The AT24C02B provides 2048 bits of serial electrically erasable and programmable read-only memory EEPROM organized as 256 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C02B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 , 5-lead SOT23, 8-lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the AT24C02B is available in 1.8V 1.8V to 5.5V version.
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AT24C02BN-SH-B (pdf) |
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AT24C02B-TSU-T |
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AT24C02B-TH-T |
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AT24C02BN-SH-T |
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AT24C02BY6-YH-T |
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AT24C02B-TH-B |
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AT24C02B-PU |
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• Low-voltage and Standard-voltage Operation VCC = 1.8V to 5.5V • Internally Organized 256 x 8 2K • Two-wire Serial Interface • Schmitt Trigger, Filtered Inputs for Noise Suppression • Bidirectional Data Transfer Protocol • 1 MHz 5V , 400 kHz 1.8V, 2.5V, 2.7V Compatibility • Write Protect Pin for Hardware Data Protection • 8-byte Page 2K Write Modes • Partial Page Writes Allowed • Self-timed Write Cycle 5 ms max • High-reliability Endurance 1 Million Write Cycles Data Retention 100 Years • 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 , 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages • Lead-free/Halogen-free • Available in Automotive • Die Sales Wafer Form and Tape and Reel The AT24C02B provides 2048 bits of serial electrically erasable and programmable read-only memory EEPROM organized as 256 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C02B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 , 5-lead SOT23, 8-lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the AT24C02B is available in 1.8V 1.8V to 5.5V version. Two-wire Serial EEPROM 2K 256 x 8 AT24C02B Not Recommended for New Design Table Pin Configuration 8-lead Ultra-Thin Pin Name Function Mini-MAP MLP 2x3 A0 - A2 SDA Address Inputs Serial Data VCC 8 WP 7 SCL 6 1 A0 2 A1 3 A2 Serial Clock Input SDA 5 4 GND Write Protect Bottom View GND VCC Ground Power Supply 8-lead TSSOP A0 1 8 VCC A1 2 7 WP A2 3 6 SCL Note: GND 4 5 SDA For use of 5-lead SOT23, the software A2, A1, and A0 bits in the device address word 5-lead SOT23 must be set to zero to prop- SCL 1 erly communicate. GND 2 SDA 3 4 VCC 8-ball dBGA2 VCC 8 1 A0 WP 7 2 A1 SCL 6 3 A2 SDA 5 4 GND Bottom View 8-lead SOIC A0 1 8 VCC A1 2 A2 3 7 WP 6 SCL AT24C02B Ordering Information Ordering Code Voltage Package Operation Range AT24C02B-PU Bulk form only AT24C02BN-SH-B 1 NiPdAu Lead Finish AT24C02BN-SH-T 2 NiPdAu Lead Finish AT24C02B-TH-B 1 NiPdAu Lead Finish AT24C02B-TH-T 2 NiPdAu Lead Finish AT24C02BY6-YH-T 2 NiPdAu Lead Finish AT24C02B-TSU-T 2 AT24C02BU3-UU-T 2 5TS1 8U3-1 Lead-free/Halogen-free/ Industrial Temperature to 85C AT24C02B-W-11 3 Die Sale Industrial Temperature to 85C Notes “-B” denotes bulk. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel. Available in tape and reel and wafer form order as SL788 for inkless wafer form. Please contact Serial Interface Marketing. 8P3 8S1 8A2 8Y6 5TS1 8U3-1 Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package DFN , MLP 2x3 mm 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Array Package dBGA2 Options Low-voltage 1.8V to 5.5V Part Marking Scheme 8-PDIP Seal Year TOP MARK | Seal Week |---|---|---|---|---|---|---|---| ATMLUYWW |---|---|---|---|---|---|---|---| |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| Pin 1 Indicator Dot U = Material Set Y = Seal Year WW = Seal Week 02B = Device 1 = Voltage Indicator *Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark 14 AT24C02B 8-SOIC Seal Year TOP MARK | Seal Week ||| |---|---|---|---|---|---|---|---| Removed reference to Waffle Pack on page 1 and Page 13 Added lines to Ordering Code table Removed NC row in the table Added note on Pg 1 Corrected format on table 5 Removed Memory Reset section Added 2-Wire software reset section and figure Corrected Figures 7-11 Corrected dBGA2 package code on Pg 13 Removed ‘Preliminary’ Added Ultra-Thin on Pg 1 Modified Ordering Information table Headquarters Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel 1 408 441-0311 Fax 1 408 487-2600 International Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel 852 2721-9778 Fax 852 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel 33 1-30-60-70-00 Fax 33 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel 81 3-3523-3551 Fax 81 3-3523-7581 Product Contact Web Site Literature Requests Technical Support Sales Contact Disclaimer The information in this document is provided in connection with Atmel products. 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More datasheets: 2322 615 53332 | 2322 615 53502 | 2322 615 53103 | FSTFST221CCB1X | 10038339-002CLF | 10038339-001LF | AT24C02B-TSU-T | AT24C02B-TH-T | AT24C02BN-SH-T | AT24C02BY6-YH-T |
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