MAX16833/MAX16833B/C/D/G
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MAX16833CAUE/V+TC0 (pdf) |
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MAX16833/MAX16833B/C/D/G EVALUATION KIT AVAILABLE High-Voltage HB LED Drivers with Integrated High-Side Current Sense The MAX16833, MAX16833B, MAX16833C, MAX16833D, and MAX16833G are peak current-mode-controlled LED drivers for boost, buck-boost, SEPIC, flyback, and highside buck topologies. A dimming driver designed to drive an external p-channel in series with the LED string provides wide-range dimming control. This feature provides extremely fast PWM current switching to the LEDs with no transient overvoltage or undervoltage conditions. In addition to PWM dimming, the ICs provide analog dimming using a DC input at ICTRL. The ICs sense the LED current at the high side of the LED string. A single resistor from RT/SYNC to ground sets the switching frequency from 100kHz to 1MHz, while an external clock signal capacitively coupled to RT/SYNC allows the ICs to synchronize to an external clock. In the MAX16833/C/G, the switching frequency can be dithered for spread-spectrum applications. The MAX16833B/D instead provide a 1.64V reference voltage with a 2% tolerance. The ICs operate over a wide 5V to 65V supply range and include a 3A sink/source gate driver for driving a power MOSFET in high-power LED driver applications. Additional features include a fault-indicator output FLT for short or overtemperature conditions and an overvoltage-protection sense input OVP for overvoltage protection. High-side current sensing combined with a p-channel dimming MOSFET allow the positive terminal of the LED string to be shorted to the positive input terminal or to the negative input terminal without any damage. This is a unique feature of the ICs. ●● Automotive Exterior Lighting High-Beam/Low-Beam/Signal/Position Lights Daytime Running Lights DRLs Fog Light and Adaptive Front Light Assemblies ●● Commercial, Industrial, and Architectural Lighting Ordering Information appears at end of data sheet. Benefits and Features ●● Integration Minimizes BOM for High-Brightness LED Driver with a Wide Input Range Saving Space and Cost • +5V to +65V Wide Input Voltage Range with a Maximum 65V Boost Output • Integrated High-Side pMOS Dimming MOSFET Driver Allows Single-Wire Connection to LEDs • ICTRL Pin for Analog Dimming • Integrated High-Side Current-Sense Amplifier • Full-Scale, High-Side, Current-Sense Voltage of 200mV ●● Simple to Optimize for Efficiency, Board Space, and Input Operating Range • Boost, SEPIC, and Buck-Boost Single-Channel LED Drivers • 2% Accurate 1.64V Reference MAX16833B/D • Programmable Operating Frequency 100kHz to 1MHz with Synchronization Capability • Frequency Dithering for Spread-Spectrum Applications MAX16833/C/G • Thermally Enhanced 5mm x 4.4mm, 16-Pin TSSOP Package with Exposed Pad ●● Protection Features and Wide Temperature Range Increase System Reliability • Short-Circuit, Overvoltage, and Thermal Protection • Fault-Indicator Output • -40°C to +125°C Operating Temperature Range Simplified Operating Circuit 6V TO 18V WITH LOAD DUMP UP TO 70V PWMDIM NDRV MAX16833 CS OVP PWMDIM ISENSE+ ISENSE- DIMOUT LED+ PGND LED- MAX16833/MAX16833B/C/D/G High-Voltage HB LED Drivers with Integrated High-Side Current Sense Absolute Maximum Ratings IN to -0.3V to +70V ISENSE+, ISENSE-, DIMOUT to PGND............... -0.3V to +80V DIMOUT to +0.3V ISENSE- to +0.3V PGND to +0.3V VCC to +9V NDRV to -0.3V to VCC + 0.3V OVP, PWMDIM, COMP, LFRAMP, REF, ICTRL, RT/SYNC, FLT to +6.0V CS to +6.0V Continuous Current on Peak Current on Q3A Continuous Current on Q100mA Short-Circuit Duration on Continuous Power Dissipation TA = +70NC 16-Pin TSSOP derate 26.1mW/NC above +70NC ......2089mW Operating Temperature Range -40NC to +125NC Junction Storage Temperature Range............................. -65NC to +150NC Lead Temperature soldering, 10s .................................. +300NC Soldering Temperature Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics Note 1 16 TSSOP Junction-to-Ambient Thermal Resistance qJA ........38.3°C/W Junction-to-Case Thermal Resistance qJC ..................3°C/W Note 1 Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to Electrical Characteristics VIN = 12V, RRT = 12.4kI, CIN = CVCC = 1µF, CLFRAMP/CREF = 0.1µF, NDRV = COMP = DIMOUT = PWMDIM = FLT = unconnected, VOVP = VCS = VPGND = VSGND = 0V, VISENSE+ = VISENSE- = 45V, VICTRL = 1.40V, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC. Note 2 PARAMETER SYSTEM SPECIFICATIONS Operational Supply Voltage Supply Current Undervoltage Lockout UVLO UVLO Hysteresis Startup Delay UVLO Falling Delay VCC LDO REGULATOR Output Voltage Dropout Voltage Short-Circuit Current OSCILLATOR RT/SYNC Switching Frequency Range Bias Voltage at RT/SYNC Maximum Duty Cycle CONDITIONS IINQ Ordering Information PART MAX16833AUE+ MAX16833AUE/V+ MAX16833BAUE+ MAX16833BAUE/V+ MAX16833CAUE+ MAX16833CAUE/V+ MAX16833DAUE+ MAX16833DAUE/V+ MAX16833GAUE/V+ TEMP RANGE -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C PIN-PACKAGE 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* 16 TSSOP-EP* +Denotes a lead Pb -free/RoHS-compliant package. /V denotes an automotive qualified part. *EP = Exposed pad. FUNCTIONALITY Frequency Dithering Frequency Dithering Reference Voltage Output Reference Voltage Output Frequency Dithering Frequency Dithering Reference Voltage Output Reference Voltage Output Frequency Dithering MAX DUTY CYCLE % 94 Chip Information PROCESS BiCMOS-DMOS Package Information For the latest package outline information and land patterns footprints , go to Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 16 TSSOP-EP PACKAGE CODE U16E+3 OUTLINE NO. 21-0108 LAND PATTERN NO. 90-0120 Maxim Integrated 23 MAX16833/MAX16833B/C/D/G High-Voltage HB LED Drivers with Integrated High-Side Current Sense 0 1 2 3 4 5 8/13 2/15 11/15 6/16 6/16 6/16 Initial release Added MAX16833AUE Added MAX16833C and MAX16833D Added MAX16833E Removed MAX16833E Updated startup delay time and its description Updated Functional Diagrams and the MAX16833B/MAX16833D Typical Operating Circuit Updated the Benefits and Features section Added MAX16833G Updated MAX16833G Functional Diagram Added MAX16833G to Frequency Dithering LFRAMP/MAX16833/ MAX16833C/MAX16833G section Added new MAX16833G Typical Operating Circuit diagram Changed fSYNCIN max in Electrical Characteristics from 1.7fsw to 1.5fsw PAGES CHANGED 1, 21, 22 22 20, 21 2, 11 9, 10, 20 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values min and max limits shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. 2017 Maxim Integrated Products, Inc. 24 |
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