8610-60G

8610-60G Datasheet

Non-Silicone Heat Transfer Compound 8610

Part	Datasheet
8610-60G	8610-60G (pdf)

PDF Datasheet Preview
Heat Transfer Compounds Non-Silicone Heat Transfer Compound 8610 z Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application z High efficient thermal conductive properties Means more rapid transfer of heat for longer component life z High temperature stability Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound. z Uses synthetic fluids and metal oxide fillers Provides excellent conductive properties that exceed those of other heat sink formulas z Will not dry, harden, melt or migrate in any heat sink application z Compatible with metal and plastic components z Also available in a silicone version Benefits of Non Silicone Heat Transfer Compound OVER Silicone No migration and component contamination. z Typically, Heat Transfer Compounds heat sink compounds are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry z Other used Semiconductor Mounting Devices Thermal joints Ballast heat transfer mediums Power resistor mountings Thermocouple wells Transistor diodes & silicone rectifier base and mounting studs ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required Specifications Physical Properties Appearance Consistency Specific Gravity 25°C 77°F Bleed % 24 hours 200°C Evaporation 24 hours 200°C Dropping Point Min. operating temp. Max. operating temp. Test Method Visual ASTM D 217 FTM-321 FTM-321 ASTM D-566 Non Silicone 8610 Off white / smooth paste 310-320 Silicone 860 White paste > 500°F 260°C > 500°F 260°C -40°F/-40°F 55°F/48°C 200°C 200°C consistent 300°C intermittent 4/28/2010 Heat Transfer Compounds Electrical Properties Thermal Conductivity Dielectric Strength 0.05l gap Dielectric Constant 1000 Hz Dissipation Factor 1000 Hz Resistivity 21°C Test Method Non Silicone 8610 Hot Wire Method W/m•K Heat Flow #36 °C ASTM D-149 350 V/MIL ASTM D- 150 ASTM D 150 ASTM D 150 x 1013 Ohm•cm

PDF Datasheet Preview

Heat Transfer Compounds

Non-Silicone Heat Transfer Compound 8610
z Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
z High efficient thermal conductive properties Means more rapid transfer of heat for longer component life
z High temperature stability Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
z Uses synthetic fluids and metal oxide fillers Provides excellent conductive properties that exceed those of other heat sink formulas
z Will not dry, harden, melt or migrate in any heat sink application z Compatible with metal and plastic components z Also available in a silicone version

Benefits of Non Silicone Heat Transfer Compound OVER Silicone

No migration and component contamination.
z Typically, Heat Transfer Compounds heat sink compounds are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry
z Other used Semiconductor Mounting Devices Thermal joints Ballast heat transfer mediums Power resistor mountings Thermocouple wells Transistor diodes & silicone rectifier base and mounting studs ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required

Specifications

Physical Properties

Appearance

Consistency Specific Gravity 25°C 77°F Bleed % 24 hours 200°C Evaporation 24 hours 200°C Dropping Point Min. operating temp.

Max. operating temp.

Test Method Visual ASTM D 217

FTM-321 FTM-321 ASTM D-566

Non Silicone 8610

Off white / smooth paste
310-320

Silicone 860 White paste
> 500°F 260°C > 500°F 260°C
-40°F/-40°F
55°F/48°C
200°C
200°C consistent 300°C intermittent
4/28/2010

Heat Transfer Compounds

Electrical Properties

Thermal Conductivity

Dielectric Strength 0.05l gap Dielectric Constant 1000 Hz Dissipation Factor 1000 Hz Resistivity 21°C

Test Method

Non Silicone 8610

Hot Wire Method W/m•K Heat Flow #36 °C

ASTM D-149
350 V/MIL

ASTM D- 150

ASTM D 150

ASTM D 150
x 1013 Ohm•cm

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Datasheet ID: 8610-60G 647851