, wide, Plastic Dual Inline PDIP 8-lead, wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline TSSOP 8MA2 8-lead, x 3.0mm body, 0.50mm pitch, Ultra Thin Mini-Map, Dual No Lead DFN , MLP 2x3 Note Formal drawings may be obtained from an Atmel sales office Both the J and P module packages are used for either ISO T=0 / 2-wire mode or TWI 2-wire mode only Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 Package Information Ordering Code MJ or MJTG Module Size Dimension* Glob Top Thickness Pitch: M2 x [mm] Round - [mm] [mm] 14.25mm Ordering Code MP or MPTG Module Size Dimension* Glob Top Thickness Pitch: M2 x [mm] Square - x [mm] [mm] 14.25mm Note: *The module dimensions listed refer to the dimensions of the exposed metal contact area. The actual dimensions of the module after excise or punching from the carrier tape are generally 0.4mm greater in both directions i.e., a punched M2 module will yield x 11.8mm . Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 Ordering Code SH 8S1 8-lead SOIC TOP VIEW SIDE VIEW Notes This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. END VIEW COMMON DIMENSIONS Unit of Measure = mm SYMBOL MIN NOTE Package Drawing Contact 8S1, 8-lead Wide Body , Plastic Gull Wing Small Outline JEDEC SOIC 6/22/11 Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 Ordering Code PU 8P3 8-lead PDIP Top View End View 4 PLCS Side View COMMON DIMENSIONS Unit of Measure = inches SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L MIN NOM MAX NOTE 2 This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm . Package Drawing Contact: 8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 Ordering Code TH 8X 8-lead TSSOP Pin 1 this corner Top View End View Side View This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm 0.006in per side. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm 0.010in per side. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. Dimension D and E1 to be determined at Datum Plane H. SYMBOL A A1 A2 D E E1 b e L L1 C COMMON DIMENSIONS Unit of Measure = mm MIN - NOM - NOTE 2, 5 3, 5 Package Drawing Contact 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package TSSOP Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 Ordering Code Y6H-T 8MA2 8-lead Ultra Thin Mini-Map 1 Pin 1 ID A2 A1 b 8x 8 7 6 5 E2 Pin#1 L 8x D2 3 4 K SYMBOL D E D2 E2 A A1 A2 C L e b K COMMON DIMENSIONS Unit of Measure = mm MIN NOM MAX NOTE 3 Package Drawing Contact: TITLE 8MA2, 8-pad, 2 x 3 x mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package UDFN GPC YNZ 8MA2 Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 5204ES 5204DS 5204CS 5204BS 5204AS Date 12/2011 07/2009 07/2009 05/2009 02/2009 07/2008 Comments Update Template Update package drawings and - Replace 8A2 with 8X - Replace 8Y6 with 8MA2 Change AT88SC0808CA-SU to AT88SC0808CA-SH Minor edits and TWI module update Minor updates to package drawing information and ordering information. Added Mini-MAP column to Table 1-1 and Mini-MAP pin-out drawing. Connection Diagram inserted DC Characteristics table updated. Initial document release. Atmel AT88SC0808CA [Summary DATASHEET] 5204FS−CRYPTO−12/11 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel +1 408 441-0311 Fax +1 408 487-2600 Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel +852 2245-6100 Fax +852 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel +49 89-31970-0 Fax +49 89-3194621 Atmel Japan G.K. 16F Shin-Osaki Kangyo Bldg. 1-6-4 Osaki, Shinagawa-ku Tokyo 141-0032 JAPAN Tel +81 3 6417-0300 Fax +81 3 6417-0370 Atmel logos and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Disclaimer The information in this document is provided in connection with Atmel products. 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