AT88SC0808CA-SU

AT88SC0808CA-SU Datasheet


Atmel AT88SC0808CA

Part Datasheet
AT88SC0808CA-SU AT88SC0808CA-SU AT88SC0808CA-SU (pdf)
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Atmel AT88SC0808CA

Atmel CryptoMemory

SUMMARY DATASHEET
• One of a family of devices with user memories from 1Kbit to 8Kbits
• 8Kbit 1Kbyte EEPROM user memory
• Eight 1Kbit 128-byte zones
• Self-timed write cycle
• Single byte or 16-byte page write mode
• Programmable access rights for each zone
• 2Kbit configuration zone
• 37-byte OTP One-Time Programmable area for user-defined codes
• 160-byte area for user-defined keys and passwords
• High security features
• 64-bit mutual authentication protocol under license of ELVA
• Cryptographic Message Authentication Codes MAC
• Stream encryption
• Four key sets for authentication and encryption
• Eight sets of two 24-bit passwords
• Anti-tearing function
• Voltage and frequency monitors
• Smart card features
• ISO 7816 Class B 3V operation
• ISO 7816-3 asynchronous T=0 Protocol Patent *
• Multiple zones, key sets and passwords for multi-application use
• Synchronous two-wire serial interface for faster device initialization *
• Programmable 8-byte answer-to-reset register ATR
• ISO 7816-2 compliant modules
• Embedded application features
• Low voltage supply 2.7V 3.6V
• Secure nonvolatile storage for sensitive system or user information
• Two-wire serial interface TWI, 5V compatible
• 1.0MHz compatibility for fast operation
• Standard 8-lead plastic packages, green compliant exceeds RoHS
• Same pin configuration as AT24CXXX Serial EEPROM in SOIC and

PDIP packages
• High reliability
• Endurance 100,000 cycles
• Data retention 10 years
• ESD protection 2,000V min
* Note Modules available with either T=0 / 2-wire modes or 2-wire mode only
5204FS−CRYPTO−12/11

Table Pin Assignments

Pad VCC GND SCL/CLK SDA/IO RST

Description Supply Voltage Ground Serial Clock Input Serial Data Input/Output Reset Input

ISO Module C1 C5 C3 C7 C2

TWI Module C1 C5 C3 C7 NC
“SOIC, PDIP” 8 4 6 5 NC

TSSOP 8 1 6 3 NC

Mini-MAP 4 5 2 7 NC

Figure Pin Configuration

ISO Smart Card Module

V CC =C1 RST=C2 SCL/CLK=C3

NC=C4

C5=GND C6=NC C7=SDA/IO C8=NC

GND 1 NC 2 SDA 3 NC 4
8-lead TSSOP
6 CLK

TWI Smart Card Module

V CC =C1 NC=C2 SCL/CLK=C3 NC=C4

C5=GND C6=NC C7=SDA/IO C8=NC
8-lead SOIC, PDIP

NC 1 NC 2 NC 3 GND 4
6 SCL
Ordering Information
Atmel Ordering Code

AT88SC0808CA-MJ AT88SC0808CA-MP AT88SC0808CA-MJTG AT88SC0808CA-MPTG

AT88SC0808CA-PU AT88SC0808CA-SH AT88SC0808CA-TH AT88SC0808CA-Y6H-T

AT88SC0808CA-WI

Package

M2 J Module- ISO M2 P Module- ISO M2 J Module -TWI M2 P Module -TWI
8P3 8S1 8A2 8Y6
7 mil wafer

Voltage Range

Temperature Range Commercial 0°C to 70°C

Green compliant exceeds RoHS / Industrial −40°C to 85°C

Industrial −40°C to 85°C

Package Type 1 2

M2 J Module ISO or TWI M2 ISO 7816 smart card module M2 P Module ISO or TWI M2 ISO 7816 smart card module with logo
8-lead, wide, Plastic Dual Inline PDIP
8-lead, wide, Plastic Gull Wing Small Outline JEDEC SOIC
8-lead, 4.4mm body, Plastic Thin Shrink Small Outline TSSOP
8MA2
8-lead, x 3.0mm body, 0.50mm pitch, Ultra Thin Mini-Map, Dual No Lead DFN , MLP 2x3

Note Formal drawings may be obtained from an Atmel sales office Both the J and P module packages are used for either ISO T=0 / 2-wire mode or TWI 2-wire mode only

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11

Package Information
Ordering Code MJ or MJTG

Module Size Dimension* Glob Top Thickness Pitch:

M2 x [mm]

Round - [mm]
[mm] 14.25mm
Ordering Code MP or MPTG

Module Size Dimension* Glob Top Thickness Pitch:

M2 x [mm] Square - x [mm] [mm] 14.25mm

Note:
*The module dimensions listed refer to the dimensions of the exposed metal contact area. The actual dimensions of the module after excise or punching from the carrier tape are generally 0.4mm greater in both directions i.e., a punched M2 module will yield x 11.8mm .

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11
Ordering Code SH 8S1 8-lead SOIC

TOP VIEW

SIDE VIEW

Notes This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.

END VIEW

COMMON DIMENSIONS Unit of Measure = mm

SYMBOL MIN

NOTE

Package Drawing Contact 8S1, 8-lead Wide Body , Plastic Gull Wing Small Outline JEDEC SOIC
6/22/11

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11
Ordering Code PU 8P3 8-lead PDIP

Top View

End View
4 PLCS

Side View

COMMON DIMENSIONS Unit of Measure = inches

SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L

MIN NOM MAX

NOTE 2

This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm .

Package Drawing Contact:
8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11
Ordering Code TH 8X 8-lead TSSOP

Pin 1 this corner

Top View

End View

Side View

This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc.

Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm 0.006in per side.

Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm 0.010in per side.

Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm.

Dimension D and E1 to be determined at Datum Plane H.

SYMBOL A A1 A2 D E E1 b e L L1 C

COMMON DIMENSIONS Unit of Measure = mm

MIN -

NOM -

NOTE
2, 5 3, 5

Package Drawing Contact 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package TSSOP

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11
Ordering Code Y6H-T 8MA2 8-lead Ultra Thin Mini-Map
1 Pin 1 ID

A2 A1
b 8x 8 7 6 5

E2 Pin#1 L 8x

D2 3 4 K

SYMBOL D E D2 E2 A A1 A2 C L e b K

COMMON DIMENSIONS Unit of Measure = mm

MIN NOM MAX

NOTE 3

Package Drawing Contact:

TITLE 8MA2, 8-pad, 2 x 3 x mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package UDFN

GPC YNZ
8MA2

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11
5204ES 5204DS 5204CS 5204BS 5204AS

Date 12/2011
07/2009 07/2009 05/2009 02/2009 07/2008

Comments

Update Template Update package drawings and
- Replace 8A2 with 8X - Replace 8Y6 with 8MA2 Change AT88SC0808CA-SU to AT88SC0808CA-SH Minor edits and TWI module update Minor updates to package drawing information and ordering information. Added Mini-MAP column to Table 1-1 and Mini-MAP pin-out drawing. Connection Diagram inserted DC Characteristics table updated. Initial document release.

Atmel AT88SC0808CA [Summary DATASHEET]
5204FS−CRYPTO−12/11

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Datasheet ID: AT88SC0808CA-SU 519070