AT24C01B-TH-B

AT24C01B-TH-B Datasheet


AT24C01B

Part Datasheet
AT24C01B-TH-B AT24C01B-TH-B AT24C01B-TH-B (pdf)
Related Parts Information
AT24C01BN-SH-T AT24C01BN-SH-T AT24C01BN-SH-T
AT24C01BY6-YH-T AT24C01BY6-YH-T AT24C01BY6-YH-T
AT24C01B-TSU-T AT24C01B-TSU-T AT24C01B-TSU-T
AT24C01BN-SH-B AT24C01BN-SH-B AT24C01BN-SH-B
AT24C01B-PU AT24C01B-PU AT24C01B-PU
AT24C01B-TH-T AT24C01B-TH-T AT24C01B-TH-T
PDF Datasheet Preview
• Low-voltage and Standard-voltage Operation VCC = 1.8V to 5.5V
• Internally Organized 128 x 8 1K
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz 5V , 400 kHz 1.8V, 2.5V, 2.7V Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-byte Page 1K Write Modes
• Partial Page Writes Allowed
• Self-timed Write Cycle 5 ms max
• High-reliability

Endurance 1 Million Write Cycles Data Retention 100 Years
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 , 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
• Lead-free/Halogen-free
• Die Sales Wafer Form and Tape and Reel

Two-wire Serial EEPROM
1K 128 x 8

AT24C01B

The AT24C01B provides 1024 bits of serial electrically erasable and programmable read-only memory EEPROM organized as 128 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C01B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3 , 5-lead SOT23, 8-lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the AT24C01B is available in 1.8V 1.8V to 5.5V version.

Table Pin Name A0 - A2 SDA SCL WP GND VCC

Pin Configuration

Function Address Inputs
8-lead Ultra Thin Mini-MAP MLP 2x3 8-ball dBGA2

VCC 8 WP 7
1 A0 2 A1

VCC 8 WP 7
1 A0 2 A1

Serial Data

SCL 6 SDA 5
3 A2 4 GND

SCL 6 SDA 5
3 A2 4 GND

Serial Clock Input

Bottom View

Bottom View

Write Protect Ground Power Supply
8-lead TSSOP

A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA
8-lead SOIC

A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA
5-lead SOT23

SCL 1

GND 2

SDA 3
4 VCC
8-lead PDIP

A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA

Absolute Maximum Ratings

Operating to +125°C Storage Temperature to +150°C Voltage on Any Pin with Respect to Ground to +7.0V Maximum Operating Voltage 6.25V DC Output mA
*NOTICE:

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Figure Block Diagram VCC GND WP SCL SDA

A2 A1 A0
AT24C01B Ordering Information
Ordering Code

Package

Voltage Range

Operation Range

AT24C01B-PU Bulk form only AT24C01BN-SH-B 1 NiPdAu Lead Finish AT24C01BN-SH-T 2 NiPdAu Lead Finish AT24C01B-TH-B 1 NiPdAu Lead Finish AT24C01B-TH-T 2 NiPdAu Lead Finish AT24C01BY6-YH-T 2 NiPdAu Lead Finish AT24C01B-TSU-T 2 AT24C01BU3-UU-T 2
8P3 8S1 8A2 8Y6 5TS1 8U3-1
1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V

Lead-free/Halogen-free/ Industrial Temperature
to 85°C

AT24C01B-W-11 3

Die Sale
1.8V to 5.5V

Industrial Temperature to 85°C

Notes “-B” denotes bulk.
“-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT 23 and dBGA2 = 5K per reel.

Available in tape and reel and wafer form order as SL788 for inkless wafer form. Please contact Serial Interface Marketing.
8P3 8S1 8A2 8Y6 5TS1 8U3-1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package DFN , MLP 2x3 mm 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Array Package dBGA2
8A2 TSSOP

Pin 1 indicator this corner

Top View

Side View

End View

COMMON DIMENSIONS Unit of Measure = mm

SYMBOL MIN NOM MAX

NOTE 2, 5 3, 5

This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc.

Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed mm in per side.

Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed mm in per side.

Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is mm.

Dimension D and E1 to be determined at Datum Plane H.
2325 Orchard Parkway R San Jose, CA 95131

TITLE 8A2, 8-lead, mm Body, Plastic

Thin Shrink Small Outline Package TSSOP
20 AT24C01B
More datasheets: 810KSA-1B | 810KSAQ | 810KMWB | 810KMV30Q | 810KMZG | 810K2MZB | 810KSA1Q | AT24C01BN-SH-T | AT24C01BY6-YH-T | AT24C01B-TSU-T


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Datasheet ID: AT24C01B-TH-B 518874