4901-2LB

4901-2LB Datasheet

Lead Free Solder Sn99 4901

Part	Datasheet
4901-2LB	4901-2LB (pdf)

Related Parts	Information
4901-112G	4901-112G
4901-454G	4901-454G
4901-227G	4901-227G

PDF Datasheet Preview
Lead Free Solder Lead Free Solder Sn99 4901 tin and copper M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu Tin/Copper alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. If your products might enter Europe, you must ensure they are RoHS compliant now. If your products are sold in California, you must ensure they are compliant by January 1, Products containing lead solder will not comply. To read more on this issue visit our RoHS Issue AppGuide Features / Benefits z Lead free z Complies with RoHS z Exceeds the impurity requirements of J-Std-006 z No Clean flux z 21 Gauge, diameters z Excellent wettability z Hard non-conductive residues Flux Percentage M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is Flux Core A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, please visit the following link for a list of Flux Removers: Specifications Cu content Test Method Specification % Page 1 of 2 4/28/2010 Lead Free Solder Sn content Flux Classification Copper Mirror Silver Chromate Corrosion SIR JSTD-004,Pattern Down SIR Bellcore Telecordia Electromigration Post Reflow Flux Residue Acid Value Flux Residue Dryness Spitting of Flux-Cored Solder Spread JSTD-004 IPC-TM-650 IPC-TM-650 IPC-TM-650 IPC-TM-650 Bellcore GR-78-CORE Bellcore GR-78-CORE TGA Analysis IPC-TM-650 IPC-TM-650 IPC-TM-650 IPC-TM-650 Balance REL0 No removal of copper film Pass x 10 11 ohms x 10 11 ohms Pass 55% 190-210 Pass 130 mm2 Lead free/leaded solder comparison Melting Point Wire Diameter Std. Wire Gauge Tolerance, in. Hardness, Brinell Coefficient of Thermal Expansion Tensile Strength Density Electrical Resistivity Electrical Conductivity Yield Strength, psi Total Elongation,% Joint Shear Strength, at 0.1mm/min 20ºC Creep Strength, N/mm2 at 0.1mm/min 20ºC Creep Strength, N/mm2 at 0.1mm/min 100 C Lead Free Solder Sn/Cu 227º C 441º F mm 21 +/- 9HB Pure Sn=23.5 3190 psi g/cc 10 - 15 µohm-cm 13 %IACS 2180 39 23 Sn63/Pb37 Leaded Solder 183 º C º F mm 21 +/- 14HB 4442 psi g/cc µohm-cm %IACS 3950 48 14 Available Sizes Catalog Number 4901-112G 4901-227G 4901-454G 4901-2LB Sizes Available 1/4 lb 113 g 1/2 lb 227 g 1 lb 454 g 2 lb 907 g Description Spool Bar 2000 - 2010 MG Chemicals. All rights reserved. Site Map Terms & Conditions Contact Us 4/28/2010

PDF Datasheet Preview

Lead Free Solder

Lead Free Solder Sn99 4901
tin and copper

M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu Tin/Copper alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.

If your products might enter Europe, you must ensure they are RoHS compliant now. If your products are sold in California, you must ensure they are compliant by January 1, Products containing lead solder will not comply. To read more on this issue visit our RoHS Issue AppGuide

Features / Benefits
z Lead free z Complies with RoHS z Exceeds the impurity requirements of J-Std-006 z No Clean flux z 21 Gauge, diameters z Excellent wettability z Hard non-conductive residues

Flux Percentage

M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is

Flux Core

A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, please visit the following link for a list of Flux Removers:

Specifications

Cu content

Test Method

Specification %

Page 1 of 2 4/28/2010

Lead Free Solder

Sn content Flux Classification Copper Mirror Silver Chromate Corrosion SIR JSTD-004,Pattern Down SIR Bellcore Telecordia Electromigration Post Reflow Flux Residue Acid Value Flux Residue Dryness Spitting of Flux-Cored Solder Spread

JSTD-004 IPC-TM-650 IPC-TM-650 IPC-TM-650 IPC-TM-650 Bellcore GR-78-CORE Bellcore GR-78-CORE TGA Analysis IPC-TM-650 IPC-TM-650 IPC-TM-650 IPC-TM-650

Balance REL0 No removal of copper film Pass x 10 11 ohms x 10 11 ohms Pass 55% 190-210 Pass 130 mm2

Lead free/leaded solder comparison Melting Point Wire Diameter

Std. Wire Gauge Tolerance, in. Hardness, Brinell Coefficient of Thermal Expansion Tensile Strength Density Electrical Resistivity Electrical Conductivity Yield Strength, psi Total Elongation,% Joint Shear Strength, at 0.1mm/min 20ºC Creep Strength, N/mm2 at 0.1mm/min 20ºC Creep Strength, N/mm2 at 0.1mm/min 100 C

Lead Free Solder Sn/Cu
227º C 441º F mm 21 +/- 9HB Pure Sn=23.5 3190 psi g/cc 10 - 15 µohm-cm 13 %IACS 2180 39 23

Sn63/Pb37 Leaded Solder
183 º C º F mm 21 +/- 14HB 4442 psi g/cc µohm-cm %IACS 3950 48 14

Available Sizes

Catalog Number 4901-112G 4901-227G 4901-454G 4901-2LB

Sizes Available 1/4 lb 113 g 1/2 lb 227 g 1 lb 454 g 2 lb 907 g

Description Spool Bar
2000 - 2010 MG Chemicals. All rights reserved. Site Map Terms & Conditions Contact Us
4/28/2010

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 4901-2LB Datasheet file may be downloaded here without warranties.

Datasheet ID: 4901-2LB 647844