AT25080BN-SH-T

AT25080BN-SH-T Datasheet


The AT25080B/160B provides 8192/16384 bits of serial electrically-erasable programmable read-only memory EEPROM organized as 1024/2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25080B/160B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 and 8-lead TSSOP packages.

Part Datasheet
AT25080BN-SH-T AT25080BN-SH-T AT25080BN-SH-T (pdf)
Related Parts Information
AT25080B-TH-B AT25080B-TH-B AT25080B-TH-B
AT25160BY6-YH-T AT25160BY6-YH-T AT25160BY6-YH-T
AT25160BN-SH-B AT25160BN-SH-B AT25160BN-SH-B
AT25160B-TH-B AT25160B-TH-B AT25160B-TH-B
AT25080BN-SH-B AT25080BN-SH-B AT25080BN-SH-B
AT25080B-PU AT25080B-PU AT25080B-PU
AT25080B-TH-T AT25080B-TH-T AT25080B-TH-T
AT25080BY6-YH-T AT25080BY6-YH-T AT25080BY6-YH-T
AT25160BN-SH-T AT25160BN-SH-T AT25160BN-SH-T
AT25160B-TH-T AT25160B-TH-T AT25160B-TH-T
AT25160B-PU AT25160B-PU AT25160B-PU
PDF Datasheet Preview
• Serial Peripheral Interface SPI Compatible
• Supports SPI Modes 0,0 and 3 1,1

Datasheet Describes Mode 0 Operation
• Low-voltage and Standard-voltage Operation

VCC = 1.8V to 5.5V
• 20 MHz Clock Rate 5V
• 32-byte Page Mode
• Block Write Protection

Protect 1/4, 1/2, or Entire Array
• Write Protect WP Pin and Write Disable Instructions for Both Hardware and Software

Data Protection
• Self-timed Write Cycle 5 ms max
• High Reliability

Endurance One Million Write Cycles Data Retention 100 Years
• 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 , 8-lead TSSOP and 8-ball dBGA2 Packages
• Die Sales Wafer Form, Tape and Reel, and Bumped Wafers

The AT25080B/160B provides 8192/16384 bits of serial electrically-erasable programmable read-only memory EEPROM organized as 1024/2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25080B/160B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 and 8-lead TSSOP packages.

The AT25080B/160B is enabled through the Chip Select pin CS and accessed via a three-wire interface consisting of Serial Data Input SI , Serial Data Output SO , and Serial Clock SCK . All programming cycles are completely self-timed, and no separate erase cycle is required before write.

Table Pin Configuration

Pin Name CS

Function Chip Select
8-lead PDIP

SCK SI SO GND

Serial Data Clock Serial Data Input Serial Data Output Ground

CS 1 SO 2 WP 3 GND 4
8 VCC 7 HOLD 6 SCK 5 SI

Power Supply

WP HOLD

Write Protect Suspends Serial Input
8-lead TSSOP

CS 1 SO 2 WP 3 GND 4
8 VCC 7 HOLD 6 SCK 5 SI

SPI Serial EEPROMs 8K 1024 x 8 16K 2048 x 8 AT25080B AT25160B Preliminary
8-lead SOIC
8-lead Ultra Thin Mini-MAP MLP 2x3
8-ball dBGA2

CS 1 SO 2 WP 3 GND 4
8 VCC 7 HOLD 6 SCK 5 SI

VCC 8 HOLD 7

SCK 6 SI 5
1 CS 2 SO 3 WP 4 GND

Bottom View

VCC 8 HOLD 7

SCK 6 SI 5
1 CS 2 SO 3 WP 4 SI

Bottom View

Block write protection is enabled by programming the status register with one of four blocks of write protection. Separate program enable and program disable instructions are provided for additional data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts to the status register. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence.

Absolute Maximum Ratings*

Operating to +125°C Storage Temperature to +150°C Voltage on Any Pin with Respect to Ground to +7.0V Maximum Operating Voltage 6.25V DC Output mA
*NOTICE:

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
AT25080B Ordering Information
Ordering Code

Voltage

Package

Operation Range

AT25080B-PU Bulk form only AT25080BN-SH-B 1 NiPdAu Lead Finish AT25080BN-SH-T 2 NiPdAu Lead Finish AT25080B-TH-B 1 NiPdAu Lead Finish AT25080B-TH-T 2 NiPdAu Lead Finish AT25080BY6-YH-T 2 NiPdAu Lead Finish

Lead-free/Halogen-free/ Industrial Temperature
−40 to 85°C

AT25080BD3-DH-T 2 AT25080BU3-UU-T 2
8U3-1

AT25080B-W-11 3

Die Sale

Industrial Temperature −40 to 85°C

Notes “B” denotes bulk.
“-T” deontes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel.

Available in waffle pack, tape and reel, and wafer form order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial Interface Marketing.
8P3 8S1 8A2 8Y6 8D3 8U3-1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package DFN , MLP 2x3 mm 8-lead, mm x mm Body, Ultra axLanda Grid Array ULLGA 8-ball, die Ball Grid Array Package dBGA2

Options Low Voltage to 5.5V
14 AT25080B/160B [Preliminary]

AT25080B/160B [Preliminary]
AT25160B Ordering Information
Ordering Code

Voltage

Package

Operation Range

AT25160B-PU Bulk form only AT25160BN-SH-B 1 NiPdAu Lead Finish AT25160BN-SH-T 2 NiPdAu Lead Finish AT25160B-TH-B 1 NiPdAu Lead Finish AT25160B-TH-T 2 NiPdAu Lead Finish AT25160BY6-YH-T 2 NiPdAu Lead Finish

Lead-free/Halogen-free/ Industrial Temperature
−40 to 85°C

AT25160BD3-DH-T 2 AT25160BU3-UU-T 2
8U3-1

AT25160B-W-11 3

Die Sale

Industrial Temperature −40 to 85°C

Notes “B” denotes bulk.
“-T” deontes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel.

Available in tape and reel and wafer form order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial Interface Marketing.
8P3 8S1 8A2 8Y6 8D3 8U3-1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package DFN , MLP 2x3mm 8-lead, mm x mm Body, Ultra axLanda Grid Array ULLGA 8-ball, die Ball Grid Array Package dBGA2

Options Low Voltage to 5.5V

Packaging Information 8P3 PDIP

Top View

End View
4 PLCS

Side View

COMMON DIMENSIONS Unit of Measure = inches

SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L

MIN NOM MAX

NOTE 2

This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA, for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm .
01/09/02
2325 Orchard Parkway R San Jose, CA 95131

TITLE 8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP
16 AT25080B/160B [Preliminary]
8S1 JEDEC SOIC

AT25080B/160B [Preliminary]

Top View

Side View

End View

COMMON DIMENSIONS Unit of Measure = mm

SYMBOL A A1 b C D E1 E L

NOTE

Note These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
More datasheets: FDD6770A | CL-773F-CW18C4-SDW-T | CLM4S-DKW-CDGGMDDDD3 | FIT0424 | AT25080B-TH-B | AT25160BY6-YH-T | AT25160BN-SH-B | AT25160B-TH-B | AT25080BN-SH-B | AT25080B-PU


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Datasheet ID: AT25080BN-SH-T 518894