AT24C256B-TH-B

AT24C256B-TH-B Datasheet

AT24C256B

Part	Datasheet
AT24C256B-TH-B	AT24C256B-TH-B (pdf)

Related Parts	Information
AT24C256BN-SH-B	AT24C256BN-SH-B
AT24C256B-PU	AT24C256B-PU
AT24C256BW-SH-B	AT24C256BW-SH-B
AT24C256BN-SH-T	AT24C256BN-SH-T
AT24C256BW-SH-T	AT24C256BW-SH-T
AT24C256B-TH-T	AT24C256B-TH-T

PDF Datasheet Preview
• Low-voltage and Standard-voltage Operation VCC = 1.8V to 5.5V • Internally Organized as 32,768 x 8 • Two-wire Serial Interface • Schmitt Trigger, Filtered Inputs for Noise Suppression • Bidirectional Data Transfer Protocol • 1 MHz 5.0V, 2.7V, 2.5V , and 400 kHz 1.8V Compatibility • Write Protect Pin for Hardware and Software Data Protection • 64-byte Page Write Mode Partial Page Writes Allowed • Self-timed Write Cycle 5 ms Max • High Reliability Endurance One Million Write Cycles Data Retention 40 Years • Lead-free/Halogen-free Devices Available • 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, EIAJ SOIC, 8-lead Ultra Thin Small Array Package SAP , 8-lead TSSOP, and 8-ball dBGA2 Packages • Die Sales Wafer Form, Waffle Pack and Bumped Wafers Two-wire Serial EEPROM 256K 32,768 x 8 AT24C256B The AT24C256B provides 262,144 bits of serial electrically erasable and programmable read-only memory EEPROM organized as 32,768 words of 8 bits each. The device’s cascadable feature allows up to eight devices to share a common two-wire bus. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The devices are available in space-saving 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin SAP, 8lead TSSOP, and 8-ball dBGA2 packages. In addition, the entire family is available in a 1.8V 1.8V to 5.5V version. Pin Configurations 8-lead PDIP 8-lead SOIC Pin Name SDA SCL WP GND Function Address Inputs Serial Data Serial Clock Input Write Protect Ground A0 1 A1 2 A2 3 GND 4 8 VCC 6 SCL 5 SDA GND 8-lead dBGA2 VCC 8 WP 7 SCL 6 SDA 5 1 A0 2 A1 3 A2 4 GND 8-lead TSSOP A0 1 A1 2 A2 3 GND 4 8 VCC 7 WP 6 SCL 5 SDA Bottom View 8-lead Ultra Thin SAP VCC 8 WP 7 SCL 6 SDA 5 1 A0 2 A1 3 A2 4 GND Bottom View Absolute Maximum Ratings* Operating 55°C to +125°C Storage Temperature 65°C to +150°C Voltage on Any Pin with Respect to Ground − 1.0V to +7.0V Maximum Operating Voltage 6.25V DC Output mA NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure Block Diagram VCC GND WP SCL SDA A2 A1 A0 START STOP LOGIC LOAD DEVICE ADDRESS COMPARATOR SERIAL CONTROL AT24C256B Ordering Codes Ordering Code AT24C256B-PU Bulk Form Only AT24C256BN-SH-B 1 NiPdAu Lead Finish AT24C256BN-SH-T 2 NiPdAu Lead Finish AT24C256BW-SH-B 1 NiPdAu Lead Finish AT24C256BW-SH-T 2 NiPdAu Lead Finish AT24C256B-TH-B 1 NiPdAu Lead Finish AT24C256B-TH-T 2 NiPdAu Lead Finish AT24C256BY7-YH-T 2 NiPdAu Lead Finish AT24C256BU2-UU-T 2 AT24C256B-W-11 Voltage Package 8P3 8S1 8S2 8A2 8Y7 8U2-1 Die Sale Operation Range Lead-free/Halogen-free Industrial Temperature −40°C to 85°C Industrial Temperature −40°C to 85°C “-B” denotes bulk. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel. Available in tape & reel and wafer form order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial Interface Marketing. 8P3 8S1 8S2 8U2-1 8A2 8Y7 Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline Package JEDEC SOIC 8-lead, Wide, Plastic Gull Wing Small Outline Package EIAJ SOIC 8-ball, die Ball Grid Array Package dBGA2 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package SAP Options Low-voltage 1.8V to 5.5V Part Marking Scheme 8-PDIP TOP MARK Seal Year \| Seal Week \|\|\| \|---\|---\|---\|---\|---\|---\|---\|---\| ATMLUYWW \|---\|---\|---\|---\|---\|---\|---\|---\| \|---\|---\|---\|---\|---\|---\|---\|---\| Lot Number \|---\|---\|---\|---\|---\|---\|---\|---\| \| Pin 1 Indicator Dot Y = SEAL YEAR 6 2006 0 2010 7 2007 8 2008 9 2009 1 2011 2 2012 3 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 : ::: : ::: : 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark 8-SOIC TOP MARK Seal Year \| Seal Week \|\|\| \|---\|---\|---\|---\|---\|---\|---\|---\| ATMLHYWW \|---\|---\|---\|---\|---\|---\|---\|---\| \|---\|---\|---\|---\|---\|---\|---\|---\| * Lot Number

PDF Datasheet Preview

• Low-voltage and Standard-voltage Operation VCC = 1.8V to 5.5V
• Internally Organized as 32,768 x 8
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz 5.0V, 2.7V, 2.5V , and 400 kHz 1.8V Compatibility
• Write Protect Pin for Hardware and Software Data Protection
• 64-byte Page Write Mode Partial Page Writes Allowed
• Self-timed Write Cycle 5 ms Max
• High Reliability

Endurance One Million Write Cycles Data Retention 40 Years
• Lead-free/Halogen-free Devices Available
• 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, EIAJ SOIC, 8-lead Ultra Thin Small Array Package SAP , 8-lead TSSOP, and 8-ball dBGA2 Packages
• Die Sales Wafer Form, Waffle Pack and Bumped Wafers

Two-wire Serial EEPROM
256K 32,768 x 8

AT24C256B

The AT24C256B provides 262,144 bits of serial electrically erasable and programmable read-only memory EEPROM organized as 32,768 words of 8 bits each. The device’s cascadable feature allows up to eight devices to share a common two-wire bus. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The devices are available in space-saving 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin SAP, 8lead TSSOP, and 8-ball dBGA2 packages. In addition, the entire family is available in a 1.8V 1.8V to 5.5V version.

Pin Configurations
8-lead PDIP
8-lead SOIC

Pin Name

SDA SCL WP GND

Function

Address Inputs Serial Data Serial Clock Input Write Protect Ground

A0 1 A1 2 A2 3 GND 4
8 VCC
6 SCL
5 SDA GND
8-lead dBGA2

VCC 8 WP 7 SCL 6 SDA 5
1 A0 2 A1 3 A2 4 GND
8-lead TSSOP

A0 1 A1 2 A2 3 GND 4
8 VCC 7 WP 6 SCL 5 SDA

Bottom View
8-lead Ultra Thin SAP

VCC 8 WP 7 SCL 6 SDA 5
1 A0 2 A1 3 A2 4 GND

Bottom View

Absolute Maximum Ratings*

Operating 55°C to +125°C Storage Temperature 65°C to +150°C Voltage on Any Pin with Respect to Ground − 1.0V to +7.0V Maximum Operating Voltage 6.25V DC Output mA
*NOTICE:

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Figure

Block Diagram VCC GND WP

SCL SDA

A2 A1 A0

START STOP LOGIC

LOAD

DEVICE ADDRESS COMPARATOR

SERIAL CONTROL
AT24C256B Ordering Codes
Ordering Code

AT24C256B-PU Bulk Form Only AT24C256BN-SH-B 1 NiPdAu Lead Finish AT24C256BN-SH-T 2 NiPdAu Lead Finish AT24C256BW-SH-B 1 NiPdAu Lead Finish AT24C256BW-SH-T 2 NiPdAu Lead Finish AT24C256B-TH-B 1 NiPdAu Lead Finish AT24C256B-TH-T 2 NiPdAu Lead Finish AT24C256BY7-YH-T 2 NiPdAu Lead Finish AT24C256BU2-UU-T 2

AT24C256B-W-11

Voltage

Package 8P3 8S1 8S2 8A2 8Y7 8U2-1

Die Sale

Operation Range

Lead-free/Halogen-free Industrial Temperature
−40°C to 85°C

Industrial Temperature −40°C to 85°C
“-B” denotes bulk. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel. Available in tape & reel and wafer form order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial Interface Marketing.
8P3 8S1 8S2 8U2-1 8A2 8Y7

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline Package JEDEC SOIC 8-lead, Wide, Plastic Gull Wing Small Outline Package EIAJ SOIC 8-ball, die Ball Grid Array Package dBGA2 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package SAP

Options Low-voltage 1.8V to 5.5V

Part Marking Scheme
8-PDIP

TOP MARK

Seal Year | Seal Week
||| |---|---|---|---|---|---|---|---|

ATMLUYWW
|---|---|---|---|---|---|---|---|
|---|---|---|---|---|---|---|---| * Lot Number
|---|---|---|---|---|---|---|---|
| Pin 1 Indicator Dot

Y = SEAL YEAR 6 2006 0 2010
7 2007 8 2008 9 2009
1 2011 2 2012 3 2013

WW = SEAL WEEK 02 = Week 2
04 = Week 4 : ::: : ::: : 50 = Week 50
52 = Week 52

Lot Number to Use ALL Characters in Marking

BOTTOM MARK

No Bottom Mark
8-SOIC

TOP MARK

Seal Year | Seal Week
||| |---|---|---|---|---|---|---|---|

ATMLHYWW
|---|---|---|---|---|---|---|---|
|---|---|---|---|---|---|---|---| * Lot Number

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived AT24C256B-TH-B Datasheet file may be downloaded here without warranties.

Datasheet ID: AT24C256B-TH-B 518884