• Low-Power Devices ISB = 6 µA 5.5V Available<br>• Internally Organized 4096 x 8, 8192 x 8<br>• 2-Wire Serial Interface<br>• Schmitt Trigger, Filtered Inputs for Noise Suppression<br>• Bidirectional Data Transfer Protocol<br>• 100 kHz 1.8V and 400 kHz 2.5V Clock Rate for AT24C32A<br>• 400 kHz 1.8V Clock Rate for AT24C64A<br>• Write Protect Pin for Hardware Data Protection<br>• 32-Byte Page Write Mode Partial Page Writes Allowed<br>• Self-Timed Write Cycle 5 ms Max<br>• High Reliability
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AT24C64AW-10SI-1.8 (pdf) |
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PDF Datasheet Preview |
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• Low-Voltage and Standard-Voltage Operation VCC = 2.7V to 5.5V VCC = 1.8V to 5.5V • Low-Power Devices ISB = 6 µA 5.5V Available • Internally Organized 4096 x 8, 8192 x 8 • 2-Wire Serial Interface • Schmitt Trigger, Filtered Inputs for Noise Suppression • Bidirectional Data Transfer Protocol • 100 kHz 1.8V and 400 kHz 2.5V Clock Rate for AT24C32A • 400 kHz 1.8V Clock Rate for AT24C64A • Write Protect Pin for Hardware Data Protection • 32-Byte Page Write Mode Partial Page Writes Allowed • Self-Timed Write Cycle 5 ms Max • High Reliability Endurance 1 Million Write Cycles Data Retention 100 Years • Automotive Grade, Extended Temperature and Lead-free/Halogen-free Devices Available • 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead MAP and 8-lead TSSOP Packages The AT24C32A/64A provides 32,768/65,536 bits of serial electrically erasable and programmable read only memory EEPROM organized as 4096/8192 words of 8 bits each. The device’s cascadable feature allows up to 8 devices to share a common 2wire bus. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The AT24C32A/64A is available in space saving 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead MAP and 8-lead TSSOP packages and is accessed via a 2-wire serial interface. In addition, the entire family is available in 2.7V 2.7V to 5.5V and 1.8V 1.8V to 5.5V versions. 2-Wire Serial EEPROM 32K 4096 x 8 64K 8192 x 8 AT24C32A AT24C64A Pin Configurations Pin Name A0 - A2 SDA SCL WP Function Address Inputs Serial Data Serial Clock Input Write Protect 8-lead SOIC A0 1 A1 2 A2 3 GND 4 8 VCC 7 WP 6 SCL 5 SDA 8-lead MAP VCC 8 WP 7 SCL 6 SDA 5 1 A0 2 A1 3 A2 4 GND Bottom View 8-lead TSSOP A0 1 A1 2 A2 3 GND 4 8 VCC 7 WP 6 SCL 5 SDA 8-lead PDIP A0 1 A1 2 A2 3 GND 4 8 VCC 7 WP 6 SCL 5 SDA Absolute Maximum Ratings* Operating -55° C to +125° C Storage Temperature -65° C to +150° C Voltage on Any Pin with Respect to Ground to +7.0V Maximum Operating Voltage 6.25V DC Output mA Block Diagram *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 AT24C32A/64A AT24C32A/64A Pin Description SERIAL CLOCK SCL The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA SDA The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open collector devices. DEVICE/ADDRESSES A2, A1, A0 The A2, A1 and A0 pins are device address inputs that are hardwired or left not connected for hardware compatibility with other AT24Cxx devices. When the pins are hardwired, as many as eight 32K/64K devices may be addressed on a single bus system device addressing is discussed in detail under the Device Addressing section . If the pins are left floating, the A2, A1 and A0 pins will be internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3 pF. If coupling is >3 pF, Atmel recommends connecting the address pins to GND. WRITE PROTECT WP The write protect input, when connected to GND, allows normal write operations. When WP is connected high to VCC, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3 pF. If coupling is >3 pF, Atmel recommends connecting the pin to GND. Switching WP to VCC prior to a write operation creates a software write protect function. Memory Organization AT24C32A/64A, 32K/64K SERIAL EEPROM The 32K/64K is internally organized as 128/256 pages of 32 bytes each. Random word addressing requires a 12/13-bit data word address. Pin Capacitance 1 Applicable over recommended operating range from TA = 25° C, f = MHz, VCC = +1.8V. Symbol Test Condition CI/O Input/Output Capacitance SDA AT24C32A Ordering Information Ordering Code AT24C32A-10PI-2.7 AT24C32AN-10SI-2.7 AT24C32AW-10SI-2.7 AT24C32A-10TI-2.7 AT24C32AY1-10YI-2.7 AT24C32A-10PI-1.8 AT24C32AN-10SI-1.8 AT24C32AW-10SI-1.8 AT24C32A-10TI-1.8 AT24C32AY1-10YI-1.8 AT24C32AN-10SU-2.7 AT24C32AN-10SU-1.8 AT24C32A-10TU-2.7 AT24C32A-10TU-1.8 AT24C32AN-10SQ-2.7 AT24C32AN-10SE-2.7 Package 8P3 8S1 8S2 8A2 8Y1 8P3 8S1 8S2 8A2 8Y1 8S1 8A2 Operation Range Industrial Temperature -40° C to 85° C Industrial Temperature -40° C to 85° C Lead-free/Halogen-free/ Industrial Temperature -40° C to 85° C Lead-free/Halogen-free/ High Grade/Extended Temperature -40° C to 125° C High Grade/Extended Temperature -40° C to 125° C Note For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables. Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, Body, Plastic Small Outline EIAJ SOIC 8-lead, Wide, Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP Options Low Voltage 2.7V to 5.5V Low Voltage 1.8V to 5.5V AT24C64A Ordering Information Ordering Code AT24C64A-10PI-2.7 AT24C64AN-10SI-2.7 AT24C64AW-10SI-2.7 AT24C64A-10TI-2.7 AT24C64AY1-10YI-2.7 AT24C64A-10PI-1.8 AT24C64AN-10SI-1.8 AT24C64AW-10SI-1.8 AT24C64A-10TI-1.8 AT24C64AY1-10YI-1.8 AT24C64AN-10SU-2.7 AT24C64AN-10SU-1.8 AT24C64A-10TU-2.7 AT24C64A-10TU-1.8 AT24C64AN-10SQ-2.7 AT24C64AN-10SE-2.7 Package 8P3 8S1 8S2 8A2 8Y1 8P3 8S1 8S2 8A2 8Y1 8S1 8A2 Operation Range Industrial Temperature -40° C to 85° C Industrial Temperature -40° C to 85° C Lead-free/Halogen-free/ Industrial Temperature -40° C to 85° C Lead-free/Halogen-free/ High Grade/Extended Temperature -40° C to 125° C High Grade/Extended Temperature -40° C to 125° C Note For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables. Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, Body, Plastic Small Outline EIAJ SOIC 8-lead, Wide, Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP Options Low Voltage 2.7V to 5.5V Low Voltage 1.8V to 5.5V 14 AT24C32A/64A Package Drawings 8P3 PDIP AT24C32A/64A Top View End View 4 PLCS Side View COMMON DIMENSIONS Unit of Measure = inches SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L MIN NOM MAX NOTE 2 This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm . 01/09/02 2325 Orchard Parkway R San Jose, CA 95131 TITLE 8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP 8S1 JEDEC SOIC Top View Side View End View |
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