AT24C01AY1-10YI-1.8

AT24C01AY1-10YI-1.8 Datasheet

The AT24C01A/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial elec-

Part	Datasheet
AT24C01AY1-10YI-1.8	AT24C01AY1-10YI-1.8 (pdf)

Related Parts	Information
AT24C02Y1-10YI-1.8	AT24C02Y1-10YI-1.8
AT24C01AY1-10YI-2.7	AT24C01AY1-10YI-2.7

PDF Datasheet Preview
• Low-voltage and Standard-voltage Operation VCC = 2.7V to 5.5V VCC = 1.8V to 5.5V • Internally Organized 128 x 8 1K , 256 x 8 2K , 512 x 8 4K , 1024 x 8 8K or 2048 x 8 16K • Two-wire Serial Interface • Schmitt Trigger, Filtered Inputs for Noise Suppression • Bidirectional Data Transfer Protocol • 100 kHz 1.8V and 400 kHz 2.5V, 2.7V, 5V Compatibility • Write Protect Pin for Hardware Data Protection • 8-byte Page 1K, 2K , 16-byte Page 4K, 8K, 16K Write Modes • Partial Page Writes Allowed • Self-timed Write Cycle 5 ms max • High-reliability Endurance 1 Million Write Cycles Data Retention 100 Years • Automotive Grade, Extended Temperature and Lead-free/Halogen-free Devices Available • 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages • Die Sales Wafer Form, Waffle Pack and Bumped Wafers Two-wire Serial EEPROM 1K 128 x 8 2K 256 x 8 4K 512 x 8 8K 1024 x 8 The AT24C01A/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial elec- trically erasable and programmable read-only memory EEPROM organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08/16 is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 AT24C01A/AT24C02/AT24C04 , 8- lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter- face. In addition, the entire family is available in 2.7V 2.7V to 5.5V and 1.8V 1.8V to 5.5V versions. 8-lead TSSOP 8-lead SOIC Table Pin Configuration Pin Name Function A0 - A2 Address Inputs Serial Data A0 1 A1 2 A2 3 GND 4 8 VCC 6 SCL 5 SDA GND 4 8 VCC 7 WP 6 SCL 5 SDA SCL WP NC GND VCC Serial Clock Input Write Protect No Connect Ground Power Supply 8-ball dBGA2 VCC 8 WP 7 SCL 6 SDA 5 1 A0 2 A1 3 A2 4 GND Bottom View 8-lead MAP VCC 8 WP 7 SCL 6 SDA 5 1 A0 2 A1 3 A2 4 GND Bottom View 8-lead PDIP AT24C01A Ordering Information 1 Ordering Code AT24C01A-10PI-2.7 AT24C01A-10SI-2.7 AT24C01A-10TI-2.7 Package 8P3 8S1 8A2 Operation Range Industrial Temperature to 85°C AT24C01A-10PI-1.8 Industrial Temperature AT24C01A-10SI-1.8 AT24C01A-10TI-1.8 to 85°C AT24C01A-10PU-2.7 AT24C01A-10PU-1.8 AT24C01A-10SU-2.7 AT24C01A-10SU-1.8 AT24C01A-10TU-2.7 AT24C01A-10TU-1.8 AT24C01A-10TSU-2.7 AT24C01A-10TSU-1.8 AT24C01AU3-10UU-2.7 AT24C01AU3-10UU-1.8 AT24C01AY1-10YU-2.7 AT24C01AY1-10YU-1.8 AT24C01A-W2.7-11 2 AT24C01A-W1.8-11 2 8P3 8S1 8A2 5TS1 8U31 8Y1 Die Sale Die Sale Lead-free/Halogen-free/ Industrial Temperature to 85°C Industrial Temperature to 85°C Notes For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8S1 8A2 8Y1 5TS1 8U3-1 Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Away Package dBGA2 Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V AT24C02 Ordering Information 1 Ordering Code Package Operation Range AT24C02-10PI-2.7 Industrial Temperature AT24C02N-10SI-2.7 AT24C02-10TI-2.7 to 85°C AT24C02-10PI-1.8 Industrial Temperature AT24C02N-10SI-1.8 AT24C02-10TI-1.8 to 85°C AT24C02-10PU-2.7 AT24C02-10PU-1.8 AT24C02N-10SU-2.7 AT24C02N-10SU-1.8 AT24C02-10TU-2.7 AT24C02-10TU-1.8 AT24C02Y1-10YU-2.7 AT24C02Y1-10YU-1.8 AT24C02-10TSU-2.7 AT24C02-10TSU-1.8 AT24C02U3-10UU-2.7 AT24C02U3-10UU-1.8 8P3 8S1 8A2 8Y1 5TS1 8U3-1 8U3-1 Lead-free/Halogen-free/ Industrial Temperature to 85°C AT24C02-W2.7-11 2 AT24C02-W1.8-11 2 Die Sale Die Sale Industrial Temperature to 85°C Notes For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8S1 8A2 8Y1 5TS1 8U3-1 Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Away Package dBGA2 Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V AT24C01A/02/04/08/16 AT24C01A/02/04/08/16 AT24C04 Ordering Information 1 Ordering Code Package Operation Range AT24C04-10PI-2.7 Industrial Temperature AT24C04N-10SI-2.7 AT24C04-10TI-2.7 to 85°C AT24C04-10PI-1.8 Industrial Temperature AT24C04N-10SI-1.8 AT24C04-10TI-1.8 to 85°C AT24C04-10PU-2.7 AT24C04-10PU-1.8 AT24C04N-10SU-2.7 AT24C04N-10SU-1.8 AT24C04-10TU-2.7 AT24C04-10TU-1.8 AT24C04Y1-10YU-2.7 AT24C04Y1-10YU-1.8 AT24C04-10TSU-2.7 AT24C04-10TSU-1.8 AT24C04U3-10UU-2.7 AT24C04U3-10UU-1.8 AT24C04-W2.7-11 2 AT24C04-W1.8-11 2 8P3 8S1 8A2 8Y1 5TS1 8U3-1 8U3-1 Die Sale Die Sale Lead-free/Halogen-free/ Industrial Temperature to 85°C Industrial Temperature to 85°C Notes For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8S1 8A2 8Y1 5TS1 8U3-1 Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Away Package dBGA2 Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V AT24C08 1 Ordering Information Ordering Code 2 Package Operation Range AT24C08-10PI-2.7 Industrial Temperature AT24C08N-10SI-2.7 AT24C08-10TI-2.7 to 85°C AT24C08-10PI-1.8 Industrial Temperature AT24C08N-10SI-1.8 AT24C08-10TI-1.8 to 85°C Notes This device is not recommended for new designs. Please refer to AT24C08A. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V 16 AT24C01A/02/04/08/16 AT24C01A/02/04/08/16 AT24C16 1 Ordering Information Ordering Code 2 Package Operation Range AT24C16-10PI-2.7 Industrial Temperature AT24C16N-10SI-2.7 AT24C16-10TI-2.7 to 85°C AT24C16-10PI-1.8 Industrial Temperature AT24C16N-10SI-1.8 AT24C16-10TI-1.8 to 85°C Notes This device is not recommended for new designs. Please refer to AT24C16A. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V Packaging Information 8P3 PDIP Top View End View 4 PLCS Side View COMMON DIMENSIONS Unit of Measure = inches SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L MIN NOM MAX NOTE 2 This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA, for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm . 01/09/02 2325 Orchard Parkway R San Jose, CA 95131 TITLE 8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP 18 AT24C01A/02/04/08/16 8S1 JEDEC SOIC AT24C01A/02/04/08/16 Top View Side View End View

PDF Datasheet Preview

• Low-voltage and Standard-voltage Operation VCC = 2.7V to 5.5V VCC = 1.8V to 5.5V
• Internally Organized 128 x 8 1K , 256 x 8 2K , 512 x 8 4K , 1024 x 8 8K or 2048 x 8 16K
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 100 kHz 1.8V and 400 kHz 2.5V, 2.7V, 5V Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-byte Page 1K, 2K , 16-byte Page 4K, 8K, 16K Write Modes
• Partial Page Writes Allowed
• Self-timed Write Cycle 5 ms max
• High-reliability

Endurance 1 Million Write Cycles

Data Retention 100 Years
• Automotive Grade, Extended Temperature and Lead-free/Halogen-free Devices

Available
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23,
8-lead TSSOP and 8-ball dBGA2 Packages
• Die Sales Wafer Form, Waffle Pack and Bumped Wafers

Two-wire Serial EEPROM
1K 128 x 8 2K 256 x 8 4K 512 x 8 8K 1024 x 8

The AT24C01A/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial elec-
trically erasable and programmable read-only memory EEPROM organized as
128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many
industrial and commercial applications where low-power and low-voltage operation
are essential. The AT24C01A/02/04/08/16 is available in space-saving 8-lead PDIP,
8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 AT24C01A/AT24C02/AT24C04 , 8-
lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial inter-
face. In addition, the entire family is available in 2.7V 2.7V to 5.5V and 1.8V 1.8V to
5.5V versions.
8-lead TSSOP
8-lead SOIC

Table Pin Configuration

Pin Name Function

A0 - A2

Address Inputs

Serial Data

A0 1 A1 2 A2 3 GND 4
8 VCC
6 SCL
5 SDA GND 4
8 VCC 7 WP 6 SCL 5 SDA

SCL WP NC GND VCC

Serial Clock Input Write Protect No Connect Ground Power Supply
8-ball dBGA2

VCC 8 WP 7 SCL 6 SDA 5
1 A0 2 A1 3 A2 4 GND

Bottom View
8-lead MAP

VCC 8 WP 7 SCL 6 SDA 5
1 A0 2 A1 3 A2 4 GND

Bottom View
8-lead PDIP
AT24C01A Ordering Information 1
Ordering Code

AT24C01A-10PI-2.7 AT24C01A-10SI-2.7 AT24C01A-10TI-2.7

Package
8P3 8S1 8A2

Operation Range

Industrial Temperature to 85°C

AT24C01A-10PI-1.8

Industrial Temperature

AT24C01A-10SI-1.8

AT24C01A-10TI-1.8
to 85°C

AT24C01A-10PU-2.7 AT24C01A-10PU-1.8 AT24C01A-10SU-2.7 AT24C01A-10SU-1.8 AT24C01A-10TU-2.7 AT24C01A-10TU-1.8 AT24C01A-10TSU-2.7 AT24C01A-10TSU-1.8 AT24C01AU3-10UU-2.7 AT24C01AU3-10UU-1.8 AT24C01AY1-10YU-2.7 AT24C01AY1-10YU-1.8 AT24C01A-W2.7-11 2 AT24C01A-W1.8-11 2
8P3 8S1 8A2 5TS1 8U31 8Y1

Die Sale Die Sale

Lead-free/Halogen-free/ Industrial Temperature
to 85°C

Industrial Temperature to 85°C

Notes For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing.
8P3 8S1 8A2 8Y1 5TS1 8U3-1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Away Package dBGA2

Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V
AT24C02 Ordering Information 1
Ordering Code

Package

Operation Range

AT24C02-10PI-2.7

Industrial Temperature

AT24C02N-10SI-2.7

AT24C02-10TI-2.7
to 85°C

AT24C02-10PI-1.8

Industrial Temperature

AT24C02N-10SI-1.8

AT24C02-10TI-1.8
to 85°C

AT24C02-10PU-2.7 AT24C02-10PU-1.8 AT24C02N-10SU-2.7

AT24C02N-10SU-1.8

AT24C02-10TU-2.7

AT24C02-10TU-1.8 AT24C02Y1-10YU-2.7 AT24C02Y1-10YU-1.8 AT24C02-10TSU-2.7 AT24C02-10TSU-1.8 AT24C02U3-10UU-2.7 AT24C02U3-10UU-1.8
8P3 8S1
8A2 8Y1 5TS1 8U3-1 8U3-1

Lead-free/Halogen-free/ Industrial Temperature
to 85°C

AT24C02-W2.7-11 2 AT24C02-W1.8-11 2

Die Sale Die Sale

Industrial Temperature to 85°C

Notes For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing.
8P3 8S1 8A2 8Y1 5TS1 8U3-1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Away Package dBGA2

Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V

AT24C01A/02/04/08/16

AT24C01A/02/04/08/16
AT24C04 Ordering Information 1
Ordering Code

Package

Operation Range

AT24C04-10PI-2.7

Industrial Temperature

AT24C04N-10SI-2.7

AT24C04-10TI-2.7
to 85°C

AT24C04-10PI-1.8

Industrial Temperature

AT24C04N-10SI-1.8

AT24C04-10TI-1.8
to 85°C

AT24C04-10PU-2.7 AT24C04-10PU-1.8 AT24C04N-10SU-2.7 AT24C04N-10SU-1.8 AT24C04-10TU-2.7 AT24C04-10TU-1.8 AT24C04Y1-10YU-2.7 AT24C04Y1-10YU-1.8 AT24C04-10TSU-2.7 AT24C04-10TSU-1.8 AT24C04U3-10UU-2.7 AT24C04U3-10UU-1.8

AT24C04-W2.7-11 2 AT24C04-W1.8-11 2
8P3 8S1 8A2 8Y1 5TS1 8U3-1 8U3-1

Die Sale

Die Sale

Lead-free/Halogen-free/ Industrial Temperature
to 85°C

Industrial Temperature to 85°C

Notes For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing.
8P3 8S1 8A2 8Y1 5TS1 8U3-1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 5-lead, mm x mm Body, Plastic Thin Shrink Small Outline Package SOT23 8-ball, die Ball Grid Away Package dBGA2

Options Low-voltage 2.7V to 5.5V Low-voltage 1.8V to 5.5V
AT24C08 1 Ordering Information
Ordering Code 2

Package

Operation Range

AT24C08-10PI-2.7

Industrial Temperature

AT24C08N-10SI-2.7

AT24C08-10TI-2.7
to 85°C

AT24C08-10PI-1.8

Industrial Temperature

AT24C08N-10SI-1.8

AT24C08-10TI-1.8
to 85°C

Notes This device is not recommended for new designs. Please refer to AT24C08A. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

Package Type
8-lead, Wide, Plastic Dual Inline Package PDIP
8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC
8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP

Options

Low-voltage 2.7V to 5.5V

Low-voltage 1.8V to 5.5V
16 AT24C01A/02/04/08/16

AT24C01A/02/04/08/16
AT24C16 1 Ordering Information
Ordering Code 2

Package

Operation Range

AT24C16-10PI-2.7

Industrial Temperature

AT24C16N-10SI-2.7

AT24C16-10TI-2.7
to 85°C

AT24C16-10PI-1.8

Industrial Temperature

AT24C16N-10SI-1.8

AT24C16-10TI-1.8
to 85°C

Notes This device is not recommended for new designs. Please refer to AT24C16A. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

Package Type
8-lead, Wide, Plastic Dual Inline Package PDIP
8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC
8-lead, mm Body, Plastic Thin Shrink Small Outline Package TSSOP

Options

Low-voltage 2.7V to 5.5V

Low-voltage 1.8V to 5.5V

Packaging Information
8P3 PDIP

Top View

End View
4 PLCS

Side View

COMMON DIMENSIONS Unit of Measure = inches

SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L

MIN NOM MAX

NOTE 2

This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA, for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm .
01/09/02
2325 Orchard Parkway R San Jose, CA 95131

TITLE 8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP
18 AT24C01A/02/04/08/16
8S1 JEDEC SOIC

AT24C01A/02/04/08/16

Top View

Side View

End View

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Datasheet ID: AT24C01AY1-10YI-1.8 518872